Patents by Inventor Min Lin

Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210057643
    Abstract: An ReRAM structure includes a dielectric layer. A first ReRAM and a second ReRAM are disposed on the dielectric layer. The second ReRAM is at one side of the first ReRAM. A trench is disposed in the dielectric layer between the first ReRAM and the second ReRAM. The first ReRAM includes a bottom electrode, a variable resistive layer and a top electrode. The variable resistive layer is between the bottom electrode and the top electrode. A width of the bottom electrode is smaller than a width of the top electrode. The width of the bottom electrode is smaller than a width of the variable resistive layer.
    Type: Application
    Filed: September 20, 2019
    Publication date: February 25, 2021
    Inventors: Shih-Min Chou, Kuo-Chih Lai, Wei-Ming Hsiao, Hui-Ting Lin, Szu-Yao Yu, Nien-Ting Ho, Hsin-Fu Huang, Chin-Fu Lin
  • Publication number: 20210058922
    Abstract: Provided are a method and apparatus for signal transmission and a terminal. The method includes determining the sending mode of multiple uplink channels by a user equipment (UE) in a case where overlapped symbols of the uplink channels exist in time domain; and sending uplink signals carried by the uplink channels according to the determined sending mode.
    Type: Application
    Filed: April 26, 2019
    Publication date: February 25, 2021
    Inventors: Xianghui HAN, Shuqiang XIA, Jing SHI, Chunli LIANG, Min REN, Wei LIN
  • Publication number: 20210056882
    Abstract: A pixel array substrate, including scanning line pads, data line pads, scanning lines, data lines, gate transmission lines, pixels, a data line signal chip, and a scanning line signal chip, is provided. The scanning lines extend along a first direction. The data lines and the gate transmission lines extend along a second direction. The data lines are electrically connected to the data line pads. The scanning lines are electrically connected to the scanning line pads through the gate transmission lines. A ratio of a number of rows of pixels arranged in the first direction to a number of rows of pixels arranged in the second direction is X:Y. Each pixel includes m sub-pixels.
    Type: Application
    Filed: August 6, 2020
    Publication date: February 25, 2021
    Applicant: Au Optronics Corporation
    Inventors: Yang-Chun Lee, Sheng-Yen Cheng, Yueh-Hung Chung, Min-Tse Lee, Kuang-Hsiang Liao, Shiang-Lin Lian, Yan-Kai Wang, Ya-Ling Hsu, Chen-Hsien Liao
  • Publication number: 20210057273
    Abstract: Interconnect structures and method of forming the same are disclosed herein. An exemplary interconnect structure includes a first contact feature in a first dielectric layer, a second dielectric layer over the first dielectric layer, a second contact feature over the first contact feature, a barrier layer between the second dielectric layer and the second contact feature, and a liner between the barrier layer and the second contact feature. An interface between the first contact feature and the second contact feature includes the liner but is free of the barrier layer.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Inventors: Hsin-Ping Chen, Ming-Han Lee, Shin-Yi Yang, Yung-Hsu Wu, Chia-Tien Wu, Shau-Lin Shue, Min Cao
  • Publication number: 20210057298
    Abstract: A semiconductor package including a semiconductor die, a molding compound and a redistribution structure is provided. The molding compound laterally wraps around the semiconductor die, wherein the molding compound includes a base material and a first filler particle and a second filler particle embedded in the base material. The first filler particle has a first recess located in a top surface of the first filler particle, and the second filler particle has at least one hollow void therein. The redistribution structure is disposed on the semiconductor die and the molding compound, wherein the redistribution structure has a polymer dielectric layer. The polymer dielectric layer includes a body portion and a first protruding portion protruding from the body portion, wherein the body portion is in contact with the base material and the top surface of the first filler particle, and the first protruding portion fits with the first recess of the first filler particle.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 25, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Da Tsai, Ching-Hua Hsieh, Chih-Wei Lin, Tsai-Tsung Tsai, Sheng-Chieh Yang, Chia-Min Lin
  • Publication number: 20210055764
    Abstract: An electronic device including two bodies and at least one hinge structure is provided. The hinge structure includes a first bracket, a second bracket, a first rotation component, and a second rotation component. The hinge structure is connected to the two bodies via the first bracket and the second bracket respectively. The first rotation component is connected rotatably to the first bracket by taking a first axis as a rotation axis. The second rotation component is connected rotatably to the first rotation component by taking the first axis as a rotation axis, and is connected rotatably to the second bracket by taking a second axis as a rotation axis, wherein the first axis and the second axis are parallel to each other.
