Patents by Inventor Ming An

Ming An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230403194
    Abstract: The disclosed embodiments provide for rules-based deployment of software installations. In some aspects, operational parameters for a computer system are monitored over time to generate a historical database of values for the operational parameters. The computer system may include multiple instances of a software installation. A portion of the multiple instances is updated with a new version of software. The operational parameters are then monitored to quantify whether the new version results in an improvement or degradation of performance of the computer system. The improvement or degradation is based on comparing values of the operational parameters after deployment to their historical values. Depending on the evaluation of the operational parameters after the installation, the installation may be rolled back if a degradation is indicated. Otherwise, the new software version may be propagated to additional installation instances.
    Type: Application
    Filed: August 24, 2023
    Publication date: December 14, 2023
    Inventors: Osman Sarood, Randall Frei, Robert J. Friday, Keh-Ming Luoh
  • Publication number: 20230402532
    Abstract: A device and methods of forming the same are described. The device includes a substrate and a first bipolar junction transistor (BJT) disposed over the substrate. The first BJT includes a first base region, a first emitter region, and a first collector region. The device further includes a second BJT disposed over the substrate adjacent the first BJT, and the second BJT includes a second base region, a second emitter region, and a second collector region. The device further includes an interconnect structure disposed over the first and second BJTs, and the interconnect structure includes a first conductive line electrically connected to the first emitter region and the second base region and a second conductive line electrically connected to the first collector region and the second collector region.
    Type: Application
    Filed: June 13, 2022
    Publication date: December 14, 2023
    Inventors: Hong-Shyang WU, Kuo-Ming WU
  • Publication number: 20230402110
    Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells connected to word lines. The memory cells are disposed in strings and are configured to retain a threshold voltage corresponding to data states. A control means is configured to apply verification pulses of program verify voltages each associated with one of the data states to selected ones of the word lines to determine whether the memory cells connected thereto have the threshold voltage above each of the program verify voltages associated with the data states targeted for each of the memory cells being programmed during verify loops of a program-verify operation. The control means slows the memory cells targeted for a selected one of the data states identified as being faster to program than other ones of the memory cells during one of verify loops associated with an earlier one of data states.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 14, 2023
    Applicant: SanDisk Technologies LLC
    Inventors: Ke Zhang, Ming Wang, Liang Li
  • Publication number: 20230400931
    Abstract: A keyboard membrane, which is a thin sheet molded object thermoformed by a thermoplastic wear-resistant molding membrane, comprising a plurality of concave-convex parts, the concave-convex part comprises a plurality of upwardly protruding pressing parts, each of the pressing parts has a top wall and a peripheral wall extending downward from a periphery of the top wall; the keyboard membrane is disposed on a key module with keys; each of the pressing parts is connected with one of the keys of the key module; a periphery of the keyboard membrane has a peripheral edge extending outward from the pressing part, and the peripheral edge wraps the key module to form a waterproof and dustproof keyboard.
    Type: Application
    Filed: June 5, 2023
    Publication date: December 14, 2023
    Inventor: Ming-Hsien YAO
  • Publication number: 20230403816
    Abstract: A fan control method for controlling a set of fans of a system includes collecting M first sets of characteristic variables of a first period; inputting the M first sets of characteristic variables to a neural network to generate N third sets of characteristic variables of a second period corresponding to a second set of characteristic variables; adjusting the second set of characteristic variables to generate P adjusted second sets of characteristic variables to accordingly generate Q adjusted third sets of characteristic variables; generating an optimized second set of characteristic variables according to the N third sets of characteristic variables and the Q adjusted third sets of characteristic variables; generating a set of weights according to the optimized second set of characteristic variables; and controlling the set of fans according to the set of weights. The first period precedes the second period. M, N, P, Q are positive integers.
    Type: Application
    Filed: December 9, 2022
    Publication date: December 14, 2023
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Chien-Ming Lee, Kai-Yang Tung, Hsin-Cheng Chu
  • Publication number: 20230403126
    Abstract: This application provides a method for transmitting a PPDU and a communication apparatus. An AP sends a trigger frame to trigger at least one STA to transmit an uplink PPDU. After receiving the trigger frame, the at least one STA transmits respective uplink PPDUs. The uplink PPDU includes a data field and LTFs. The data field is carried on a distributed RU. The LTFs are carried on all subcarriers in a first transmission bandwidth. The first transmission bandwidth is a bandwidth occupied by a distributed RU that is allocated by the AP to the at least one STA for transmitting the uplink PPDU. Alternatively, the LTFs are carried on all subcarriers of a plurality of continuous RUs corresponding to the distributed RU.
