Abstract: Systems and methods are provided for trapping and electrically monitoring molecules in a nanopore sensor. The nanopore sensor comprises a support structure with a first and a second fluidic chamber, at least one nanopore fluidically connected to the two chambers, and a protein shuttle. The protein shuttle comprises an electrically charged protein molecule, such as Avidin. The nanopore can be a Clytosolin A. A method can comprise applying a voltage across the nanopores to draw protein shuttles towards the nanopores. The ionic current through each or all of the nanopores can be concurrently measured. Based on the measured ionic current, blockage events can be detected. Each blockage event indicates a capture of a protein shuttle by at least one nanopore. Each blockage event can be detected through a change of the total ionic current flow or a change in the ionic current flow for a particular nanopore.

Abstract: A glue dispensing system and the glue supplying method thereof are disclosed. The glue dispensing system uses at least one feed tank to provide or supply the glue to a glue dispensing needle cylinder. Thus, the glue dispensing needle cylinder does not need to be replaced or the frequency of replacing the glue dispensing needle cylinder can be decreased in order to save more time, reduce manpower waste and decrease the cost.

Abstract: A graphical ultrasonic module and driver assistance system are provided. The graphical ultrasonic module includes an ultrasonic sensor array and an ultrasonic transmitter array. The ultrasonic sensor array includes three or more ultrasonic sensors, and the ultrasonic sensors form a virtual plane. The ultrasonic transmitter array includes a plurality of ultrasonic transmitters. The geometric center of the ultrasonic transmitter array is substantially the same as the geometric center of the ultrasonic sensor array.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a conductive structure arranged within a substrate or a first dielectric layer. A first barrier layer is arranged on outermost sidewalls and a bottom surface of the conductive structure. A second barrier layer is arranged on outer surfaces of the first barrier layer. The second barrier layer separates the first barrier layer from the substrate or the first dielectric layer. A second dielectric layer is arranged over the substrate or the first dielectric layer. A via structure extends through the second dielectric layer, is arranged directly over topmost surfaces of the first and second barrier layers, and is electrically coupled to the conductive structure through the first and second barrier layers.

Abstract: An automatic generation system of a training image and a method thereof are provided. The disclosure generates a training image and records the target category and the target position. The disclosure adds the target image to the container image as a candidate image, calculates a reliability of the candidate image, and repeatedly executes the process until the reliability of the candidate image meets a threshold condition for generating the training image. The disclosure is able to generate the training images automatically, and the recognition difficulty of the training image is adjustable by the user, so as to be suitable for customized recognition training.

Abstract: A mass transferring system and the method thereof are provided. The system includes two platforms and a plurality of picking and placing units. When the mass transferring process is performed for one of the substrates, the replacing process and the aligning process are simultaneously executed for another one of the substrates, such that the mass transferring process and the replacing process can be performed at the same time. Compared with the conventional mass transferring processes, the efficiency of the mass transferring system and the method thereof according to the present invention can be increased by 90%.

Abstract: A wet etching chemistry to selectively remove a polymer residue on an opening embedded in a low-k dielectric layer and an underlying stop layer in a process of forming an interconnect structure is provided. The wet etching chemistry includes: two type of organic solvents, wherein a concentration of the two type of organic solvents is greater than or equal to 70%; an Alkali source amine, at least comprising a tertiary amine; an inhibitor; and water. In some embodiment, the wet etching chemistry is free of a peroxide to avoid damage to the WdC hard mask.

Abstract: An integrated circuit (IC) including a first ring oscillator (RO) including a first set of cascaded stages, wherein each of the first set of cascaded stages comprises a first logic inverter, including: a first set of field effect transistors (FETs) coupled in parallel between a first voltage rail and a first intermediate node, wherein the first set of FETs include a set of gates coupled to an input of the first logic inverter; and a second set of FETs coupled in series between the first intermediate node and a second voltage rail, wherein the second set of FETs includes at least a first FET including a gate coupled to the input of the first logic inverter, and at least a second FET that is diode-connected in accordance with a first mode of operation.

