Patents by Inventor Min Cheng

Min Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220251813
    Abstract: A drain strainer includes a base body defining a chamber with opposite water inlet and water outlet, a straining unit disposed in the chamber, and a cover unit including a cover body connected to the straining unit. The straining unit includes a bottom straining member having a plurality of bottom straining holes, and a main straining member disposed on one side of the bottom straining member and including a main straining surrounding wall formed with a plurality of spaced-apart main straining holes. The bottom and main straining holes communicate with each other and with the chamber.
    Type: Application
    Filed: May 26, 2021
    Publication date: August 11, 2022
    Inventor: Hsi-Min CHENG
  • Patent number: 11409200
    Abstract: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Cheng Wu, Chi-Hung Liao
  • Patent number: 11409201
    Abstract: Embodiments of the present disclosure provide methods for processing a substrate using a measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective zones of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: August 9, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Min-Cheng Wu, Chi-Hung Liao
  • Publication number: 20220244656
    Abstract: Toner particles including a core and a shell thereover; wherein the core comprises at least one styrene-acrylate copolymer selected from styrene-acrylate copolymer 1, styrene-acrylate copolymer 2, and styrene-acrylate copolymer 3, and combinations thereof a wax; and an optional colorant; wherein the shell comprises at least one styrene-acrylate copolymer selected from styrene-acrylate copolymer 1, styrene acrylate copolymer 2, styrene acrylate copolymer 3, and combinations thereof.
    Type: Application
    Filed: February 4, 2021
    Publication date: August 4, 2022
    Inventors: Jordan A. Frank, Daniel W. Asarese, Chieh-Min Cheng, Paul K. Acquaviva, Richard P. N. Veregin, Michael F. Zona
  • Patent number: 11400647
    Abstract: A method for improving z-axis strength of a 3D printed object is disclosed. For example, the method includes printing a three-dimensional (3D) object with a polymer and magnetic particles, heating the 3D object to a temperature at approximately a melting temperature of the polymer, and applying a magnetic field to the 3D object to locally move the magnetic particles in the polymer to generate heat and fuse the polymer around the magnetic particles to improve a z-axis strength of the 3D object.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: August 2, 2022
    Assignee: Xerox Corporation
    Inventors: Chunliang Lu, Christopher Wolfe, John Ianni, Mark Mercandetti, John Pawlak, Chieh-Min Cheng
  • Patent number: 11401455
    Abstract: The invention is directed to polymers that self-crosslink at acidic pH or can be crosslinked by phenolic agents in brine. Such polymers have lower viscosity and can be pumped deep into reservoirs, where they will cross link in situ, thus increasing their viscosity and/or form a gel and blocking thief zones. Methods of making and using such polymers are also provided.
    Type: Grant
    Filed: September 12, 2021
    Date of Patent: August 2, 2022
    Assignees: CONOCOPHILLIPS COMPANY, UNIVERSITY OF KANSAS
    Inventors: Huili Guan, Cory Berkland, Ahmad Moradi-Araghi, Jenn-Tai Liang, Terry M. Christian, Riley B. Needham, James H. Hedges, Min Cheng, Faye L. Scully
  • Publication number: 20220239881
    Abstract: In an image processing method, an image processing device obtains an input image from an image sensor. Each pixel of the input image is either a type-I pixel or a type-II pixel. Each type-I pixel carries a luminance channel value and no color data, and each type-II pixel carries a single color channel value and no luminance data, wherein the single color channel value is a cyan channel value, a magenta channel value, or a yellow channel value. The image processing device generates a target image by performing interpolation based on the luminance channel values and the single color channel values of the pixels of the input image, wherein each pixel in the target image corresponds in location to a pixel in the input image and has three color channel values generated by the interpolation.
    Type: Application
    Filed: April 18, 2022
    Publication date: July 28, 2022
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Min Cheng, Daolong Tang, Yufeng Dai
  • Patent number: 11396624
    Abstract: The instant application relates to nanogels or compositions that hold multivalent metal ions until some level of nanogel degradation has occurred, then slowly release the multivalent metal ions for gelation with carboxylate containing polymers. Compositions comprising such nanogels, together with polymers that can be crosslinked with multivalent metal ions, allow the deployment of such mixtures in various applications, and greatly increased gelation times.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: July 26, 2022
    Assignees: CONOCOPHILIPS COMPANY, UNIVERSITY OF KANSAS
    Inventors: Huili Guan, Cory Berkland, Ahmad Moradi-Araghi, Jenn-Tai Liang, Terry M. Christian, Riley B. Needham, Min Cheng, Faye Lynn Scully, James H. Hedges
  • Patent number: 11390795
    Abstract: The invention is directed to delayed gelation agents comprising a degradable polymeric cage containing therein one or more gelation agents. The cage degrades in situ, e.g, in an oil reservoir, thus releasing the gelation agent(s), which can then crosslink second polymers in situ to form a gel.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: July 19, 2022
    Assignees: CONOCOPHILLIPS COMPANY, UNIVERSITY OF KANSAS
    Inventors: Huili Guan, Cory Berkland, Ahmad Moradi-Araghi, Jenn-Tai Liang, David R. Zornes, Riley B Needham, James H. Hedges, Min Cheng, James P. Johnson, Faye L. Scully
  • Patent number: 11384279
    Abstract: The disclosure is directed to methods and compositions delaying the gelation of polymers in water flooding by sequentially or co-injecting a carboxylate-containing polymer solution, a gel-delaying polymer, and gelation agent into a hydrocarbon reservoir. Delays of weeks are observed.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: July 12, 2022
    Assignee: CONOCOPHILLIPS COMPANY
    Inventors: Huili Guan, Cory Berkland, Ahmad Moradi-Araghi, Jenn-Tai Liang, Terry M. Christian, Riley B. Needham, Min Cheng
  • Publication number: 20220204809
    Abstract: Photocurable (meth)acrylate compositions for forming features on the surfaces of membranes, and particularly, on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 30, 2022