    Type: Application
    Filed: August 25, 2023
    Publication date: December 14, 2023
    Inventors: Bo GONG, Mengshi HU, Jian YU, Chenchen LIU, Ming GAN
  • Publication number: 20230402480
    Abstract: A method of manufacturing a semiconductor device includes disposing a plurality of a first type of light sensing units on a substrate; and disposing a plurality of a second type of light sensing units arranged on the substrate. Each of the first type of light sensing units is operable to receive less radiation than each of the second type of light sensing units. At least one of the second type of light sensing units is adjacent to a portion of at least one of the first type of light sensing units. The method includes disposing a first isolation structure between one of the first type of light sensing units and one of the second type of light sensing units; and disposing a second isolation structure between the adjacent first type of light sensing units. The method includes disposing a reflective layer above the first type of light sensing units.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 14, 2023
    Inventors: Li-Wen HUANG, Chung-Lin FANG, Kuan-Ling PAN, Ping-Hao LIN, Kuo-Cheng LEE, Cheng-Ming WU
  • Publication number: 20230402225
    Abstract: The transformer includes iron core and coils. The iron core includes a first flange, a second flange, and a central column having a first face and a second face. The coils include a first coil and a second coil wound around the central column from the first flange towards the second flange. Within a first layer of coils along the first face, there are sequentially arranged at least a first coil, a first coil, a second coil, a first coil, a second coil, a gap, a second coil, a first coil, and multiple rounds of first coil. Within the first layer along the second face, there are sequentially arranged multiple rounds of the first coil, a first coil, a second coil, a gap, a second coil, a first coil, and multiple rounds of the first coil. Within a second layer there are multiple rounds of the second coil.
    Type: Application
    Filed: June 13, 2022
    Publication date: December 14, 2023
    Inventors: Ming-Yen Hsieh, Pao Lin Shen, Hsiang Chung Yang
  • Publication number: 20230400818
    Abstract: An electronic watch may include a housing and a crown configured to receive a rotational input. The crown may include a knob external to the housing, a rotor coupled to the knob and configured to rotate in response to the rotational input, the rotor defining a recess extending about a circumference of the rotor, and a coating positioned in the recess and configured to reflect at least a portion of light incident on the coating. The electronic watch may further include an optical sensing system configured to detect the rotational input using the reflected portion of the light.
    Type: Application
    Filed: June 14, 2022
    Publication date: December 14, 2023
    Inventors: Richard A. Davis, Cole J. Bowden, Craig A. Horton, Ming Kun Shi
  • Publication number: 20230402818
    Abstract: A semiconductor package includes a printed circuit board (PCB), a semiconductor device, a first signal bonding wire, and a first ground bonding wire. The PCB includes a first PCB ground pad and a first PCB signal trace. The semiconductor device includes a first device ground pad and a first device signal pad. The first signal bonding wire is coupled between the first device signal pad and the first PCB signal trace. The first ground bonding wire is coupled between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.
    Type: Application
    Filed: November 28, 2022
    Publication date: December 14, 2023
    Applicant: Airoha Technology Corp.