Abstract: A rotation locking system of a motor of a fan is provided. A closed-loop control circuit outputs an initial duty cycle signal according to a current rotational speed and a target rotational speed. A driver circuit outputs a driving signal to the motor to drive the motor to rotate according to the initial duty cycle signal. A lookup table arithmetic circuit looks up, from a lookup table, two reference duty cycles correspond to two reference rotational speeds that are respectively equal to the current rotational speed and the target rotational speed. The lookup table arithmetic circuit calculates a difference between the two reference duty cycles. A speed feedback control circuit compensates the initial duty cycle signal according to the difference to output a final duty cycle signal to the driver circuit. The driver circuit drives the motor to rotate according to the final duty cycle signal.

Abstract: A package structure of an embedded power module includes a top insulation layer, a top metal pattern layer, a solder layer, a device layer, a bottom metal pattern layer and a bottom insulation layer sequentially arranged from top to bottom. The device layer includes at least two MOSFET bare dies and several metal connection blocks, and is filled with insulation filler to isolate the MOSFET bare dies and the metal connection blocks from each other. The drain electrodes of the bare dies are connected with the top metal pattern layer through the solder layer, and the source electrodes and the gate electrodes of the bare dies are electrically connected to the bottom metal pattern layer, respectively. The upper and lower surfaces of the metal connection blocks are electrically connected to the top metal pattern layer and the bottom metal pattern layer, respectively.

Abstract: A series circuit and a computing device include a power supply terminal for providing voltage for a plurality of chips disposed on the computing device; a ground terminal disposed at one end of each of the plurality of chips relative to the power supply terminal; and a first connection line for separately connecting a first predetermined number of chips of the plurality of chips in series, wherein a communication line is connected between adjacent chips of the first predetermined number of chips, a portion of the communication line is connected to a target connection point, which is disposed on the first connection line and adapted to the adjacent chips, via a third connection line, and the voltage at the target connection point is greater than or equal to the minimum voltage required for communication between the adjacent chips.

Abstract: A light emitting module is provided. The light emitting module includes a substrate, light emitting elements, an encapsulant material and dimming structures. The light emitting elements are disposed over the substrate. The encapsulant material covers the light emitting elements and the substrate, and the encapsulant material has an encapsulant height H. The dimming structures are disposed over the encapsulant material or embedded in the encapsulant material. The dimming structures have a maximum dimming thickness h. The encapsulant thickness H and the maximum dimming thickness h satisfy the following relationship: 0.01?h/H?1.

Abstract: An energy storage MMC topology is proposed to avoid the microcirculation of battery. The topology consists of six bridge arms in three stages and can be connected to DC system and AC system. Each bridge arm is composed of one bridge arm inductance and N energy storage sub-modules with the same structure in series. The energy storage sub-modules include a half-bridge power module, a battery energy storage module and a group of anti-parallel thyristors. The group of anti-parallel thyristors is connected in series over the DC cable between the battery energy storage module and a capacitor of the half-bridge power module. The switching control is performed on the battery in the energy storage MMC according to the systematic operating mode.

Abstract: A chip-on-wafer-on-substrate (CoWoS) semiconductor assembly is formed which includes a chip-on-wafer (CoW) sub-assembly of integrated circuit (IC) dies mounted on an interposer, which is in turn mounted on a package substrate with a top metallization stack and a bottom metallization stack using bonding bumps connecting the backside of the interposer and the front side of the package substrate. The bonding bumps provide electrical connections between the ends of through-vias exposed at the backside of the interposer and the top metallization stack of the package substrate. The likelihood of certain failure mechanisms that can adversely affect CoWoS yield are reduced or eliminated by ensuring a total metal thickness of the top metallization stack is greater than a total metal thickness of the bottom metallization stack, but not so much greater as to induce cracking of the underfill material during curing thereof.

