Abstract: A semiconductor device includes an alignment data generation circuit aligning first and second latch data generated from a first group of input data in synchronization with a first internal strobe signal, outputting the aligned first and second latch data as first alignment data, aligning a first and second latch data generated from a second group of the input data in synchronization with a second internal strobe signal, and outputting the aligned first and second latch data as second alignment data. The semiconductor device includes a write data generation circuit generating first and second write data from the first and second alignment data in synchronization with a latch clock after the start of a first operation mode and generating the first and second write data from the first alignment data in synchronization with the latch clock after the start of a second operation mode.

Abstract: A semiconductor device includes an alignment data generation circuit aligning first and second latch data generated from a first group of input data in synchronization with a first internal strobe signal, outputting the aligned first and second latch data as first alignment data, aligning a first and second latch data generated from a second group of the input data in synchronization with a second internal strobe signal, and outputting the aligned first and second latch data as second alignment data. The semiconductor device includes a write data generation circuit generating first and second write data from the first and second alignment data in synchronization with a latch clock after the start of a first operation mode and generating the first and second write data from the first alignment data in synchronization with the latch clock after the start of a second operation mode.

Abstract: A memory may include a data transmission/reception circuit and a memory bank including a plurality of cell arrays. When a metadata mode is activated, data and metadata received through the data transmission/reception circuit may be distributed to and stored in the plurality of cell arrays. When the metadata mode is deactivated, the data received through the data transmission/reception circuit may be distributed to and stored in cell arrays except one or more no-access cell arrays, among the plurality of cell arrays.

Abstract: A memory module may include a management bus and a plurality of memories connected in series and connected to the management bus, each of the plurality of memories including an identification (ID) input terminal and an ID output terminal. Among the plurality of memories, a memory, for which an activation signal is applied to an ID input terminal of the memory, may set an ID for the memory in response to ID setting information transmitted on the management bus.

Abstract: A memory may include multiple rows each coupled to multiple memory cells; a target row classification circuit suitable for classifying, as a target row, a row, among the multiple rows, that is susceptible to data loss as a result of activity of an adjacent row; and a target row signal generation circuit suitable for sequentially activating a target row active signal for activating the target row and a target row precharge signal for precharging the target row in response to a precharge command.

Abstract: The present invention relates to a thiobenzimidazole derivative or a pharmaceutically acceptable salt thereof, and a composition for preventing or treating cancer, comprising the derivative as an active ingredient. The thiobenzimidazole derivative of the present invention exhibits cell toxicity by blocking the cell cycle of a cancer cell and inducing apoptosis when administered to an individual, as the derivative inhibits tubulin polymerization by being activated in the cancer cell, and, thus, the derivative can be used for prevention or treatment of cancer, desirably for prevention or treatment of triple-negative breast cancer.

Abstract: A semiconductor device includes an alignment data generation circuit aligning first and second latch data generated from a first group of input data in synchronization with a first internal strobe signal, outputting the aligned first and second latch data as first alignment data, aligning a first and second latch data generated from a second group of the input data in synchronization with a second internal strobe signal, and outputting the aligned first and second latch data as second alignment data. The semiconductor device includes a write data generation circuit generating first and second write data from the first and second alignment data in synchronization with a latch clock after the start of a first operation mode and generating the first and second write data from the first alignment data in synchronization with the latch clock after the start of a second operation mode.

Abstract: A memory device includes a memory cell array and a peripheral circuit. The memory cell array includes a plurality of memory regions each identified by a row address and a column address. The peripheral circuit accesses the memory cell array by performing, based on an address, a burst length and a burst address gap provided from a memory controller, a burst operation supporting a variable burst address gap. The burst address gap is a numerical difference between adjacent column addresses, on which the burst operation is to be performed.

Abstract: A memory device includes a memory cell array and a peripheral circuit. The memory cell array includes a plurality of memory regions each identified by a row address and a column address. The peripheral circuit accesses the memory cell array by performing, based on an address, a burst length and a burst address gap provided from a memory controller, a burst operation supporting a variable burst address gap. The burst address gap is a numerical difference between adjacent column addresses, on which the burst operation is to be performed.

