Abstract: A device includes a first power rail for a first power domain and a second power rail for a second power domain. A first circuit block is connected to the first power rail and a second circuit block is connected to the second power rail. The first and second circuit blocks are both connected to a virtual VSS terminal. A footer circuit is connected between the virtual VSS terminal and a ground terminal, and the footer circuit is configured to selectively control a connection between the virtual VSS terminal and the ground terminal.

Abstract: A method of processing light-emitting elements includes: transferring a plurality of light-emitting elements from original wafers or next-stage carriers, based on a predetermined pattern. The predetermined pattern arranges two adjacent LED groups in a first direction on the original wafer or carriers to be placed on two non-adjacent positions in the first direction on the next-stage carriers. The light-emitting elements on the original wafer have a horizontal wafer pitch and a vertical wafer pitch. The light-emitting elements on each of the next-stage carriers have a first horizontal pitch and a first vertical pitch. The first horizontal pitch is greater than the horizontal wafer pitch, or the first vertical pitch is greater than the vertical wafer pitch. Besides, a light-emitting element device using the aforementioned method is also provided.

Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.

Abstract: An intelligent drying device for a transformer includes an air dehydrating device and a control device. The air dehydrating device is in air communication with a transformer, and includes a device body, a sensor, and a heater. The device body has a desiccant, and the sensor and the heater are disposed on the device body. The control device is connected to the air dehydrating device, and includes a display module. In use, the air dehydrating device can remove moisture from an air stream by the desiccant when the transformer is in an intake state, and can remove moisture from the desiccant by the heater when the transformer is in an exhaust state. The control device can determine a humidity status level to be displayed on the display module according to air humidity data obtained by the sensor.

Abstract: A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.

Abstract: An electronic device includes a first memory controller, a second memory controller, and a memory access controller. The first memory controller stores setting information of a predetermined memory, wherein the predetermined memory is defined as an execute-only-memory. The second memory controller provides and sets an enabling register according to the setting information of the predetermined memory, and generates an enabling signal. The memory access controller accesses the first memory controller and the second memory controller to move the data of the predetermined memory to a predetermined memory space corresponding to the enabling register according to the enabling signal and the setting information of the predetermined memory.

Abstract: Disclosed is an earphone system. The earphone system includes a charging box and an earphone, which is detachably assembled in the charging box. The charging box includes a processing module provided with a first identification time period, a power outputting module and a first switch module. During the first identification time period when the earphone is connected to the charging box, the earphone system is in a test mode, and the first switch module is switched for the charging box to transmit power to the earphone through the power outputting module and the first switch module. After the earphone is connected to the charging box for more than the first identification time period, the earphone system is in a communication mode, and the first switch module is switched for the charging box to transmit a data signal to the earphone through the processing module and the first switch module.

Abstract: Disclosed is an earphone system. The earphone system includes a charging box and an earphone, which is detachably assembled in the charging box. The charging box includes a processing module provided with a first identification time period, a power outputting module and a first switch module. During the first identification time period when the earphone is connected to the charging box, the earphone system is in a test mode, and the first switch module is switched for the charging box to transmit power to the earphone through the power outputting module and the first switch module. After the earphone is connected to the charging box for more than the first identification time period, the earphone system is in a communication mode, and the first switch module is switched for the charging box to transmit a data signal to the earphone through the processing module and the first switch module.

Abstract: Aspects of the present disclosure involve a system comprising a computer-readable storage medium storing a program and method for dynamically assigning participant video feeds within a virtual conferencing system. The program and method provide, in association with designing a virtual space for virtual conferencing, an interface for configuring a set of rooms, each room being associated with a different number of participant video elements assignable to respective participant video feeds; receive, via the interface, an indication of user input for setting properties for the set of rooms; determine, in association with virtual conferencing, a first number of participants for a room; select a first room corresponding to the first number of participants; provide display of the first room; and assign, for each of the first number of participants, a participant video feed corresponding to the participant with a respective participant video element in the first room.

Abstract: Aspects of the present disclosure involve a system comprising a computer-readable storage medium storing a program and method for providing bot participants for virtual conferencing.

Abstract: An intelligent energy storage system, electrically connected to an external power source and a load, including a first energy storage device, a second energy storage device, at least one converter and a controller. The first energy storage device is adapted for storing electrical energy. The second energy storage device is electrically connected to the external power source and the load. The converter is electrically connected between the first and the second energy storage device. The controller is configured to detect at least one electrical property of the first or the second energy storage device to regulate an output voltage and current of the converter. In an energy storage mode, the external power source is used to charge the first energy storage device through the second energy storage device. In an energy transfer mode, the first energy storage device is used as power source to charge the second energy storage device.

Abstract: Aspects of the present disclosure involve a system comprising a computer-readable storage medium storing a program and method for providing a room preview within a virtual conferencing system. The program and method provide for virtual conferencing between plural participants within a first room of plural rooms, the plural rooms being included within a virtual space for virtual conferencing; and for each of the plural participants, provide a first audio channel associated with audio output of the first room, provide display of a room preview element within the first room, the room preview element corresponding to a live preview of a second room of the plural rooms, and provide a second audio channel associated with audio output of the second room.

Abstract: A heterogeneous integration semiconductor package structure including a heat dissipation assembly, multiple chips, a package assembly, multiple connectors and a circuit substrate is provided. The heat dissipation assembly has a connection surface and includes a two-phase flow heat dissipation device and a first redistribution structure layer embedded in the connection surface. The chips are disposed on the connection surface of the heat dissipation assembly and electrically connected to the first redistribution structure layer. The package assembly surrounds the chips and includes a second redistribution structure layer disposed on a lower surface and multiple conductive vias electrically connected to the first redistribution structure layer and the second redistribution structure layer. The connectors are disposed on the package assembly and electrically connected to the second redistribution structure layer.

Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.

Abstract: A head-mounted display device is provided. The head-mounted display device includes a sensor and a controller. The sensor is configured to capture an eye image of eyes of a user. The controller is coupled to the sensor and configured to: analyze the eye image to generate an analysis result, wherein the analysis result indicates that whether the eyes in the eye image is clear or not; and in response to the analysis result indicating that the eye in the eye image is not clear, output an issue detected signal.

Abstract: A resin film is provided. When the resin film is characterized by Fourier transform infrared spectroscopy (FTIR), the Fourier transform infrared spectrum of the resin film has a signal intensity A from 2205 cm?1 to 2322 cm?1 and a signal intensity B from 1472 cm?1 to 1523 cm?1, and 0.70?A/B?1.95.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an interconnection structure over a semiconductor substrate and a conductive pillar over the interconnection structure. The conductive pillar has a protruding portion extending towards the semiconductor substrate from a lower surface of the conductive pillar. The semiconductor device structure also includes an upper conductive via between the conductive pillar and the interconnection structure and a lower conductive via between the upper conductive via and the interconnection structure. The lower conductive via is electrically connected to the conductive pillar through the upper conductive via. The conductive pillar extends across opposite sidewalls of the upper conductive via and opposite sidewalls of the lower conductive via. A top view of an entirety of the second conductive via is separated from a top view of an entirety of the protruding portion.

Abstract: Aspects of the present disclosure involve a system comprising a computer-readable storage medium storing a program and method for configuring a three-dimensional (3D) model within a virtual conferencing system. The program and method provide, in association with designing a room for virtual conferencing, an interface for configuring a 3D model; receiving, via the interface, an indication of user input for setting properties for the 3D model, the properties specifying image data for projecting onto the 3D model; and in association with virtual conferencing, providing display of the room based on the properties for the 3D model, and causing the image data to be projected onto the 3D model within the room.