Abstract: A reciprocating glue dispenser dispensing switch includes a switching device main body, a needle holding base, a sliding wear-resistant plate, and a driving device. The switching device main body is equipped with a double liquid inlet, the needle holding base is equipped with a mixed glue outlet, the sliding wear-resistant plate is installed between the switching device main body and the needle holding base, and the sliding wear-resistant plate is equipped with a sliding wear-resistant plate opening. The driving device is utilized to move the sliding wear-resistant plate. A mixed double-liquid glue passes through the double liquid inlet, the sliding wear-resistant plate opening and the glue outlet to dispense a mixed double-liquid glue while the double liquid inlet, the sliding wear-resistant plate opening and the glue outlet are overlapped. In addition, a double liquid dispensing equipment is also disclosed herein.

Abstract: An etchant is utilized to remove a semiconductor material. In some embodiments an oxidizer is added to the etchant in order to react with surrounding semiconductor material and form a protective layer. The protective layer is utilized to help prevent damage that could occur from the other components within the etchant.

Abstract: Related to is a bidirectional capacitance - inductance - inductance - capacitance (CLLC) circuit with a coupled inductor, which is associated with a circuit topology and operation control of a bidirectional CLLC resonant converter. A bidirectional CLLC resonant circuit with a coupled inductor includes a primary side bridge, a secondary side bridge, a primary side resonant capacitor, a secondary side resonant capacitor, a coupled resonant inductor, and a transformer. Compared with a structure of a conventional bidirectional CLLC resonant circuit, two separate resonant inductors located at a primary side and a secondary side in an original resonant cavity are replaced with one coupled resonant inductor in the circuit; the coupled resonant inductor has opposite dotted terminals with the transformer, and a primary side and a secondary side of the coupled resonant inductor are respectively in serial connection with a primary side and a secondary side of the transformer.

Abstract: An integrated comprehensive adjustment method for a pulverized coal boiler based on high-temperature corrosion prevention and control of water wall is provided. The method includes: during shutdown period of the boiler, mounting reducing atmosphere sampling pipe on a water-cooled wall region; carrying out a diagnostic test on the boiler; carrying out an optimization and adjustment test of a boiler pulverizing system; carrying out a single-factor adjustment test of boiler-related parameters; determining degrees of influence of different parameters on water wall reducing atmosphere, thermal efficiency of the boiler and NOx concentration at a denitration inlet; carrying out an optimization test of ammonia spraying of a denitration system; carrying out a maximum safe denitration efficiency test; and finding a balance point among the water wall reducing atmosphere, the thermal efficiency of the boiler and the NOx concentration at the denitration inlet.

Abstract: A steel ladle drainage method, is achieved by using a steel ladle structure. Vacuum interlayers are provided within an upper nozzle, an upper fixed plate, alower fixed plate and a sliding plate of the steel ladle structure respectively. In the steel ladle drainage method provided by the present invention, a metal drainage agent is used to replace the drainage sand in the prior art, the metal drainage agent is melted by the liquid steel and deposited in the upper nozzle, the sliding plate with the vacuum interlayer and the upper nozzle with the vacuum interlayer have the insulation effect on the melted metal drainage agent, agent falling. Moreover, through moving the sliding plate, the two pouring holes of the upper and lower fixed plates are connectedwith each other, the metal drainage agent enters the tundish through the pouring holes and the lower nozzle under the action of gravity.

Abstract: The present disclosure provides methods, compositions, kits and systems for nucleic acid amplification. In some embodiments, nucleic acid amplification methods include subjecting the nucleic acid to be amplified to partially denaturing conditions. In some embodiments, nucleic acid amplification methods include amplifying without fully denaturing the nucleic acid that is amplified. In some embodiments, the nucleic acid amplification method employs an enzyme that catalyzes homologous recombination and a polymerase. In some embodiments, methods for nucleic acid amplification can be conducted in a single reaction vessel and/or in a single continuous liquid phase of a reaction mixture, without need for compartmentalization of the reaction mixture or immobilization of reaction components.