    Type: Application
    Filed: August 19, 2020
    Publication date: February 25, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Cheng-Ya Chi, Chien-Chu Chen, Ken-Ping Lin, Cheng-Shiue Jan, Yao-Lin Chang, Han-Hsuan Tsai, Jui-Min Huang, Chih-Wen Chiang
  • Patent number: 10927000
    Abstract: A MEMS structure includes a substrate, an inter-dielectric layer on a front side of the substrate, a MEMS component on the inter-dielectric layer, and a chamber disposed within the inter-dielectric layer and through the substrate. The chamber has an opening at a backside of the substrate. An etch stop layer is disposed within the inter-dielectric layer. The chamber has a ceiling opposite to the opening and a sidewall joining the ceiling. The sidewall includes a portion of the etch stop layer.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: February 23, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kun-Che Hsieh, Kuan-Yu Wang, Chung-Yi Chiu
  • Publication number: 20210050824
    Abstract: A radio frequency amplifier circuit is provided. A matching circuit is configured on a radio frequency path of an input end or an output end of an amplifier. An inductance-capacitance resonance circuit and the matching circuit share an inductor included in the matching circuit to generate a corresponding resonance frequency. The matching circuit provides an input impedance or an output impedance matching two fundamental tones in a radio frequency signal at a first frequency and a second frequency. The inductance-capacitance resonance circuit provides a filtering path for filtering a signal component outside a frequency band formed by the first frequency and the second frequency in the radio frequency signal.
    Type: Application
    Filed: August 13, 2020
    Publication date: February 18, 2021
    Applicant: RichWave Technology Corp.
    Inventor: Cheng-Min Lin
  • Patent number: 10921063
    Abstract: A heat dissipation unit includes a main body and a mesh body. The main body has an upper plate and a lower plate. The upper and lower plates are correspondingly overlapped and mated with each other to together define an airtight chamber. A working fluid is contained in the airtight chamber. One face of the lower plate, which faces the airtight chamber, is formed with a capillary structure by means of laser processing. The mesh body is attached to the face of the lower plate with the capillary structure. By means of the mesh body, the liquid working fluid backflow efficiency of the capillary structure can be enhanced and the water content of the internal evaporation section of the heat dissipation unit can be increased to avoid dry burn.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: February 16, 2021
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Yu-Min Lin
  • Publication number: 20210041133
    Abstract: Some embodiments of the present disclosure provide an air sweeping assembly, an air regulating device and an air conditioner. The air sweeping assembly includes: a rotation shaft (10), the rotation shaft (10) being provided with blades (20) thereon; a driving device, the driving device including a fixing portion (31) and a driving portion disposed on the fixing portion (31); the driving portion being drivingly connected with the rotation shaft (10), and the driving portion being configured to drive the rotation shaft (10) to rotate; and a first position limiting member (40) disposed on the fixing portion (31); the first position limiting member (40) being configured to define an initial position of the rotation shaft (10) in a circumferential direction.
    Type: Application
    Filed: December 10, 2018
    Publication date: February 11, 2021
    Inventors: Qinghui LIN, Chunjie Wang, Min Wang
  • Publication number: 20210042186
    Abstract: A memory storage apparatus including a memory array and a controller circuit is provided. The memory array is configured to store a first error correcting code and a first data. The controller circuit is coupled to the memory array. The controller circuit is configured to read the first data from the memory array and determine whether an error bit of the first data is one of one or more data mask bits to decide whether to update the first error correcting code stored in the memory array. The controller circuit includes a switch element. The switch element is coupled to the memory array. The switch element receives the first data from the memory array. An error correcting procedure is not performed on the first data. In addition, a data access method is also provided.
    Type: Application
    Filed: August 11, 2019
    Publication date: February 11, 2021
    Applicant: Winbond Electronics Corp.
    Inventor: Che-Min Lin
  • Patent number: 10913812
    Abstract: An alkoxy amine compound is provided, which has a chemical structure of: wherein each of R1 is independently H, C1-6 alkyl group, or C1-6 alkoxy group; R2 is C1-6 alkyl group, R3 is —(CxH2x)—OH or —(CxH2x+1), and x is 1 to 8; R4 is H or C1-6 alkyl group; R5 is and R6 is H or C1-8 alkyl group; R7 is H or C1-6 alkyl group, R8 is Ini is a residual group of a radical initiator; and n is an integer of 1 to 10000.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: February 9, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Meng-Wei Wang, Yu-Min Han, Chih-Hsiang Lin
  • Publication number: 20210037232
    Abstract: A driving method suitable for a head mounted device (HMD) is provided. The driving method includes the following operations: moving a first image capture unit and a second image capture unit of the HMD to respectively capture two left-eye images and two right-eye images; calculating a first eye relief according to at least one left-eye feature in the two left-eye images; calculating a second eye relief according to at least one right-eye feature in the two right-eye images; calculating an interpupillary distance (IPD) according to the first eye relief and the second eye relief; and adjusting, according to the IPD, a distance between a first lens and a second lens of the HMD.