    Inventors: Shuhua Jin, Chih-Min Cheng
  • Publication number: 20220204660
    Abstract: Photocurable (meth)acrylate compositions for forming features on the surfaces of membranes, and particularly, on membranes used in osmosis and reverse-osmosis applications, such as membrane filters.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 30, 2022
    Inventors: Shuhua Jin, Chih-Min Cheng
  • Patent number: 11362101
    Abstract: A three-dimensional memory device includes a plurality of conductive layers and insulating layers alternately formed to define a multi-layer stacked structure on a first region of a semiconductor substrate. The multi-layer stacked structure includes a stair structure and a non-stair structure. A plurality of memory structures are located in the non-stair structure to form a memory array region, and each memory structure passes through the conductive layers and the insulating layers. A plurality of bow-height adjustment features are located in a second region of the semiconductor substrate.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: June 14, 2022
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Chien-Lan Chiu, Chun-Min Cheng
  • Publication number: 20220164276
    Abstract: A method, computer program product and system are provided for preloading debug information based on the presence of incremental source code files. Based on parsed input parameters to a source code debugger, a source code repository and a local storage area are searched for an incremental file. In response to the incremental file being located, a preload indicator in the incremental file, which is a source code file, is set. Based on the preload indicator being set, debug symbol data from the incremental file is merged to a preload symbol list. In response to receiving a command to examine the debug symbol data from the incremental file, the preload symbol list is searched for the requested debug symbol data.
    Type: Application
    Filed: November 25, 2020
    Publication date: May 26, 2022
    Inventors: Xiao Ling Chen, Xiao Xuan Fu, Jiang Yi Liu, Zhan Peng Huo, Wen Ji Huang, Qing Yu Pei, Min Cheng, Yan Huang
  • Publication number: 20220165475
    Abstract: An inductor module includes at least one first magnetic core, a second magnetic core and at least one winding assembly. Each first magnetic core includes a connection part, a first post and a second post. The first post and the second post are disposed on a top surface of the connection part. A winding groove is formed between the first post and the second post. The second magnetic core is disposed adjacent to the first magnetic core. Each winding assembly is formed by wrapping a single metal sheet for at least one turn. Each winding assembly is disposed around the first post. A portion of each winding assembly is accommodated within the winding groove of the corresponding first magnetic core. An overall thickness of the winding assembly within the winding groove is smaller than or equal to a width W of the winding groove and greater than 0.9×W.
    Type: Application
    Filed: August 4, 2021
    Publication date: May 26, 2022
    Inventors: Hsin-Wei Tsai, Te-Chih Peng, Min-Cheng Chiang
  • Publication number: 20220148979
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.
    Type: Application
    Filed: March 16, 2021
    Publication date: May 12, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Ching, Shu-Shen Yeh, Chien-Hung Chen, Hui-Chang Yu, Yu-Min Cheng
  • Patent number: 11327527
    Abstract: A motor assembly is provided. The motor assembly includes a motor, a driving force transmission module, and a driving force output component. The motor includes a rotating shaft, the rotating shaft is configured to rotate along a first axis. The driving force transmission module includes a first transmission portion and a second transmission portion connected with each other. The first transmission portion is connected with the rotating shaft of the motor, and the second transmission portion is bent relative to the first transmission portion and extends to one side of the motor. The driving force output component is connected with an end of the second transmission portion away from the first transmission portion, and configured to rotate along a second axis, which is parallel to the first axis.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: May 10, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chui-Hung Chen, Cheng-Han Chung, Ching-Yuan Yang, Chia-Min Cheng
  • Publication number: 20220130839
    Abstract: A method for fabricating buried word line of a dynamic random access memory (DRAM) includes the steps of: forming a trench in a substrate; forming a first conductive layer in the trench; forming a second conductive layer on the first conductive layer, in which the second conductive layer above the substrate and the second conductive layer below the substrate comprise different thickness; and forming a third conductive layer on the second conductive layer to fill the trench.
    Type: Application
    Filed: January 6, 2022
    Publication date: April 28, 2022
    Applicants: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Pin-Hong Chen, Yi-Wei Chen, Tzu-Chieh Chen, Chih-Chieh Tsai, Chia-Chen Wu, Kai-Jiun Chang, Yi-An Huang, Tsun-Min Cheng
  • Patent number: 11302566
    Abstract: A method for fabricating a wafer includes providing a wafer table, wherein the wafer table includes support pins that are movable with respect to each other; identifying features of a layer to be formed on a wafer, wherein the features have a tolerance for overlay errors below a threshold; moving one or more support pins based on the features; after the moving of the one or more support pins, mounting the wafer on the wafer table; and after the mounting of the wafer on the wafer table, forming the layer on the wafer.
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: April 12, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung Liao, Min-Cheng Wu
  • Publication number: 20220091530
    Abstract: According to various embodiments, there is provided a toner composition and a developer. The toner composition includes toner particles including a resin, a colorant; and a surface additive applied to a surface of the toner particles. The surface additive includes polyaniline doped strontium titanate (SrTiO3).
    Type: Application
    Filed: September 24, 2020
    Publication date: March 24, 2022
    Inventors: Elizabeth K. Priebe, Christopher Michael Wolfe, Chieh-Min Cheng, Jordan A. Frank, Richard Partch