Abstract: Techniques for multiple-phase, high-boost converters are provided. In an example, a multiple-phase switched-capacitor-inductor (MPSCI) boost converter can include a first phase circuit, a second phase circuit, and a capacitor. Each of the first phase circuit and the second phase circuit can include a first switch, an inductor having a first node coupled to a first supply rail, and a second switch configured to selectively couple a second node of the inductor to a second supply rail. The capacitor can be coupled between the second node of the inductor of the second phase circuit and the first switch of the second phase circuit.

Abstract: Embodiments described herein relate generally to methods for forming a conductive feature in a dielectric layer in semiconductor processing and structures formed thereby. In some embodiments, a structure includes a dielectric layer over a substrate, a surface modification layer, and a conductive feature. The dielectric layer has a sidewall. The surface modification layer is along the sidewall, and the surface modification layer includes phosphorous and carbon. The conductive feature is along the surface modification layer.

Abstract: The direct patterning method includes: providing a substrate having a display area and a peripheral area, which a peripheral circuit having a bonding pad is disposed on the peripheral area; sequentially disposing a metal nanowire layer, a pre-cured film layer and a negative-type photosensitive layer thereon; performing a photolithography step; and curing the pre-cured film layer. The photolithography step includes exposing the negative-type photosensitive layer to define a removal region and a reserved region; and removing the negative-type photosensitive layer, the pre-cured film layer and the metal nanowire layer in the removal region by using a developer, such that a touch sensing electrode is fabricated in the display area and the bonding pad is exposed.

Abstract: Aspects of the disclosure provide an apparatus that includes a receiving circuit and a processing circuit. The receiving circuit is configured to receive signals transmitted from a second apparatus to the apparatus and generate digital samples in response to the received signals. The signals have a plurality of resource elements. The processing circuit is configured to receive the digital samples, process the digital samples to generate symbols carried by the resource elements, detect control channel assistance information at a predetermined position of the resource elements and detect control information based on the detection of the control channel assistance information.

Abstract: The Kappa converter circuit, as introduced herein, can be configured for step-down (buck), step-up (boost), or buck-boost operation. The Kappa converter circuit exhibits lower electromagnetic interference (EMI) relative to other buck, boost, or buck-boost topologies, such as without additional input or output filter circuits. The Kappa converter circuit can have high power handling capability and less DCR loss, for example due to a distribution of current signals through respective inductors. The Kappa converter circuit includes isolating inductors at its input and ground reference nodes to help reduce signal bounce or signal pulsations at supply and ground reference busses, thereby further reducing EMI noise due to switching in the circuit. When the Kappa converter is configured for step-up operation, the converter exhibits no right-half-plane (RHP) zero.

Abstract: Provided is an active power filter-based modular multilevel converter, relating to the field of power electronics. According to the converter, an active power filter circuit is provided between upper and lower arms of each phase in a modular multilevel converter. The active power filter circuit includes two switch power devices, two submodules, a capacitor, and an inductor. The upper and lower bridge-arms are connected in series by means of two submodules, the two switch power devices are connected in series and then connected in parallel to ends of intermediate submodules which are connected in series, and the capacitor and the inductor are connected in series and then connected in parallel to two ends of the switch power device connected to the lower bridge-arm. The defect of large capacitance of submodule in conventional modular multilevel topology is overcome.

Abstract: Aspects of the disclosure provide an apparatus that includes a transceiver circuit and a processing circuit. The transceiver circuit is configured to transmit/receive signals in a shared channel by the apparatus and other apparatuses. A portion of transmission resources in the shared channel is allocated to the apparatus to carry control information in a control information format that is adjustable in time domain and frequency domain. The processing circuit is configured to determine the control information format, encode/decode the control information based on the control information format and encode/decode data according to the control information.

Abstract: A semiconductor device is provided. The semiconductor device comprises a substrate, a gate, a first doped region and a second doped region. The gate is over the substrate. The first doped region and the second doped region are in the substrate. The first doped region and the second doped region are of a same conductivity type and separated by the gate. The length of the first doped region is greater than a length of the second doped region in a direction substantially perpendicular to a channel length defined between the first doped region and the second doped region.

Abstract: A solder paste printing quality inspection (SPI) method includes establishing at least one data inspection model, acquiring real-time test data, preprocessing the real-time test data, and determining a type of the real-time test data and inputting the real-time test data into the data inspection model corresponding to the type of the real-time test data to obtain a judgment result of the solder paste printing quality inspection. The real-time test data includes one or both of a test image and a test value of solder paste printing quality inspection. The preprocessing includes obtaining key parameters of the test value or obtaining image data of the test image and standardizing the real-time test data.

Abstract: A resilient body and a keyboard structure are disclosed. The resilient body has a top portion, a bottom portion, a conducting post and an annular wall. The top portion has a first side wall and a first bottom surface. Before the resilient body is pressed, an angle is formed between the first side wall and the first bottom surface, wherein the angle is greater than 90°. The bottom portion has a second bottom surface. The conducting post is disposed under the first bottom surface. When the resilient body is pressed, the fire point of the resilient body is reached before the resilient body reaches the bottom point.

