Abstract: An embodiment apparatus includes a dielectric layer, a conductive trace in the dielectric layer, and a bump pad. The conductive trace includes a first portion having an exposed top surface, wherein the exposed top surface is recessed from a top surface of the dielectric layer. Furthermore, the bump pad is disposed over and is electrically connected to a second portion of the conductive trace.

Abstract: According to various embodiments, a wristband may be provided. The wristband may include: a receiver configured to receive data; a first display; a second display; a display controller configured to control the first display to display first abstract information of a first level of detail based on the received data, and further configured to control the second display to display second abstract information of a second level of detail based on the received data; and a sensor configured to determine a condition of the wristband. The display controller is further configured to control at least one of the first display or the second display based on the determined condition.

Abstract: A package includes a package substrate, which includes a middle layer selected from the group consisting of a core and a middle metal layer, a top metal layer overlying the middle layer, and a bottom metal layer underlying the middle layer. All metal layers overlying the middle layer have a first total metal density that is equal to a sum of all densities of all metal layers over the middle layer. All metal layers underlying the middle layer have a second total metal density that is equal to a sum of all densities of all metal layers under the middle layer. An absolute value of a difference between the first total metal density and the second total metal density is lower than about 0.1.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: An embodiment apparatus includes a dielectric layer in a die, a conductive trace in the dielectric layer, and a protrusion bump pad on the conductive trace. The protrusion bump pad at least partially extends over the dielectric layer, and the protrusion bump pad includes a lengthwise axis and a widthwise axis. A ratio of a first dimension of the lengthwise axis to a second dimension of the widthwise axis is about 0.8 to about 1.2.

Abstract: According to various embodiments, a radio communication system may be provided. The radio communication system may include: a portable device; a beacon receiving device; and a server. The portable device may include: a transmitter configured to repeatedly transmit signals; and a receiver configured to receive data from the server. The beacon receiving device may include: a receiver configured to receive signals from the portable device; and a transmitter configured to transmit an indication to the server based on the received signal. The server may include: a receiver configured to receive the indication from the beacon receiving device; and a transmitter configured to transmit data to the portable device based on the indication.

Abstract: According to various embodiments, a radio communication device may be provided. The radio communication device may include: a memory circuit configured to store data to be broadcasted; a communication circuit configured to establish a wireless connection with a first further radio communication device; and a transmitter configured to at least one of broadcast signals based on the stored data or transmit a signal based on the stored data to the first further radio communication device using the communication circuit; wherein the communication circuit is configured to receive information from the first further radio communication device based on a signal broadcasted by a second further radio communication device, free from the communication circuit receiving the signal from the second further radio communication device.

Abstract: A package includes a package substrate, which includes a middle layer selected from the group consisting of a core and a middle metal layer, a top metal layer overlying the middle layer, and a bottom metal layer underlying the middle layer. All metal layers overlying the middle layer have a first total metal density that is equal to a sum of all densities of all metal layers over the middle layer. All metal layers underlying the middle layer have a second total metal density that is equal to a sum of all densities of all metal layers under the middle layer. An absolute value of a difference between the first total metal density and the second total metal density is lower than about 0.1.

Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: An embodiment apparatus includes a dielectric layer, a conductive trace in the dielectric layer, and a bump pad. The conductive trace includes a first portion having an exposed top surface, wherein the exposed top surface is recessed from a top surface of the dielectric layer. Furthermore, the bump pad is disposed over and is electrically connected to a second portion of the conductive trace.

Abstract: According to various embodiments, a radio communication device may be provided. The radio communication device may include: a memory circuit configured to store data to be broadcasted; a communication circuit configured to establish a wireless connection with a first further radio communication device; and a transmitter configured to at least one of broadcast signals based on the stored data or transmit a signal based on the stored data to the first further radio communication device using the communication circuit; wherein the communication circuit is configured to receive information from the first further radio communication device based on a signal broadcasted by a second further radio communication device, free from the communication circuit receiving the signal from the second further radio communication device.

