Patents by Inventor Mineo Nomoto

Mineo Nomoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8659761
    Abstract: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: February 25, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Yasuhiro Yoshitake, Mineo Nomoto
  • Patent number: 8629985
    Abstract: A displacement measurement method, an apparatus thereof, and a probe microscope. which enable stable measure an amount of displacement and a moving distance of an object under measurement with an accuracy of the sub-nanometer order or below without being affected by disturbances such as fluctuations of air and mechanical vibration. A pulsed beam is split into two; one beam is reflected by an object under measurement and then inputted to a delay optical path equivalent to one pulse period; and the other beam is sent through the same delay optical path in the opposite direction up to the object under measurement with a delay of one pulse period, and then reflected by the object under measurement. An optical phase variation caused by the movement of the object under measurement is obtained by subjecting the two pulsed beams to interference.
    Type: Grant
    Filed: September 6, 2012
    Date of Patent: January 14, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Mineo Nomoto
  • Publication number: 20120327429
    Abstract: A displacement measurement method, an apparatus thereof, and a probe microscope. which enable stable measure an amount of displacement and a moving distance of an object under measurement with an accuracy of the sub-nanometer order or below without being affected by disturbances such as fluctuations of air and mechanical vibration. A pulsed beam is split into two; one beam is reflected by an object under measurement and then inputted to a delay optical path equivalent to one pulse period; and the other beam is sent through the same delay optical path in the opposite direction up to the object under measurement with a delay of one pulse period, and then reflected by the object under measurement. An optical phase variation caused by the movement of the object under measurement is obtained by subjecting the two pulsed beams to interference.
    Type: Application
    Filed: September 6, 2012
    Publication date: December 27, 2012
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Mineo Nomoto
  • Patent number: 8284406
    Abstract: The present invention provides a displacement measurement method, an apparatus thereof, a probe microscope. which make it possible to stably measure an amount of displacement and a moving distance of an object under measurement with an accuracy of the sub-nanometer order or below without being affected by disturbances such as fluctuations of air, mechanical vibration. Specifically, with the present invention, a pulsed beam is split into two; one beam is reflected by an object under measurement and then inputted to a delay optical path equivalent to one pulse period; and the other beam is sent through the same delay optical path in the opposite direction up to the object under measurement with a delay of one pulse period, and then reflected by the object under measurement. Then, an optical phase variation caused by the movement of the object under measurement is obtained by subjecting the two pulsed beams to interference.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: October 9, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Mineo Nomoto
  • Publication number: 20120062903
    Abstract: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.
    Type: Application
    Filed: November 22, 2011
    Publication date: March 15, 2012
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Yasuhiro Yoshitake, Mineo Nomoto
  • Patent number: 8064066
    Abstract: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: November 22, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Yasuhiro Yoshitake, Mineo Nomoto
  • Patent number: 7834353
    Abstract: A TFT device having a pixel portion and a driving circuit portion formed on a glass substrate; wherein at least the active layer (active region) of a transistor constituting said driving circuit comprises polycrystalline silicon including crystals that do not have crystal grain boundaries which cross the direction of current flow.
    Type: Grant
    Filed: January 29, 2008
    Date of Patent: November 16, 2010
    Assignee: Hitachi Displays, Ltd.
    Inventors: Mikio Hongo, Sachio Uto, Mineo Nomoto, Toshihiko Nakata, Mutsuko Hatano, Shinya Yamaguchi, Makoto Ohkura
  • Publication number: 20100039652
    Abstract: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.
    Type: Application
    Filed: October 23, 2009
    Publication date: February 18, 2010
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Yasuhiro Yoshitake, Mineo Nomoto
  • Patent number: 7612889
    Abstract: In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: November 3, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Yasuhiro Yoshitake, Mineo Nomoto
  • Publication number: 20090210971
    Abstract: The present invention provides a displacement measurement method, an apparatus thereof, a probe microscope. which make it possible to stably measure an amount of displacement and a moving distance of an object under measurement with an accuracy of the sub-nanometer order or below without being affected by disturbances such as fluctuations of air, mechanical vibration. Specifically, with the present invention, a pulsed beam is split into two; one beam is reflected by an object under measurement and then inputted to a delay optical path equivalent to one pulse period; and the other beam is sent through the same delay optical path in the opposite direction up to the object under measurement with a delay of one pulse period, and then reflected by the object under measurement. Then, an optical phase variation caused by the movement of the object under measurement is obtained by subjecting the two pulsed beams to interference.