Abstract: In a network protection method, a network node, and a communications system provided in embodiments of the present disclosure, when signal degrade or signal fail occurs in a service transmission path, a communication status of a source node of a current protection segment is obtained, and whether to perform protection switching is determined according to the communication status of the source node and a communication status of a local communication path. This can avoid erroneous switching to some extent, thereby improving protection switching accuracy of a communications network.

Abstract: Provided are a touch structure, a touch display panel and a driving method. The touch structure includes a plurality of touch driving electrodes, a plurality of touch sensing electrodes and a plurality of additional touch driving electrodes, where the plurality of touch driving electrodes, the plurality of touch sensing electrodes and the plurality of additional touch driving electrodes are insulated from each other. The plurality of touch driving electrodes and the plurality of additional touch driving electrodes extend along a first direction and are arranged along a second direction, and the plurality of touch sensing electrodes extend along the second direction and are arranged along the first direction, where the first direction is intersected with the second direction. Each of the plurality of additional touch driving electrodes corresponds to a respective one of the plurality of touch driving electrodes.

Abstract: A lock apparatus includes a bracket, an engagement module, and an actuation module. The engagement module is supported in the bracket and has an engagement member configured to move to a first position or a second position in a first axial direction along the first axial direction. The actuation module is connected to the bracket and includes a pushing member. The actuation module drives the pushing member to move to a first position or a second position in the second axial direction along the second axial direction. When the pushing member is at the first position in the second axial direction, the engagement member is at the first position in the first axial direction. When the pushing member is at the second position in the second axial direction, the engagement member is at the second position in the first axial direction.

Abstract: A method includes forming a tri-layer. The tri-layer includes a bottom layer; a middle layer over the bottom layer; and a top layer over the middle layer. The top layer includes a photo resist. The method further includes removing the top layer; and removing the middle layer using a chemical solution. The chemical solution is free from potassium hydroxide (KOH), and includes at least one of a quaternary ammonium hydroxide and a quaternary ammonium fluoride.

Abstract: Provided is a word line structure including a substrate, a stack structure, and a metal silicide structure. The stack structure is disposed on the substrate. The metal silicide structure is disposed on the stack structure. The metal silicide structure includes a first metal element, a second metal element, and a silicon element. The first metal element is different from the second metal element, and concentrations of the first metal element and the second metal element gradually decrease along a direction from a top surface of the metal silicide structure to the substrate.

Abstract: Methods and apparatus are provided for paging enhancement for LC-MTC devices. In one novel aspect, a new paging message is used. In one embodiment, a new system information (M-SI)-paging is provided either carrying a bitmap or being generated from specific M-P1-RNTI sequences to indicate the modified SI messages. In another embodiment, a new RRC-paging is used through a UE-specific message, a multicast message, or a broadcast message to inform a UE to establish a RRC connection. The new paging message is either a sequence or an encoded data packet transmitted without control information, or scheduled by M-PDCCH. In another novel aspect, the new paging message is transmitted within one or more cells by a broadcast mechanism to achieve a maximal CE level the one or more cells support, or a multi-cast mechanism to support a specified CE level range, or a unicast mechanism to support a CE level.

Abstract: A semiconductor device is provided. The semiconductor device comprises a substrate, a gate, a first doped region and a second doped region. The gate is over the substrate. The first doped region and the second doped region are in the substrate. The first doped region and the second doped region are of a same conductivity type and separated by the gate. The length of the first doped region is greater than a length of the second doped region in a direction substantially perpendicular to a channel length defined between the first doped region and the second doped region.

Abstract: The electrospray device comprises a sprayer comprising a sprayer body and nozzle, and a partition positioned vertically and coaxially with the sprayer. The sprayer body is provided with a swirl generator for generating a swirling air stream, and a power supply connected between the nozzle and the partition, to apply voltage to the nozzle and the partition. The electrospray device may be part of a fluidized bed apparatus comprising a product container, a lower plenum base, an air distribution plate resided therebetween. When the power supply applies voltage in opposite polarities to the nozzle and the partition, the fluidized bed apparatus is used for coating particles; and when the power supply applies voltage of the same, the fluidized bed apparatus is used for spray-drying a solution. The electrospray device uses an electromagnetic hydrodynamic method to improve the performance of the fluidized bed apparatus and optimize the process of product.

Abstract: Aspects of the present disclosure provide techniques for predicting a failure of an integrated circuit, which may include receiving first aging sensor data during an idle state of the integrated circuit; determining a voltage compensation value based on the first aging sensor data; comparing a new voltage value based on the voltage compensation value to a threshold operating voltage; determining the new operating voltage value exceeds the threshold operating voltage; determining a warning state for the integrated circuit; receiving second aging sensor data during the idle state of the integrated circuit; receiving stored aging sensor data from an aging sensor data repository; comparing the second aging sensor data to the stored aging sensor data; determining that the second aging sensor data is inconsistent with the stored aging sensor data; and determining a danger state for the integrated circuit.