Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.

Abstract: A D-type screwing assembly for furniture contains a retaining member including a hole defined in the retaining member, with a plurality of ribs defined on two sides of the retaining member, and with a slot formed on a top end of the retaining member. A screw member includes at least two orifices defined on a head end of the screw member and a thread section formed on the screw member to screw with the hole of the retaining member. A rotary member includes at least two posts extending outwardly from a front end of the rotary member, with a number of the at least two posts corresponding to that of the at least two orifices of the screw member, so that the at least two posts of the rotary member are fitted into the at least two orifices of the screw member correspondingly.

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract: An apparatus with dehumidification and defrosting abilities comprises a compressor, an indoor heat exchanger, an outdoor heat exchanger, a four-way valve and a means for refrigerant flow controlling. The compressor is coupled to the four-way valve. The four-way valve is coupled to the outdoor heat exchanger. The indoor heat exchanger is coupled to the four-way valve. The means for refrigerant flow controlling is respectively coupled to the indoor heat exchanger, the outdoor heat exchanger and the four way valve, to control mixing a low-temperature refrigerant and a high-temperature before flowing into the indoor heat exchanger, or to control mixing a low-temperature refrigerant and a high-temperature refrigerant before flowing into the compressor, or control mixing a low-temperature refrigerant and a high-temperature refrigerant before flowing into the outdoor heat exchanger.

Abstract: The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

Abstract: The present invention relates to a biodegradable carrier for carrying a radioisotope, which is formed from at least one biodegradable polymer selected from the group consisting of poly(lactic-co-glycolic acid) (PLGA), poly(lactic acid) (PLA), poly(?-caprolactone) (PCL), chitosan, poly(?-glutamic acid) (PGA), and polyethylene glycol (PE) in which its hydroxyl group is substituted with an amino group and grafted with tetraazocyclododecanetetraacetic acid monosuccinimide ester (DOTA-NHS), in which nitrogen atoms contained in the DOTA-NHS are provided for coordinating with a radioisotope. The present invention also relates to a kit which includes a first container containing the biodegradable carrier for carrying a radioisotope according to the present invention and a second container containing a radioisotope.

Abstract: An automatic image-capturing system is used for capturing an image and transmitting the image to a remote device. The automatic image-capturing system includes a photography module for capturing the image; a storage module for storing the image captured by the photography module; a transmission module for receiving a control instruction sent by the remote device; a master core module for making the photography module to capture the image based on the control instruction, and segmenting the image into a plurality of files and segmenting the files into a plurality of packets to be transmitted to the remote device by the transmission module, and a slave core module for monitoring the operations of the master core module to turn off and restart the master core module when there is an abnormal operation in the master core module.

Abstract: A chip card ejecting mechanism includes a main body, a tray assembled in the main body and configured to receive a chip card, and a door. The door includes a rotating end rotatably mounted on the main body and a push pole protruding from the rotating end. A resisting portion is located on an end of the push pole away from the rotating end. When the door is opened and the rotating end is rotated relative to the main body, the resisting portion resists against the chip card and drives the chip card to move out from the main body.

Abstract: Verifying text translation in a program including obtaining a first program integrated information (PII) file and a second PII file of text in the program. An original page is generated by using the first PII file. Document object model (DOM) tree information of the original page is obtained. For each text unit in the original page: identification information corresponding to a first text unit in the first PII file is extracted; a second text unit is identified in the second PII file using the extracted identification information and a relationship between the identification information and the second text unit; and the first text unit is replaced in the DOM tree with the second text unit. A new page is generated using the text units from the second PII file.

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract: The present invention relates to novel carbazole derivatives and an organic light-emitting diode device using the same. These carbazole derivatives can simultaneously or singly be used as a hole transporting layer, a host or guest of an emitting layer or an electron transporting layer of an organic light-emitting diode device.

Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.

Abstract: The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A first conductive terminal and a second conductive terminal are each disposed below the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.

Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.

Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.

Abstract: The present disclosure involves a light-emitting diode (LED) packaging structure. The LED packaging structure includes a submount having a substrate and a plurality of bond pads on the substrate. The LED packaging structure includes a plurality of p-type LEDs bonded to the substrate through a first subset of the bond pads. The LED packaging structure includes a plurality of n-type LEDs bonded to the substrate through a second subset of the bond pads. Some of the bond pads belong to both the first subset and the second subset of the bond pads. The p-type LEDs and the n-type LEDs are arranged as alternating pairs. The LED packaging structure includes a plurality of transparent and conductive components each disposed over and electrically interconnecting one of the pairs of the p-type and n-type LEDs. The LED packaging structure includes one or more lenses disposed over the n-type LEDs and the p-type LEDs.