Abstract: A memory may include multiple rows each coupled to multiple memory cells; a target row classification circuit suitable for classifying, as a target row, a row, among the multiple rows, that is susceptible to data loss as a result of activity of an adjacent row; and a target row signal generation circuit suitable for sequentially activating a target row active signal for activating the target row and a target row precharge signal for precharging the target row in response to a precharge command.

Abstract: Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

Abstract: A memory may include multiple rows each coupled to multiple memory cells; a target row classification circuit suitable for classifying, as a target row, a row, among the multiple rows, that is susceptible to data loss as a result of activity of an adjacent row; and a target row signal generation circuit suitable for sequentially activating a target row active signal for activating the target row and a target row precharge signal for precharging the target row in response to a precharge command.

Abstract: An electronic device includes an enable signal generation circuit configured to activate, when a write operation is performed, a termination enable signal earlier than a time point when a write latency elapses, by a duration amount of an entry offset period; and a data input and output circuit configured to receive, when the write operation is performed, data later than the time point when the write latency elapses, based on the termination enable signal, wherein the data input and output circuit receives the data after the write latency elapses by a duration amount of a first data reception delay period.

Abstract: A memory device includes a memory cell array and a peripheral circuit. The memory cell array includes a plurality of memory regions each identified by a row address and a column address. The peripheral circuit accesses the memory cell array by performing, based on an address, a burst length and a burst address gap provided from a memory controller, a burst operation supporting a variable burst address gap. The burst address gap is a numerical difference between adjacent column addresses, on which the burst operation is to be performed.

Abstract: An electronic device includes an enable signal generation circuit configured to activate, when a write operation is performed, a termination enable signal earlier than a time point when a write latency elapses, by a duration amount of an entry offset period; and a data input and output circuit configured to receive, when the write operation is performed, data later than the time point when the write latency elapses, based on the termination enable signal, wherein the data input and output circuit receives the data after the write latency elapses by a duration amount of a first data reception delay period.

Abstract: A lead (Pb)-free, and silver (Ag)-free solder alloy includes a primary metallic element in a content of about 1.1 wt % to about 1.9 wt %, nickel(Ni) in a content of about 0.02 wt % to about 0.09 wt %, copper (Cu) in a content of about 0.2 wt % to about 0.9 wt %, and tin (Sn) and other unavoidable impurities in remaining balance, wherein the primary metallic element is at least one selected from the group including bismuth (Bi), chromium (Cr), indium (In), antimony (Sb), silicon (Si) and zinc (Zn).

Abstract: A semiconductor system includes a semiconductor device and a controller. The semiconductor device includes a first memory rank and is configured to perform, in response to receiving a first write command, a first write operation of writing first data to the first memory rank. The semiconductor device includes a second memory rank and is configured to perform, in response to receiving a second write command, a second write operation of writing second data to the second memory rank. The controller is configured to receive at least one write request and responsively generate the first and second write commands separated in time so that a transition time interval between generation of the first write command and generation of the second write command is based on the second memory rank being different from the first memory rank and based on a comparison of a write preamble period to a write post-amble period.

Abstract: A semiconductor device includes an internal command pulse generation circuit and a sense data generation circuit. The internal command pulse generation circuit is configured to generate an internal command pulse based on a write signal, a latency code, and an offset code. The sense data generation circuit is configured to generate a sense data based on the internal command pulse and an internal data strobe signal and configured to generate the sense data based on the internal command pulse and a delayed strobe signal.

Abstract: A semiconductor package of a pin-grid-array type includes a bump pad on a first substrate, a metal socket on a second substrate, a core material for reverse reflow on the bump pad, and solder paste or a solder bump forming a solder layer on the core material for reverse reflow. The solder paste or the solder bump is in contact with the bump pad. The core material for reverse reflow and the solder paste or the solder bump bonded to the core material for reverse reflow are used as a pin and detachably attached to the metal socket. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.

Abstract: Provided is a semiconductor package including a first bump pad on a first substrate, a second bump pad on a second substrate, a core material for reverse reflow between the first bump pad and the second bump pad, and a solder member forming a solder layer on the core material for reverse reflow. The solder member is in contact with the first bump pad and the second bump pad. Each of a first diameter of the first bump pad and a second diameter of the second bump pad is at least about 1.1 times greater than a third diameter of the core material for reverse reflow. The core material for reverse reflow includes a core, a first metal layer directly coated on the core, and a second metal layer directly coated on the first metal layer.