    Type: Application
    Filed: August 9, 2006
    Publication date: August 20, 2009
    Inventors: Toshihiko Nakata, Masahiro Watanabe, Shuichi Baba, Mineo Nomoto
  • Patent number: 7498589
    Abstract: A scanning probe microscope for measuring a surface profile of a sample by bringing a probe into close proximity to or contact with the surface of the sample and scanning the sample surface includes: a sample stage movable in at least one axis direction; the probe which is brought into close proximity to or contact with the surface of the sample mounted on the sample stage and scans the sample surface; a probe-driving unit for moving the probe three-dimensionally; a probe deflection detector for detecting a deflection of the probe; and an observation optical system which has an objective lens and observes the probe disposed on substantially the optical axis of the objective lens, and the sample. The probe-driving unit is disposed with three sets of paired drive sources arranged essentially with symmetry with respect to the optical axis of the objective lens.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: March 3, 2009
    Assignee: Hitachi Kenki Fine Tech Co., Ltd.
    Inventors: Shigenobu Maruyama, Mineo Nomoto, Toru Kurenuma, Yuichi Kunitomo, Yukio Kembo
  • Publication number: 20080145517
    Abstract: A method for manufacturing a plasma display comprises: a phosphor painting process for painting phosphor layer in ribs formed on a back plate; and a phosphor inspection process that includes the steps of: irradiating the phosphor layer with ultraviolet light; preparing an imaging system so that the imaging system images the emitted light beam to acquire information on brightness; comparing the brightness information with correlation between a shape model of the phosphor layer and brightness signal information that have been obtained in advance; and obtaining a painted state of the phosphor layer painted in the ribs; and a process for feeding back the applied state of the phosphor layer, which has been obtained in the phosphor inspection process, to the phosphor painting process so that the manufacturing equipment is controlled in the phosphor painting process.
    Type: Application
    Filed: August 6, 2007
    Publication date: June 19, 2008
    Inventors: Hideaki SASAZAWA, Mineo Nomoto, Kouji Kashiwagi, Shigeru Saitou, Tomohiko Murase
  • Publication number: 20080121894
    Abstract: A TFT device having a pixel portion and a driving circuit portion formed on a glass substrate; wherein at least the active layer (active region) of a transistor constituting said driving circuit comprises polycrystalline silicon including crystals that do not have crystal grain boundaries which cross the direction of current flow.
    Type: Application
    Filed: January 29, 2008
    Publication date: May 29, 2008
    Inventors: Mikio HONGO, Sachio Uto, Mineo Nomoto, Toshihiko Nakata, Mutsuko Hatano, Shinya Yamaguchi, Makoto Ohkura
  • Patent number: 7336816
    Abstract: The present invention provides a bump shape measuring apparatus comprising an illumination optical system which illuminates bumps arranged on a board with illumination light of a low tilt angle to a surface of the board; a detection optical system where reflected light from the bumps is condensed for detection of image signals of the bumps by a high tilt angle to the surface of the board; an image processing unit where an outline of the tip and the base of each of the bumps is calculated based on the image signals of each of the bumps, and geometric characteristics including at least a position and height of each of the bumps are calculated based on the outline of the tip and the base of each of the bumps; and a main control unit where information on the calculated geometric characteristics of the bumps is displayed on a display unit.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: February 26, 2008
    Assignee: Hitachi Via Mechanics, Ltd.
