Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.

Abstract: A service-level communication and computing collaborative resource allocation device and method for a large-scale satellite network are provided, the device includes: a network information management function module including a service request collection unit configured to collect service requests arriving at each satellite node in the network, and a network resource collection unit configured to collect available resource status information for each satellite node; a service preprocessing function module configured to preprocess service requests; a service feature extraction function module configured to perform feature extraction for preprocessed service requests to generate service demand features; a service order decision submodule configured to determine a service order of service requests; a service strategy decision submodule configured to output a service strategy of the service request.

Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: Provided are a silicon carbide crystal growth device and a quality control method. The device includes: an annealing unit, a crystal growth unit, an atmosphere control unit, and a transport system; the atmosphere control unit provides a gas environment with low water, oxygen and nitrogen; the transport system transports a plurality of target objects after high-temperature purification by the annealing unit to the atmosphere control unit; after assembling silicon carbide seed crystal and silicon carbide powder in a graphite crucible and covering with thermal insulation material to form a container inside the atmosphere control unit, the transport system transports the container to the crystal growth unit. The method uses a weighing system in a chamber of the crystal growth unit to detect a weight change of silicon carbide seed crystal and silicon carbide powder during a crystal growth process through a plurality of weight sensors of the weighing system.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: Embodiments of the present disclosure generally relate to lithography systems. In one embodiment, a method is disclosed. The method includes measuring a location of a die pad of a die placed on a substrate and determining a die pad shift between an expected location of the die pad and the measured location of the die pad. The method also includes using the determined die pad shift and an expected via location to generate a shifted via location for a via electrically connecting to the die pad. The method further includes patterning the via at the shifted via location with a maskless lithography tool and utilizing a physical mask with a mask-based lithography tool to pattern a redistribution layer (RDL) pad electrically connected to the via patterned at the shifted via location with the maskless lithography tool.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: A method for enhancing network coverage based on adaptive generation of resource cell. A traditional cell in a network is taken as an initial state of the network. A correlation matrix in a current network state is generated. Whether |?i,jt??i,jt-1|/?i,jt-1>? is determined. Each access point is divided into a plurality of resource cells. A CU-DU network mapping table is generated. A middlehaul link of each of the plurality of resource cells is constructed according to the CU-DU network mapping table.

Abstract: Hierarchical network operation and resource control system and method for a mega satellite constellation, belonging to the field of spatial information technology, are provided. The hierarchical network operation and resource control system includes a service layer, a global organization layer, a local coordination layer and a resource layer. The service layer is used as an input to drive operation of whole system. The global organization layer is to realize “operation, measurement and control” integrated control and decision of whole network. The local coordination layer is to realize local management decision and management slice generation. The resource layer is to provide physical resource and physical device and realize resource virtualization.

Abstract: An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.

Abstract: An inter-layer link design method of multilayer constellations with enhanced service coverage capacity is provided, the method includes: establishing a multilayer satellite network spinning T time slot, and obtaining a coordinate of each satellite in the multilayer satellite network at each time slot under a geocentric coordinate system; establishing an adjacency matrix of each constellation in the multilayer satellite network; establishing a feasible set of inter-layer links between adjacent layers in the multilayer satellite network for each time slot; establishing a globally non-uniform service model according to geographical population distribution, and dividing an earth surface into multiple logical area; obtaining a weight of inter-layer link in the feasible set of inter-layer links at each time slot; establishing an assignment model of inter-layer link according to the weight of inter-layer link; and optimizing an inter-layer link set in the feasible set of inter-layer links to obtain a target inter-la

Abstract: A silicon carbide crystal expansion apparatus includes a crucible and a heating device. The crucible includes a main body and a cover body. The main body has a raw material space suitable for placing a silicon carbide raw material. The cover body is suitable for being placed above the main body, and has an accommodating space suitable for a silicon carbide seed and a crystal expansion space located below the accommodating space. The heating device is thermally coupled to the crucible. The upper portion of the crystal expansion space has a first size, and the lower portion of the crystal expansion space has a second size, and the second size is larger than the first size.

Abstract: Lightweight inter-satellite handover device and method for a mega LEO satellite network are provided. An attribute extraction sub-module extracts attributes of handover users in a user information storage unit. Based on the attributes of the handover users, a cluster sub-module clusters the handover users into user clusters. A decision set generator sub-module generates target satellite sets of the user clusters, determines each target satellite of the target satellite sets of the user clusters of each LEO satellite whether belongs to LEO satellites in a management domain of a handover decision point of managing the LEO satellite based on management domain information in a LEO satellite information storage unit, and if YES, performing inter-satellite handover by a centralized decision unit, otherwise performing inter-satellite handover by a distributed decision unit.

Abstract: Disclosed is an optical emission assembly including a body, an adapter, two light-emitting assemblies, a multiplexer and a converging lens. The body is provided with a first positioning groove, a second positioning groove, an accommodation groove, and a through hole. The accommodation groove communicates with the first and second positioning grooves and the through hole. A groove bottom of the first positioning groove communicates with a groove bottom of the second positioning groove. The adapter is connected to the body and disposed corresponding to the through hole. When the two light-emitting assemblies are installed in the first and second positioning grooves, each light-emitting chip of each light-emitting assembly emits beams towards the accommodation groove to make the multiplexer disposed at the bottom of the accommodation groove combine the beams into one beam. The converging lens is disposed in the through hole to converge the one beam on the adapter.

Abstract: Disclosed is an optical emission assembly including a heat dissipation base, an adapter, a light-emitting assembly, a multiplexer, a cooling chip, a converging lens, a housing, and a heat-conducting glue. The heat dissipation base includes a first heat dissipation plate and a second heat dissipation plate forming a T-shaped or an L-shaped structure. The light-emitting assembly and the multiplexer are disposed on the second heat dissipation plate. The multiplexer combines light beams emitted by light-emitting chips of the light-emitting assembly into one light beam, and then the one light beam enters the adapter through the converging lens. The cooling chip is disposed on the first heat dissipation plate. The heat dissipation base and the cooling chip are disposed in the housing, and the cooling chip corresponds to a through hole of the housing. The heat-conducting glue is filled in the through hole and between the cooling chip and the housing.

Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.

Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: A scene-based beam generation method for ground-to-air coverage based on convex polygon subdivision is provided and includes: obtaining a collection of base station positions by using a method of universal transverse mercator projection; constructing a three-dimensional (3D) low altitude signal coverage area; performing convex polygon subdivision on the area to be covered; and generating a beam configuration of each base station. The method realizes generation of beam configurations of base stations in the 3D low altitude signal coverage area, overcomes a problem that the existing 17 kind of scene-based beams cannot realize the coverage of 3D area, overcomes a problem of mismatch between network state information and beam configuration caused by dynamic adjustment of beam configurations. The beam configurations generated by the method does not need to obtain the number of users in real time to adjust the beam, and has a good coverage ability.

Abstract: A large-scale network node simulation method based on Linux container is provided, which solves problems of low packet transmission efficiency and multi-thread creation in real-time simulation in a large-scale network scenario. The method includes: scheduling all container nodes in a scenario; managing, by a container node, a dynamic thread through an idle thread management queue, and setting a finite state machine and a function pointer for the dynamic thread; registering, by a source container node, an output queue with a next-hop container node, and informing the next-hop container node to allocate a dynamic thread for receiving and processing the output queue. Packet transmission is realized between the container nodes through data units created in a shared memory. The sending thread and the receiving thread dynamically adjust the number of dynamic threads by checking the state of the output queue.

Abstract: An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.