Abstract: An embodiment package includes a conductive pillar mounted on an integrated circuit chip, the conductive pillar having a stepper shape, a metal trace partially embedded in a substrate, the metal trace having a bonding pad portion protruding from the substrate, and a solder feature electrically coupling the conductive pillar to the bonding pad portion of the metal trace.

Abstract: A keyboard structure for improving the uniformity of illumination comprises a substrate having a reflective surface and a key switch assembly. The key switch assembly is disposed adjacent and specifically on top of the substrate and comprises a keycap, a contact assembly and a light emitting means. The light emitting means can be located either between the keycap and the contact assembly or on the substrate and adjacent to the contact assembly. The keycap further has a portion which is optically transmissive. The light from the light emitting means, directly and/or after reflecting from the reflective surface passes through one or more of the gap between adjacent keycaps or a row of keycaps and through the optically transmissive portion of the keycaps, thus illuminating the keyboard structure. Different colors may be used in different zones of the keyboard. The reflective surface and the light emitting means can have the same color.

Abstract: A die and a substrate are provided. The die comprises at least one integrated circuit chip, and the substrate comprises first and second subsets of conductive pillars extending at least partially therethrough. Each of the first subset of conductive pillars comprises a protrusion bump pad protruding from a surface of the substrate, and the second subset of conductive pillars each partially form a trace recessed within the surface of the substrate. The die is coupled to the substrate via a plurality of conductive bumps each extending between one of the protrusion bump pads and the die.

Abstract: A package includes a package component and an interposer over and bonded to the package component. The package component includes a solder region. The interposer includes a core dielectric material, a conductive pipe penetrating through the core dielectric material, with the first solder region in contact with a bottom end of the conductive pipe, and a through-opening in a center region of the interposer.

Abstract: According to various embodiments, a wristband may be provided. The wristband may include: a receiver configured to receive data; a first display; a second display; a display controller configured to control the first display to display first abstract information of a first level of detail based on the received data, and further configured to control the second display to display second abstract information of a second level of detail based on the received data; and a sensor configured to determine a condition of the wristband. The display controller is further configured to control at least one of the first display or the second display based on the determined condition.

Abstract: A package includes a package component and an interposer over and bonded to the package component. The package component includes a solder region. The interposer includes a core dielectric material, a conductive pipe penetrating through the core dielectric material, with the first solder region in contact with a bottom end of the conductive pipe, and a through-opening in a center region of the interposer.

Abstract: An embodiment package includes a conductive pillar mounted on an integrated circuit chip, the conductive pillar having a stepper shape, a metal trace partially embedded in a substrate, the metal trace having a bonding pad portion protruding from the substrate, and a solder feature electrically coupling the conductive pillar to the bonding pad portion of the metal trace.

Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes: a substrate comprising a recess portion filled with a conductive material; a conductive trace overlying and contacting the conductive material; a conductive pillar disposed on the conductive trace and over the recess portion of the substrate; and a semiconductor chip disposed on the conductive pillar, wherein the elastic modulus of the substrate is of about 3 to about 10 GPa at about 20 to about 30° C. and of about 1 to about 5 GPa at about 250 to about 270° C.

Abstract: Most computer operating systems are able to automatically configure the coupled computer peripheral device for use with the computer operating system without the need for installation of a specific driver. However, when these peripheral devices are detected by the computing system, a generic UI control configuration is often assigned to them and whatever customised settings previously configured by the user will be lost and replaced with a new set of unfamiliar setting. This poses much inconvenience and hassle to gamers when they use a different computing system or machine. Described according to an embodiment of the invention is a profile management method, operating on a computing cloud, comprising steps for receiving client data provided by a computing system detecting coupling of a user-interface (UI) thereto and for retrieving configuration data corresponding to the client data for use in configuring the UI by the computing system.