Patents by Inventor Ming An

Ming An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230401098
    Abstract: Approaches presented herein enable provisional scheduling of resources in a cloud computing environment. More specifically, a first group request to host an application is obtained. This first group request includes one or more virtual units, which each have one or more topological constraints. One or more resources are scheduled for each of the virtual units. This scheduling includes provisionally allocating the resources to each of the virtual units according to the topological constraints. Each resource comprises a respective weight. In response to obtaining a second group request, the resources are provisionally re-allocated to one or more virtual units of the second group request according to one or more topological constraints of the second group request and the respective weight of each of the resources. This re-allocating minimizes a summation of each respective weight of the resources. A new respective weight is then assigned to each of the resources.
    Type: Application
    Filed: December 6, 2022
    Publication date: December 14, 2023
    Inventors: Asser Nasreldin Tantawi, Ming-Hung Chen, Pavlos Maniotis, Claudia Misale, Laurent Schares, Seetharami R. Seelam, Hao Yu
  • Publication number: 20230401478
    Abstract: A method for performing at least a portion of a computational process includes computing a pulse function of a pulse to be applied to a first pair of trapped ions in a first ion chain based on a phase-space condition, wherein the phase-space condition is derived using equi-spaced synthetic frequencies in a frequency interval that includes a range set by a highest and a lowest motional mode frequency of the first ion chain, generating the pulse based on the computed pulse function, and applying the generated pulse to each of a second pair of trapped ions in a second ion chain to perform an entangling gate operation between the second pair of trapped ions in the second ion chain.
    Type: Application
    Filed: October 21, 2022
    Publication date: December 14, 2023
    Inventors: Reinhold BLÜMEL, Nikodem GRZESIAK, Ming LI, Andrii MAKSYMOV, Yunseong NAM
  • Publication number: 20230402109
    Abstract: Technology is disclosed herein for open block boundary group programming of non-volatile memory such as NAND. The open block boundary group could potentially be read in response to a request from a host for the data stored in the group. In an aspect, the memory system will determine whether programming a group of memory cells in a selected block will result in an open block. If it will not result in an open block, then the memory system uses a first set of programming parameters to program the group. However, if it will result in an open block then the memory system uses a second set of programming parameters to program the boundary group. The programming parameters may include verify levels and/or a program voltage step size. The second set of programming parameters can tighten Vt distributions, which mitigates mis-reads if the boundary group is read.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 14, 2023
    Applicant: Western Digital Technologies, Inc.
    Inventors: Ke Zhang, Ming Wang, Liang Li
  • Publication number: 20230399710
    Abstract: Various embodiments include processes for purifying and/or preparing iron-bearing materials. Various embodiments include purification and/or preparation of iron ores, iron, and their intermediates. Various embodiments include processes for purifying iron-bearing materials comprising leaching one or more soluble species of impurities out of iron-bearing materials using a leaching solution comprising fluorine.
    Type: Application
    Filed: February 6, 2023
    Publication date: December 14, 2023
    Inventors: Michael Andrew GIBSON, Danielle Cassidy SMITH, Yet-Ming CHIANG, Kjell William SCHRODER, Olivia Claire TAYLOR, Vincent Chevrier
  • Publication number: 20230402404
    Abstract: Devices and method for forming a chip package structure including a package substrate, a fan-out package attached to the package substrate, a first adhesive layer attached to a top surface of the package substrate, a beveled stiffener structure attached to the package substrate and surrounding the fan-out package, the beveled stiffener structure comprising at least one tapered sidewall, in which a first width of a top portion of the beveled stiffener structure along the at least one tapered sidewall is greater than a second width of a bottom portion of the beveled stiffener structure along the at least one tapered sidewall, and in which the bottom portion is in contact with a top surface of the first adhesive layer.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 14, 2023
    Inventors: Chia-Kuei Hsu, Ming-Chih Yew, Li-Ling Liao, Shin-Puu Jeng
  • Publication number: 20230402384
    Abstract: Material properties of graphene can be leveraged to improve performance of interconnects in an integrated circuit. One way to circumvent challenges involved in depositing graphene onto a copper surface is to incorporate graphene into the bulk metal layer to create a hybrid metal/graphene interconnect structure. Such a hybrid structure can be created instead of, or in addition to, forming a graphene film on the metal surface as a metal capping layer. A first method for embedding graphene into a copper damascene layer is to alternate the metal fill process with graphene deposition to create a composite graphene matrix. A second method is to implant carbon atoms into a surface layer of metal. A third method is to disperse graphene flakes in a damascene copper plating solution to create a distributed graphene matrix. Any combination of these methods can be used to enhance conductivity of the interconnect.