    Type: Application
    Filed: June 29, 2020
    Publication date: February 4, 2021
    Inventors: Yung-Chen LIN, Wen-Ju CHEN, Wei-Chen CHEN, Kai-Wen ZHENG, Yan-Min KUO
  • Publication number: 20210035914
    Abstract: A chip package structure including first and second insulating layers, first and second circuit structures, a chip on the first circuit structure, an encapsulant, a conductive through via, and first and second heat dissipation layers is provided. The first circuit structure is disposed at the first surface of the first insulating layer. The bottom electrode of the chip is electrically connected to the first circuit structure. The second circuit structure is disposed on the chip and electrically connected to the top electrode of the chip. The encapsulant encapsulates the first and second circuit structures and the chip. The conductive through via is disposed in the encapsulant and connects the first and second circuit structures. The second insulating layer is disposed on the second circuit structure. The first heat dissipation layer is disposed on the first insulating layer. The second heat dissipation layer is disposed on the second insulating layer.
    Type: Application
    Filed: April 16, 2020
    Publication date: February 4, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Han Lin, Yu-Min Lin, Tao-Chih Chang
  • Patent number: 10899608
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Patent number: 10903559
    Abstract: A method for manufacturing a liquid-crystal antenna device is provided. The method includes step (a) providing a first mother substrate. The first mother substrate includes a first region and a second region. The first region has a plurality of first sides. An extension line of at least one of the first sides divides the second region into a first part and a second part. The method also includes the following steps: (b) forming a first electrode layer on the first region and the second region, and (c) cutting the first mother substrate along the first sides of the first region.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: January 26, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Yi-Hung Lin, Chin-Lung Ting, Hui-Min Huang, Tang-Chin Hung
  • Patent number: 10901506
    Abstract: A finger-gesture detection device adapted for a control handle includes a grip portion. The finger-gesture detection device includes a first wearing portion, a plurality of second wearing portions, and a plurality of first sensors. The first wearing portion is adapted to detachably surround the grip portion of the control handle. When the grip portion connects the first wearing portion, the grip portion is positioned on one side of the first wearing portion. The second wearing portions are each independently connected to the first wearing portion. When a force is applied to one of the second wearing portions, the corresponding second wearing portion moves toward the grip portion. The first sensors are respectively disposed on the second wearing portions for detecting positions or movements of the second wearing portions relative to the grip portion. A control assembly and a correction method are also proposed.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: January 26, 2021
    Assignee: HTC Corporation
    Inventors: Chien-Min Wu, Huan-Hsin Li, Li-Hsun Chang, Tian-Jia Hsieh, Tzu-Hao Lin
  • Publication number: 20210018197
    Abstract: An intelligent air-drying system and method are provided. The intelligent air-drying system includes an air-drying device and an application program. The air-drying device includes a device body, a sensing unit, a heater, and a processing unit. The device body has a water-absorbing material for absorbing moisture in the air. The sensing unit is disposed on the device body to detect the humidity of the environment where the air-drying device is located. The heater is disposed on the device body to heat the water-absorbing material. The processing unit is coupled to the sensing unit and the heater, and the processing unit executes the application program. The startup timing of the heater is dynamically predicted based on the daily humidity change measured by the sensing unit, and the heater is started before the water-absorbing material reaches saturation to ensure the water-absorbing and dehumidifying capabilities of the water-absorbing material.
    Type: Application
    Filed: July 19, 2019
    Publication date: January 21, 2021
    Inventors: CHIA-CHING LIN, CHING-MIN CHEN
  • Patent number: 10895974
    Abstract: In one example, a system for topic image flows can include a processing resource and a non-transitory computer readable medium having stored thereon instructions to cause the processing resource to generate an image flow of a plurality of topic headers when a user scroll speed of a document including text exceeds a threshold scroll speed, receive a selection of a topic header from the plurality of topic headers, and display, on a user interface, a portion of the document that corresponds to the selected topic header from the plurality of topic headers.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: January 19, 2021
    Assignee: MICRO FOCUS LLC
    Inventors: Perry Zhang, Yu-Dan Lin, Bing Zhang, Jian-Min Gao
  • Patent number: D911409
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: February 23, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Min-Min Ou Yang, Chih-Chi Lin, Po-Yen Tseng