Abstract: A tube type light emitting diode light source including a light source generator, a light guide and a diffuser is provided. The light source generator includes LEDs arranging in a line. The light guide has a grooved light incident surface and a grooved light-guiding surface. The grooved light incident surface encompasses the LEDs, and the grooved light-guiding surface is adapted for changing the propagating direction of an incident light. The diffuser covers the light guide.

Abstract: A light emitting diode (LED) utilizes an adhesive layer to adhere a light emitting layer to a substrate. The LED further comprises an electrode buffer layer to enhance the adhesion between the electrode and the light emitting diode, and thus to improve the yield rate of the LED.

Abstract: A light emitting device having a circuit protection unit is provided. The circuit protection unit has a low-resistance layer and a potential barrier layer, wherein a barrier potential exists at the interface between the low-resistance layer and the potential barrier layer. The circuit protection unit is electrically connected with the light emitting device. When an electrostatic discharge or excessive forward current is occurred in the light emitting device, the circuit protection unit provides a rectifying function for preventing damages caused by static electricity or excessive forward current to the light emitting device.

Abstract: An illumination apparatus is disclosed in the invention. The illumination apparatus includes a cavity with a diffusion surface, a light source, a light-spreading device, and at least one optically-conditioning surface with a wavelike array formed thereon. The light-spreading device and the optically-conditioning surface spread the light generated by the light source. The light-spreading device includes a wing-shaped protrusion part, a light incident surface, a recess located away from the light incident surface, and an optically-conditioning surface including a wavelike array, wherein the wavelike array has a wavefront direction.

Abstract: A semiconductor light-emitting element assembly, comprising a composite substrate, a circuit layout carrier, a connecting structure, a recess, and a semiconductor light-emitting element, is disclosed. The connecting structure is used for bonding the composite substrate with the circuit layout carrier. The recess is formed by the circuit layout carrier and extends toward the composite substrate. The semiconductor light-emitting element is deposited in the recess and electrically connected to the circuit layout carrier.

Abstract: An illumination package is disclosed in the invention. The illumination package includes an optical element, package base, and a light emitter. The optical element is designed to redirect a majority of light emitted from the light emitter to a direction approximately perpendicular to a longitudinal axis of the optical element. In one embodiment, the optical element includes an flared portion and a base portion. The flared portion is constructed by an upper surface forming a recess, a side surface adjacent to the upper surface and curved, and a lower surface connecting to the base portion. In another embodiment, a concave lens is formed on the upper surface.

Abstract: A liquid crystal display having a backlight module, liquid crystal layer and a color filter layer is disclosed in the invention. An ultraviolet unit for emitting ultraviolet is disposed in the backlight module. The color filter layer is composed of a purity of pixels, and at least one of the purity of pixels is filled with a wavelength-converting material. The wavelength-converting material can convert ultraviolet into green light.

Abstract: An organic adhesive light-emitting device with a vertical structure is provided. The organic adhesive light-emitting device comprises a conductive substrate with a concavo-convex upper surface; a first metal layer formed on the concavo-convex upper surface of the conductive substrate; an organic adhesive material formed over the first metal layer; a second metal layer formed over the organic adhesive material, wherein all or part of the first metal layer over the concavo-convex upper surface is in ohmic contact with the second metal layer through the organic adhesive material; a reflective layer formed over the second metal layer; and a light-emitting stack layer formed over the second metal layer. The process for manufacturing the present invention organic adhesive light-emitting device is less complex than that for manufacturing prior art diodes.

Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.

Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.

Abstract: A light emitting diode having an adhesive layer and a reflective layer and a manufacturing method thereof featured by adhering together a light emitting diode stack and a substrate having a reflective metal layer by use of a transparent adhesive layer so that the light rays directed to the reflective metal layer can be reflected therefrom to improve the brightness of the light emitting diode.

Abstract: The present invention is related to a light emitting diode of an omnidirectional reflector providing with a transparent conductive layer. In the present invention, a cohesion layer is formed between a transparent layer and a metal reflection layer to improve the cohesive force therebetween and increase the reflectivity of the light emitting diode, so as the present invention can enhance the light-emitting efficiency of the light emitting diode.

Abstract: The present invention is related to a light emitting diode having an adhesive layer provided with heat paths. In the present invention, an adhesive layer is formed to bond the substrate and the LED stack. There are a plurality of metal protrusions or semiconductor protrusions passing through the adhesive layer to form heat-dissipation paths to improve the heat-dissipation effect of the LED so as to enhance the stability and the light-emitting efficiency of the LED.

Abstract: A backlight module including an independent light source is provided. The backlight module includes a light generation device, a light transmission device, a light mixing device and a planar light generation device. The light generation device may include one or more light emitting components. The light transmission device may be adopted for receiving and transmitting the light emitted by the light generation device. The light mixing device may be adopted for mixing the light emitted by the light transmission device to generate a mixed linear light. The planar light generation device may comprise a light distributing portion for receiving the mixed linear light to generate a planar light.

Abstract: A light emitting diode having an adhesive layer and manufacturing method thereof is disclosed. An adhesive layer having a thickness of about 0.1 ?m to 1 ?m is used to adhere an LED stack and a high heat-dissipating substrate, wherein the substrate is of a thermal conductivity greater than or equal to 100 W/mk. The present invention enhances the heat-dissipating effect of the light emitting diode so as to improve the stability and the light-emitting efficiency of the light emitting diode.

Abstract: Disclosed is a planar light source device comprising a light generation device comprising at least two light-emitting elements; a light-mixing device for mixing a generated light from the light generation device to generate a mixed linear light; and a planar light generation device comprising a light-scattering portion for receiving the mixed light to generate a planar light.

Abstract: A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.

Abstract: A planar light-emitting device includes a light source for generating light, a light gathering module for gathering the light generated by the light source and generating mixed light, a linear light generator comprising a light distributing unit for receiving the mixed light and distributing the mixed light to generate linear light, and a planar light generator for receiving the linear light and generating a planar light.

Abstract: A semiconductor light-emitting device includes a light-impervious substrate, a bonding structure, a semiconductor light-emitting stack, and a fluorescent material structure overlaying the semiconductor light-emitting stack. The semiconductor light-emitting stack is separated from a growth substrate and bonded to the light-impervious substrate via the bonding structure. A method for producing the semiconductor light-emitting device includes separating a semiconductor light-emitting stack from a growth substrate, bonding the semiconductor light-emitting stack to a light-impervious substrate, and forming a fluorescent material structure over the semiconductor light-emitting stack.

Abstract: Organic adhesive light-emitting device with ohmic metal bulge. The organic adhesive light-emitting device includes a conductive substrate, a light-emitting stack layer, a metal layer formed over the conductive substrate, a reflective layer formed over the light-emitting stack layer, and an organic adhesive layer having an ohmic metal bulge and an adhesive material around the ohmic metal bulge. The adhesive material bonds the metal layer and the reflective layer together, while the ohmic metal bulge forms ohmic contacts with the metal layer and the reflective layer. The configuration can simplify a light-emitting diode.