    Type: Application
    Filed: June 8, 2022
    Publication date: December 14, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jian-Hong LIN, Yinlung LU, Jun HE, Hsuan-Ming HUANG, Hsin-Chun CHANG
  • Publication number: 20230403046
    Abstract: A millimeter wave communication apparatus includes: an electronic device, including a first waveguide connection port disposed on a casing of the electronic device, and a millimeter wave communication module connected to the first waveguide connection port to transmit and receive millimeter-wave signals; and an expansion device, installed on a carrier, and including a second waveguide connection port disposed on a casing of the expansion device and corresponding to a position of the first waveguide connection port of the electronic device, and at least one millimeter-wave antenna connected to the second waveguide connection port to transmit and receive the millimeter-wave signals. When the electronic device is fastened on the expansion device, the first waveguide connection port and the second waveguide connection port form a waveguide to transmit and receive the millimeter-wave signals. Therefore, attenuation of the millimeter-wave signals is avoided.
    Type: Application
    Filed: November 3, 2022
    Publication date: December 14, 2023
    Inventor: SHANG-MING CHIU
  • Publication number: 20230402068
    Abstract: The present disclosure describes techniques for voice-controlled content creation. The techniques comprise monitoring voice commands spoken by a creator. Recording of a content may be initiated in response to recognizing a first voice command spoken by the creator. Recording of the content may be stopped in response to recognizing a second voice command spoken by the creator. A timestamp associated with the second voice command may be created. A segment may be automatically deleted from the content based on the timestamp. The segment may comprise a recording of the second voice command.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 14, 2023
    Inventors: Wenqing Jiang, Serhan Uslubas, Zheng Li, Ming Tu, Shiva Shanker Pandiri
  • Publication number: 20230402278
    Abstract: A method of forming a semiconductor device includes following operations. A substrate is provided with a gate stack thereon, an epitaxial layer therein, and a dielectric layer aside the gate stack and over the epitaxial layer. An opening is formed through the dielectric layer, and the opening exposes the epitaxial layer. A metal silicon-germanide layer is formed on the epitaxial layer, wherein the metal silicon-germanide layer includes a metal having a melting point of about 1700° C. or higher. A connector is formed over the metal silicon-germanide layer in the opening.
    Type: Application
    Filed: June 12, 2022
    Publication date: December 14, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Ming Tsai, Wei-Yip Loh, Harry CHIEN, Chih-Shiun Chou, Hong-Mao Lee, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20230402608
    Abstract: A negative electrode plate includes a current collector and a negative electrode film layer disposed on at least one surface of the current collector. The negative electrode film layer includes a negative electrode active material and an emulsion-type binder. At least a portion of the emulsion-type binder is in irregular film-like distribution on surface of the negative electrode active material.
    Type: Application
    Filed: August 29, 2023
    Publication date: December 14, 2023
    Inventors: Tongxian ZHANG, Ming ZHANG
  • Publication number: 20230403522
    Abstract: A self-fitting hearing compensation device with real-ear measurement is provided and includes: a first transducer, which receives a first test signal from a device and converts the first test signal into a first electrical signal; a first hearing compensation module, which is connected to the first transducer and performs gain compensation on the first electrical signal; a second transducer, which is connected to the first hearing compensation module, converts the gain-compensated first electrical signal into sound, and transmits the sound into an ear canal; and a third transducer, which synchronously converts the sound transmitted in the ear canal into a second electrical signal, so as to transmit the second electrical signal to the device via a wireless transmission network. In addition, a self-fitting hearing compensation method and a computer program product are also provided.
    Type: Application
    Filed: September 26, 2022
    Publication date: December 14, 2023
    Applicant: GMI Technology Inc.
    Inventors: Ming-Han YEH, Ying-Hui LAI
  • Publication number: 20230399614
    Abstract: The present disclosure is directed to methods of preparing genetically engineered lymphocytes. In addition, methods of using the genetically engineered lymphocytes in T cell therapy for cancers are also disclosed.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 14, 2023
    Inventors: Saikat Banerjee, Jodi L. Murakami, Heba N. Nowyhed, Da Ming Ou
  • Publication number: 20230401025
    Abstract: A vehicle infotainment system is provided. The vehicle infotainment system includes a repositionable display, a sensing arrangement, and a controller. The repositionable display is attached to a vehicle and slidable along a defined path between a first position and a second position within the vehicle. The sensing arrangement detects a position of the repositionable display. The controller is operatively connected to the repositionable display and to the sensing arrangement. The controller controls provision of content to the repositionable display, and is configured to control the content provided to the repositionable display in dependence on signals received from the sensing arrangement.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 14, 2023
    Inventor: Ming Liu
  • Publication number: 20230403868
    Abstract: A method includes forming a circuit region over a substrate. The circuit region includes at least one active region extending along a first direction, and at least one gate region extending across the at least one active region and along a second direction transverse to the first direction. At least one first input/output (TO) pattern and at least one second TO pattern are correspondingly formed in different first and second metal layers to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first TO pattern extends along a third direction oblique to both the first direction and the second direction. The at least one second TO pattern extends along a fourth direction oblique to both the first direction and the second direction, the fourth direction transverse to the third direction.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 14, 2023
    Inventors: Jerry Chang Jui KAO, Meng-Kai HSU, Chin-Shen LIN, Ming-Tao YU, Tzu-Ying LIN, Chung-Hsing WANG
  • Publication number: 20230403165
    Abstract: A key generation technology of the present disclosure does not additionally set a combinational logic circuit on an original path of a scanning flip-flop, but utilizes a plurality of existing combinational logic circuits in a circuit system to generate multiple values of a key. Correspondingly, a key generation unit used in the key generation technology has two data flip-flops. One of the data flip-flops is used as a data flip-flop in one of a plurality of scanning flip-flops. The other data flip-flop is to obtain a node data signal of a node in the corresponding combinational logic circuit as one of the values of the key.
