Patents by Inventor Min SHENG

Min SHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978392
    Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: May 7, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Min-Yang Chiu, Yu-Sheng Ma, Jin-Yi Lin, Hsuan-Yu Chen, Jhih-Siou Cheng, Chun-Fu Lin
  • Publication number: 20240147606
    Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.
    Type: Application
    Filed: September 14, 2023
    Publication date: May 2, 2024
    Applicant: Innolux Corporation
    Inventors: Mu-Fan Chang, Yi-Hua Hsu, Hung-Sheng Liao, Min-Hsin Lo, Ming-Chun Tseng, Ker-Yih Kao
  • Publication number: 20240135184
    Abstract: Aspects of the disclosure provide an evolutionary neural architecture search (ENAS) method. For example, the ENAS method can include steps (a) performing one or more evolutionary operations on an initial population of neural architectures to generate offspring neural architectures, (b) evaluating performance of each of the offspring neural architectures to obtain at least one evaluation value of the offspring neural architecture with respect to a performance metric, (c) adjusting the evaluation values of the offspring neural architectures based on at least one constraint on the evaluation values, (d) selecting at least one of the offspring neural architectures as a new population of neural architectures, and (e) outputting the new population of neural architectures as a last population of neural architectures when a stopping criterion is achieved, or (f) iterating steps (a) to (d) with the new population of neural architectures being taken as the initial population of neural architectures.
    Type: Application
    Filed: October 5, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yun-Chan TSAI, Min-Fong HORNG, Chia-Hsiang LIU, Cheng-Sheng CHAN, ShengJe HUNG
  • Publication number: 20240098953
    Abstract: This application discloses electromagnetic energy mitigation assemblies and automotive vehicle components comprising the electromagnetic energy mitigation assemblies. An electromagnetic energy mitigation assembly includes a first electrically conductive layer and a second electrically conductive layer. First and second permalloy layers are along respective first and second opposite sides of the first electrically conductive layer. Third and fourth permalloy layers are along respective third and fourth opposite sides of the second electrically conductive layer. An electromagnetic noise suppression layer is sandwiched between the second and third permalloy layers. An automotive vehicle component includes an electromagnetic energy mitigation assembly configured to be positioned relative to one or more batteries of an automotive vehicle for providing electromagnetic shielding for the one or more batteries. The electromagnetic energy mitigation assembly includes a first electrically conductive layer.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 21, 2024
    Inventors: Tsang-I TSAI, Yunxi SHE, Dong-Xiang LI, Jie-Sheng CHEN, Min-Wei HSU
  • Publication number: 20240071536
    Abstract: A memory bit cell includes a first memory cell including a first antifuse transistor and a first selection transistor, the first antifuse transistor being selectable between a first state or a second state in response to a word line program signal, the first selection transistor being configured to provide access to the first antifuse transistor in response to a word line read signal; a second memory cell including a second antifuse transistor and a second selection transistor, the second antifuse transistor being selectable between the first state or the second state in response to the word line program signal, the second selection transistor being configured to provide access to the second antifuse transistor in response to the word line read signal; a first word line to selectively provide the word line program signal; a second word line to selectively provide the word line read signal; and a bit line.
    Type: Application
    Filed: August 10, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Sheng Chang, Yao-Jen Yang, Min-Shin Wu
  • Publication number: 20240071963
    Abstract: A semiconductor device assembly is provided. The assembly includes a package substrate which has a tunneled interconnect structure. The tunneled interconnect structure has a solder-wettable surface, an interior cavity, and at least one microvia extending from the surface to the cavity. The assembly further includes a semiconductor device disposed over the substrate and a solder joint coupling the device and the substrate. The joint comprises the solder between the semiconductor device and the interconnect structure, which includes the solder on the surface, the solder in the microvia, and the solder within the interior cavity.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Inventors: Yun Ting Hsu, Chong Leong Gan, Min Hua Chung, Yung Sheng Zou
  • Patent number: 11915512
    Abstract: A three-dimensional sensing system includes a plurality of scanners each emitting a light signal to a scene to be sensed and receiving a reflected light signal, according to which depth information is obtained. Only one scanner executes transmitting corresponding light signal and receiving corresponding reflected light signal at a time.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: February 27, 2024
    Assignee: Himax Technologies Limited
    Inventors: Ching-Wen Wang, Cheng-Che Tsai, Ting-Sheng Hsu, Min-Chian Wu
  • Publication number: 20240004150
    Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.
