Abstract: In order to be able to automatically define significant measurement points for measuring the film thickness of a transparent film on a circuit pattern buried under an optically transparent thin film, in a method for determining measurement points for measuring film thickness, whereby measurement points for measuring the film thickness of optically transparent thin film on a circuit pattern formed on a wafer beneath an optically transparent thin film, are determined automatically, light is irradiated onto the surface of the wafer, either intermittently or continuously, starting at a predetermined provisional reference measurement point in the region of a particular chip on the wafer, and following a predetermined path of travel in the vicinity of this provisional reference measurement point, the light reflected by the wafer is detected, and the measurement points for measuring film thickness are determined on the basis of spectral waveform data for the reflected light thus detected.

Abstract: An image input can be executed without any influence of physical conditions of an inspection object and environment such as installation area by utilizing a cordless type image pickup apparatus in the excellent portability combining a lighting apparatus to a digital camera. On the occasion of picking up an image of such inspection object, marks of the shape such as the rectangular shape, circular shape and linear line shape and marks of the shape combining the linear lines (plus sign (+), capital letter L or cross (+)) of known size are allocated within the same image and these marks are extracted simultaneously. Thereby, compensation process for the magnifying factor, position and tilt is conducted using the marks allocated in the image with the equal interval. Input data is continuously applied depending on the inspection object to generate a total inspection map by combining such input data.

Abstract: Laser sources output laser lights L1 and L2 having different wavelengths so as to increase an accuracy of an endpoint detection of polishing processing by enabling an accurate detection of a film thickness of a layer insulating film on a surface of a wafer to be polished by the CMP processing, the lights are emitted from a detection window via a beam splitter to the layer insulating film formed on the surface of the wafer to be polished by a pad, different optical detectors detect interference lights corresponding to the laser lights L1 and L2 reflected and generated from a surface of the layer insulating film and a pattern under the surface via the detection window, the beam splitter, and a dichroic mirror, the detection results are supplied to a film thickness evaluation unit 7, a film thickness of the layer insulation film is detected on the basis of a relationship between intensities of the reflected interference lights to the laser lights L1 and L2 or the intensity ratio, and an endpoint of polishing pro

Abstract: The object of the present invention is to establish a technology for directly evaluating polishing pad surface conditions, to allow high-precision CMP process management, and to improve process throughput. The pad surface is illuminated with light. The intensity of reflected light or fluorescence from the illuminated area or an intensity distribution image is used directly evaluate the pad surface condition. Based on the results of this evaluation, conditioning conditions for a conditioner are optimized, thus allowing high precision CMP processing while maintaining good pad surface conditions.

Abstract: A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short

Abstract: In order to detect a local shape defect on an inner surface of an ordinary plane member with a high degree of accuracy as a state distinguished from a big waviness deformation, a surface-shape-defect inspecting method and apparatus for identifying the shape defect on the inner surface of the plane member is provided. The method and apparatus provides for scanning optically the entire area of the plane member, extracting a shape of the surface of the plane member as absolute height displacement data at scanning positions, finding a difference between a reference surface shape inferred from the extracted shape of the surface of the plane member and the shape of the surface, and using the difference as relative height displacement data with respect to the reference surface shape, and detecting the shape defect on the surface by identifying the location of the shape defect through comparison of the relative height displacement data with predetermined allowable displacement.

Abstract: A temperature measuring method and apparatus for measuring temperature of at least one measuring point of a sample. At least one measuring point on a surface of a sample at least with a first light. A displacement of the at least one measuring point on the surface of the sample occurs from thermal expansion of the sample in response to the first light impinging thereon and a signal indicative of the displacement is produced. The temperature of the at least one measuring point of the sample is determined from the signal.

Abstract: A detected pattern is binarized, the binarized pattern is expanded, an image size is reduced while a connectivity of the expanded pattern is preserved and stored in a first memory. In turn, the binarized pattern is contracted, the image size is reduced while a connectivity of the contracted pattern is preserved and stored in a second memory. Then the expanded pattern is read out from the first memory and a connectivity of the pattern is selected. The contracted pattern is read out from the second pattern and the connectivity of the pattern is extracted. The selected connectivities are compared with the connectivity of a normal pattern to detect a non-coincidence. The circuit pattern having a short circuit or a semi-short circuit defect and a circuit pattern having an open circuit or a semi-open circuit defect are classified and selected in response to these non-coincidences.

Abstract: A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results.

Abstract: In an X-ray tomographic imaging system and method, an object to be inspected is irradiated with X-rays from an X-ray source to obtain an X-ray transmission image of the object. The X-ray transmission image is converted by an X-ray fluorescence image intensifier into a detection image. The intensity of the detection image is also intensified by the X-ray fluorescence image intensifier. A photo-electric converter converts the intensified detection image from the X-ray fluorescence image intensifier into an electrical signal. The object to be inspected is held by an object holder rotatably at a position in proximity to the X-ray source and movably in a direction of the axis of rotation of the object and a direction perpendicular to the rotation axis. The electrical signal from the photo-electric converter is processed to a cross-sectional image.

Abstract: Two kinds of image corresponding to a reference pattern and a pattern to be inspected are converted into binary images and local images cut out from the binary images are compared with each other to detect differences between the cut out images and recognize these differences as a defect. One of the main subjects of the inspecting method is to moderate excess sensitivity to the different portions to the extent of allowing non-serious actual defects. By setting don't care areas each of which consists of one pixel row neighboring on a binary boundary line in the image, and comparing the remaining portions of the images other than the don't care areas by logical processing it is possible to detect various defects without regarding the quantization error as a defect.

Abstract: An apparatus for testing printed wiring patterns for use in combination with an apparatus including a plurality of dedicated pattern generators for generating arcuate wiring patterns. In contrast to the conventional LSI pattern inspection effected with design data being inputted, the apparatus can inspect the pattern including curved portions peculiar to the printed wiring pattern. Although the conventional LSI inspection technique involves an impracticably increased amount of design data, the invention allows the test or inspection to be performed at a high speed with an improved reliability and can be applied to the inspection of any pattern including arcuate patterns. By inputting graphic data in conformance with the order for generating patterns, pattern generation can be accomplished not only through ordinary raster scan but also by other various scanning methods.

Abstract: A pattern checking apparatus carries out the detection of candidate defects through a primary selection with a sensitivity high enough to detect any existing defect, and then carries out a detailed analysis by a controlling processor for a pattern including the periphery of the detected candidate defect through a secondary selection in which a candidate defect which is not a defect in a practical sense is removed from candidates, so that only real defects are detected.

Abstract: A projecting apparatus for forming an image of a mask on a wafer by a projector of a unit magnification reflection system having a concave spherical mirror and a convex spherical mirror. The distance from the projector to the mask or the upper side of a mask holder for holding the mask and the distance from the projector to the wafer are measured. An error of the image-forming position is computed from the distance measurements. At least one of the mask, the wafer and the projector is moved along the direction of projection in a manner to eliminate the error of the image-forming position computed, thus attaining automatic focus adjustment.

Abstract: A light exposure device and method for exposing and printing a predetermined pattern on an exposure surface of a substrate comprises measuring means for measuring curvature of the exposure surface of the substrate, a chuck including suck and hold means for sucking and holding a back surface of the substrate opposite to the exposure surface and deforming means for imparting a force to the back surface of the substrate to deform the substrate, and control means for controlling the deforming means of the chuck in accordance with the curvature of the exposure surface of the substrate measured by the measuring means such that the exposure surface of the substrate conforms to an image surface of the pattern over an entire exposure area within a predetermined allowable error.