    Type: Application
    Filed: November 2, 2022
    Publication date: December 14, 2023
    Inventor: MING-HUNG WU
  • Publication number: 20230399074
    Abstract: A stem buffer suspension assembly structure includes a main suspension stem inserted into a stem channel of a front buffer frame assembly and including a buffer assembly, wherein a stem and a headset are assembled on an end of the main suspension stem protruded out of the buffer assembly; an upper end cover assembled with the buffer assembly and abutted with a top of the stem; a lower pressing assembly is assembled with the main suspension stem and includes a lower plug member, a locking pin, a pressing member and a limit block. The lower plug member is assembled on the main suspension stem, and the lower plug member is locked with the locking part, the locking pin is screwed with the pressing member, the limit block is mounted with the locking pin and located between the lower plug member and the pressing member.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 14, 2023
    Inventor: Ming-Ta Tsai
  • Publication number: 20230401068
    Abstract: A method for improving an accuracy of a loop branch prediction algorithm by a bypass circuit, comprising: adding a bypass circuit to a loop branch prediction algorithm; and for three pcs entering a pipeline, enabling pc1 fetched in an if0 stage to enter a hybrid branch predictor, and registering pc1; obtaining branch prediction information in an if1 stage, and making a comparison in an if2 stage to obtain a prediction result, registering the prediction result obtained in the if2 stage, and processing pc2 and pc3 in a same way.
    Type: Application
    Filed: February 28, 2023
    Publication date: December 14, 2023
    Applicants: Jiangsu Huachuang Microsystem Company Limited, Nanjing Research Institute of Electronics Technology
    Inventors: Jiong LOU, Shiping LI, Sibo YANG, Ming LI, Wenjun HAN, Zhiyong LEI
  • Publication number: 20230400168
    Abstract: A color mixing light system comprises a pyramidal mirror assembly comprising three or more mirrors constructed and arranged in a pyramid structure and three or more color light sources. The pyramidal mirror assembly divides the light beams from the color light sources so that a first portion is reflected by the mirrors and a second portion extends beyond the mirrors to collectively form a multicolor pattern comprising plurality of overlapping color regions on a surface.
    Type: Application
    Filed: May 16, 2023
    Publication date: December 14, 2023
    Inventors: Chia Ming Chen, Marian Hernan-Ackah, Yu Mo, Hemanth Kiran Gutti, Huikai Xie, Jessica Han, Albert DC Chen
  • Publication number: 20230403634
    Abstract: Embodiments of this application provide channel bandwidth configuration methods, devices, and computer readable storage media. An example method includes generating and sending an extremely high throughput (EHT) operation element. The EHT operation element includes a channel bandwidth field, a first channel center frequency field, and a second channel center frequency field. The channel bandwidth field indicates channel bandwidth information of a basic service set (BSS). The first channel center frequency field and the second channel center frequency field indicate channel location information of the BSS. The bandwidth information indicates a channel bandwidth in a plurality of channel bandwidths supported by a terminal. This application can be applied, for example, to a Wi-Fi system that supports the 802.11 standard, such as, the 802.11be standard.
    Type: Application
    Filed: August 18, 2023
    Publication date: December 14, 2023
    Inventors: Guogang HUANG, Ming GAN, Yunbo LI, Yuchen GUO
  • Publication number: 20230402416
    Abstract: A semiconductor die includes a processing circuit, a first bond pad, and a second bond pad. The first bond pad is electrically connected to a first node of the processing circuit and a first bond wire. The second bond pad is electrically connected to a second node of the processing circuit and a second bond wire. The first bond wire and the second bond wire are magnetically coupled to form a first bond wire T-coil circuit with equivalent negative inductance.
    Type: Application
    Filed: June 13, 2022
    Publication date: December 14, 2023
    Applicant: Airoha Technology (HK) Limited
    Inventors: Huan-Sheng Chen, Ming-Yin Ko, Chun-Wei Chen