    Type: Application
    Filed: December 5, 2022
    Publication date: January 4, 2024
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventors: QianBing YAN, Min-Sheng KAO, ChunFu WU, Yueh-Kuo LIN, LinChun LI, Chung-Hsin FU
  • Publication number: 20230333317
    Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.
    Type: Application
    Filed: December 22, 2022
    Publication date: October 19, 2023
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventors: Chung-Hsin FU, Min-Sheng KAO, ChunFu WU, Yi-Tseng LIN, Chih-Wei YU, Chien-Tzu WU, QianBing YAN, Yueh-Kuo LIN
  • Patent number: 11778487
    Abstract: A scene-based beam generation method for ground-to-air coverage based on convex polygon subdivision is provided and includes: obtaining a collection of base station positions by using a method of universal transverse mercator projection; constructing a three-dimensional (3D) low altitude signal coverage area; performing convex polygon subdivision on the area to be covered; and generating a beam configuration of each base station. The method realizes generation of beam configurations of base stations in the 3D low altitude signal coverage area, overcomes a problem that the existing 17 kind of scene-based beams cannot realize the coverage of 3D area, overcomes a problem of mismatch between network state information and beam configuration caused by dynamic adjustment of beam configurations. The beam configurations generated by the method does not need to obtain the number of users in real time to adjust the beam, and has a good coverage ability.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: October 3, 2023
    Assignee: XIDIAN UNIVERSITY
    Inventors: Junyu Liu, Min Sheng, Songtao Lei, Ziye Zhang, Yan Shi, Yu Su, Jiandong Li
  • Publication number: 20230216806
    Abstract: A large-scale network node simulation method based on Linux container is provided, which solves problems of low packet transmission efficiency and multi-thread creation in real-time simulation in a large-scale network scenario. The method includes: scheduling all container nodes in a scenario; managing, by a container node, a dynamic thread through an idle thread management queue, and setting a finite state machine and a function pointer for the dynamic thread; registering, by a source container node, an output queue with a next-hop container node, and informing the next-hop container node to allocate a dynamic thread for receiving and processing the output queue. Packet transmission is realized between the container nodes through data units created in a shared memory. The sending thread and the receiving thread dynamically adjust the number of dynamic threads by checking the state of the output queue.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 6, 2023
    Inventors: Yan SHI, Min SHENG, Qixuan CAO, Jiandong LI, Weigang BAI, Di ZHOU, Haoran LI, Yan ZHU, Feng DING, Lianwei ZHOU
  • Publication number: 20230161121
    Abstract: An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.
    Type: Application
    Filed: July 6, 2022
    Publication date: May 25, 2023
    Applicant: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: Yi-Tseng LIN, Chih-Wei YU, Chien-Tzu WU, Kuen-Da JENG, Min-Sheng KAO
  • Publication number: 20230146215
    Abstract: A scene-based beam generation method for ground-to-air coverage based on convex polygon subdivision is provided and includes: obtaining a collection of base station positions by using a method of universal transverse mercator projection; constructing a three-dimensional (3D) low altitude signal coverage area; performing convex polygon subdivision on the area to be covered; and generating a beam configuration of each base station. The method realizes generation of beam configurations of base stations in the 3D low altitude signal coverage area, overcomes a problem that the existing 17 kind of scene-based beams cannot realize the coverage of 3D area, overcomes a problem of mismatch between network state information and beam configuration caused by dynamic adjustment of beam configurations. The beam configurations generated by the method does not need to obtain the number of users in real time to adjust the beam, and has a good coverage ability.
    Type: Application
    Filed: May 25, 2022
    Publication date: May 11, 2023
    Inventors: Junyu Liu, Min Sheng, Songtao Lei, Ziye Zhang, Yan Shi, Yu Su, Jiandong Li
  • Publication number: 20230122313
    Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.