    Inventors: Hideaki Sasazawa, Mineo Nomoto, Masatoshi Yamaga, Chikara Iwata, Masashi Uehara
  • Patent number: 7326623
    Abstract: Arrangements (e.g., methods) for manufacturing a display device, including irradiating an amorphous semiconductor film formed on a substrate with an excimer laser beam to convert the amorphous semiconductor film into a polycrystalline semiconductor film; and irradiating predetermined areas of the polycrystalline semiconductor film intermittently with a continuous wave laser beam while a position of the substrate with respect to the continuous wave laser beam is scanned, crystal grains larger than those of the polycrystalline semiconductor film other than the predetermined areas are formed in each of the predetermined areas locally in the polycrystalline semiconductor film, wherein first thin film transistors are formed in the predetermined areas while second thin film transistors are formed in the polycrystalline semiconductor film other than the predetermined areas thereof.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: February 5, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Mikio Hongo, Sachio Uto, Mineo Nomoto, Toshihiko Nakata, Mutsuko Hatano, Shinya Yamaguchi, Makoto Ohkura
  • Patent number: 7272253
    Abstract: An image input can be executed without any influence of physical conditions of an inspection object and environment such as installation area by utilizing a cordless type image pickup apparatus in the excellent portability combining a lighting apparatus to a digital camera. On the occasion of picking up an image of such inspection object, marks of the shape such as the rectangular shape, circular shape and linear line shape and marks of the shape combining the linear lines (plus sign (+), capital letter L or cross (+)) of known size are allocated within the same image and these marks are extracted simultaneously. Thereby, compensation process for the magnifying factor, position and tilt is conducted using the marks allocated in the image with the equal interval. Input data is continuously applied depending on the inspection object to generate a total inspection map by combining such input data.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: September 18, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Daisuke Katsuta, Mineo Nomoto, Tetsuo Taguchi, Masahiro Hotta, Isao Tanaka
  • Patent number: 7215807
    Abstract: The present invention relates to a method for inspecting a crack in a metal surface or the like, and, particularly, to an inspection method and apparatus for nondestructive inspection such as liquid penetrant inspection and magnetic particle testing. The present invention provides a flaw inspection method that essentially comprises the steps of illuminating a surface of a sample to be inspected, obtaining an image of the surface, characterizing a potential flaw on the inspected surface by processing the obtained image, displaying an image of the potential flaw, verifying that the potential flaw is a true flaw, and storing an image of the verified flaw in memory.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: May 8, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Mineo Nomoto, Daiske Katsuta, Toshio Asano, Kaoru Sakai, Tetsuo Taguchi, Isao Tanaka
  • Publication number: 20070041410
    Abstract: Apparatus for fabricating a display device includes a stage capable of mounting an insulating substrate of the display device and moving the insulating substrate, linear scales which detect a position or moving distance of the substrate, a laser oscillator which generates continuous-waves laser light, a modulator which turns ON/OFF the continuous-wave laser light, a beam forming optic which shapes the continuous-wave laser light passing through the modulator into a linear or rectangular form, an objective lens which projects the at least one of the laser light on the insulating substrate so as to irradiate the insulating substrate with the laser light.
    Type: Application
    Filed: October 27, 2006
    Publication date: February 22, 2007
    Inventors: Mikio Hongo, Sachio Uto, Mineo Nomoto, Toshihiko Nakata, Mutsuko Hatano, Shinya Yamaguchi, Makoto Ohkura
  • Patent number: 7129124
    Abstract: The active layer (active region) of the thin-film transistor making up the driver circuit is obtained by reformation implemented by scanning the continuous-wave laser light, condensed into a linear form or a rectangle form extremely longer in the longitudinal direction than in the transverse direction, along a given direction crossing the longitudinal direction. This is made up of a poly silicon film containing crystal grains having no grain boundaries crossing the direction of current flow, that is, a band-like polycrystalline silicon film. As a result, it is possible to implement a display device having stable and high quality active elements outside the display region on the insulating substrate.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: October 31, 2006
    Assignee: Hitachi Displays, Ltd.
    Inventors: Mikio Hongo, Sachio Uto, Mineo Nomoto, Toshihiko Nakata, Mutsuko Hatano, Shinya Yamaguchi, Makoto Ohkura
  • Patent number: 7119908
    Abstract: A manufacturing method and manufacturing device for high-precision thin film devices is disclosed, whereby the film thickness and film thickness distribution of a transparent film is measured to a high degree of accuracy during a CMP process without being affected by the film thickness distribution between LSI regions or within the semiconductor wafer surface generated by CMP processing. Film thickness is measured by specifying relatively level measurement regions, according to a characteristic quantity of the spectral waveform of the reflected light from the transparent film, such as the reflection intensity, frequency spectrum intensity, or the like, thereby permitting highly accurate control of film thickness. The leveling process in CMP processing can be optimized on the basis of the film thickness distribution. The film deposition conditions in the film deposition stage and the etching conditions in the etching stage can also be optimized.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: October 10, 2006
    Assignee: Hitachi, Ltd.
    Inventors: Mineo Nomoto, Takenori Hirose, Keiya Saito