    Type: Application
    Filed: August 10, 2022
    Publication date: April 20, 2023
    Applicant: Dongguan Luxshare Technologies Co., Ltd
    Inventors: Min-Sheng KAO, ChunFu WU, Chung-Hsin FU, QianBing YAN, LinChun LI, Chih-Wei YU, Chien-Tzu WU, Yi-Tseng LIN
  • Patent number: 11560271
    Abstract: An electronic smoking device includes a liquid supply (34) and an atomizer in a housing. The liquid supply (34) includes at least two container members (34a, 34b) attachable to one another through a connection mechanism to form a liquid supply main body. Each of the container members (34a, 34b) may have an outlet (341a, 341b) sealed by a sealing member (342a, 342b) and a second end which is closed, and an aerosol channel (343a, 343b) formed between the container members.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: January 24, 2023
    Inventor: Min Sheng
  • Publication number: 20220353742
    Abstract: Hierarchical network operation and resource control system and method for a mega satellite constellation, belonging to the field of spatial information technology, are provided. The hierarchical network operation and resource control system includes a service layer, a global organization layer, a local coordination layer and a resource layer. The service layer is used as an input to drive operation of whole system. The global organization layer is to realize “operation, measurement and control” integrated control and decision of whole network. The local coordination layer is to realize local management decision and management slice generation. The resource layer is to provide physical resource and physical device and realize resource virtualization.
    Type: Application
    Filed: April 19, 2022
    Publication date: November 3, 2022
    Inventors: Min SHENG, Di ZHOU, Sijing JI, Weigang BAI, Jiandong LI, Yan SHI, Haoran LI
  • Publication number: 20220345967
    Abstract: Lightweight inter-satellite handover device and method for a mega LEO satellite network are provided. An attribute extraction sub-module extracts attributes of handover users in a user information storage unit. Based on the attributes of the handover users, a cluster sub-module clusters the handover users into user clusters. A decision set generator sub-module generates target satellite sets of the user clusters, determines each target satellite of the target satellite sets of the user clusters of each LEO satellite whether belongs to LEO satellites in a management domain of a handover decision point of managing the LEO satellite based on management domain information in a LEO satellite information storage unit, and if YES, performing inter-satellite handover by a centralized decision unit, otherwise performing inter-satellite handover by a distributed decision unit.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 27, 2022
    Inventors: Min SHENG, Di ZHOU, Liuying WANG, Sijing JI, Jiandong LI, Weigang BAI, Yan SHI, Haoran LI
  • Patent number: 11365750
    Abstract: A tray-type fan impeller structure includes a plate body annularly disposed around a hub. The plate body has a connection side connected with the hub and a free side extending in a direction away from the hub. Multiple boss bodies are arranged on a top face or the top face and a bottom face of the plate body at intervals. By means of the boss bodies, the periodical noise problem caused by the conventional blades is improved.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: June 21, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Te-Chung Wang, Ming-Che Lee, Min-Sheng Cheng, Liang-Hsuan Yeh
  • Patent number: 11326616
    Abstract: A disk-shaped fan impeller structure includes a plate body having an inner rim and an outer rim. The inner rim is connected with a hub via multiple connection members. The outer rim extends in a direction away from the hub. The connection members are annularly disposed on outer circumference of the hub at intervals to radially extend toward the inner rim of the plate body. A top face and a bottom face are defined between the inner rim and outer rim. Multiple upper boss bodies are arranged on the top face at intervals. Multiple first gaps are distributed between the upper boss bodies. By means of the boss bodies, the periodical noise problem of the conventional fan impeller can be improved.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: May 10, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Te-Chung Wang, Ming-Che Lee, Min-Sheng Cheng, Liang-Hsuan Yeh
  • Publication number: 20220110045
    Abstract: A method for enhancing network coverage based on adaptive generation of resource cell. A traditional cell in a network is taken as an initial state of the network. A correlation matrix in a current network state is generated. Whether |?i,jt??i,jt-1|/?i,jt-1>? is determined. Each access point is divided into a plurality of resource cells. A CU-DU network mapping table is generated. A middlehaul link of each of the plurality of resource cells is constructed according to the CU-DU network mapping table.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 7, 2022
    Inventors: Junyu LIU, Min SHENG, Ziwen XIE, Jiandong LI, Yu SU, Yan SHI, Xiayu ZHANG