    Inventors: Chun-Wei Chen, Ming-Yin Ko, Yan-Bin Luo
  • Patent number: 11840719
    Abstract: An apparatus and associated methods of use for a controlled combination of reagents is disclosed. The apparatus includes a vessel 400, a vessel insert 220, and a cap element 200. The vessel 400 has a body portion 410 for receiving a biological sample. The vessel insert 220 receives at least one reagent therein. Preferably, the vessel insert 220 is received in a portion 420 of the vessel 400. The cap element 200 is attached to the vessel 400 to secure the vessel insert 220 in the vessel 400. During use, the vessel insert 220 is adapted to release its contents when the biological sample is introduced into the body portion 410 of the vessel 400 upon application of an intermixing force to the vessel insert 220. A variety of intermixing forces may be applied, depending upon the embodiment of the present invention and its associated methods of use.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: December 12, 2023
    Assignee: BECTON, DICKINSON AND COMPANY
    Inventors: Mei Yang-Woytowitz, Brent Pohl, Gary F. Hershner, Dwight Livingston, Eric Ursprung, Gerard Lotz, Kevin Bailey, Ammon David Lentz, Michael A. Brasch, Ming-hsiung Yeh, Patrick Shawn Beaty, Charles C. Yu, Timothy M. Wiles, Liping Feng, Ben Turng, Xiaofei Chang, Patrick R. Murray
  • Patent number: 11842955
    Abstract: An integrated circuit package and a method of forming the same are provided. A method includes forming a first redistribution layer over a carrier, the first redistribution layer including a contact pad and a bond pad. A conductive pillar is formed over the contact pad. A backside surface of an integrated circuit die is attached to the bond pad using a solder joint. An encapsulant is formed along a sidewall of the conductive pillar and a sidewall of the integrated circuit die, a front-side surface of the integrated circuit die being substantially level with a topmost surface of the encapsulant and a topmost surface of the conductive pillar. A second redistribution layer is formed over the front-side surface of the integrated circuit die, the topmost surface of the encapsulant and the topmost surface of the conductive pillar.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: December 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, Hung-Jui Kuo, Ming-Che Ho, Tzung-Hui Lee
  • Patent number: 11841922
    Abstract: Method and system for classifying and labeling images, which can perform segmentation based on features of each part of images, classify and match the image and the segmented image based on a classification model built by the machine learning method. Meanwhile, each image is assigned with labels and text descriptions. The system also includes a string module assigning the image with a plurality of matching labels and text descriptions that are the most relevant in recent times. Furthermore, the classification model is trained by machine learning method such as an unsupervised learning, a self-supervised learning, or a heuristic algorithms. In addition, a character recognition module is provided to extract characters in the image for comprehensive learning and calculations to facilitate classification and labeling of the image.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: December 12, 2023
    Assignee: AWOO INTELLIGENCE, INC.
    Inventors: Szu-Wu Lin, Gang-Feng Ho, Kuo Ming Lin
  • Patent number: 11842927
    Abstract: A semiconductor structure includes a substrate including a first region and a second region, a first channel layer disposed in the first region and a second channel layer disposed in the second region, a first dielectric layer disposed on the first channel layer and a second dielectric layer disposed on the second channel layer, and a first gate electrode disposed on the first dielectric layer and a second gate electrode disposed on the second dielectric layer. The first channel layer in the first region includes Ge compound of a first Ge concentration, the second channel layer in the second region includes Ge compound of a second Ge concentration. The first Ge concentration in the first channel layer is greater than the second Ge concentration in the second channel layer.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: December 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: I-Ming Chang, Chung-Liang Cheng, Hsiang-Pi Chang, Hung-Chang Sun, Yao-Sheng Huang, Yu-Wei Lu, Fang-Wei Lee, Ziwei Fang, Huang-Lin Chao
  • Patent number: 11844184
    Abstract: An information processing system includes a housing, a circuit board in the housing, a functional module in the housing, and a module fixing device in the housing. The functional module is inserted into the circuit board. The module fixing device is connected to the functional module and is connected to the circuit board. The module fixing device comprises a clamping member and an elastic member. The clamping member is movably connected to the circuit board in a first direction and a second direction opposite to the first direction, the clamping member comprises a first clamping portion to clamp the functional module. The elastic member is connected to the clamping member, the elastic member is deformable in the first direction to drive the clamping member to move in the first direction to clamp the functional module.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: December 12, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Tung-Ho Shih, Hung-Wei Chen, Kuan-Chin Yu, Ming-Heng Lu
  • Patent number: 11842421
    Abstract: The present disclosure provides a watermark embedding method including following steps. Values of predetermined grayscale program are respectively multiplied by a value of time series data to generate grayscale information of a watermark signal. In a first time period and a second time period included in each of continuous cycles, phases of the time series data are opposite and averages values of the predetermined grayscale program are the same, and a sum of the grayscale information of the watermark signal in the first time period and the second time period is zero. The watermark signal is embedded into a first local dimming signal by the processing circuit to generate a second local dimming signal to control light intensities of local dimming zones according to the second local dimming data with the watermark information.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: December 12, 2023
    Assignee: AUO CORPORATION
    Inventors: Wei-Ming Cheng, Chao-Wei Li, Cheng-Kuang Wang, Yang-En Wu, Wen-Rei Guo
  • Patent number: 11840008
    Abstract: A method of fabricating a decorated molding article includes forming an all-in-one coating on a substrate and performing a curing step, thereby forming a composite layer structure with a protective effect, a color effect, and a bonding effect. The composite layer structure may form a molded film with better physical properties (e.g., higher hardness, better protection effect, and the like) after the blister molding process. Therefore, the molded film of the embodiments may be applied to a laser engraving process to form a variety of light-transmitting decorated molding articles.
    Type: Grant
    Filed: October 24, 2021
    Date of Patent: December 12, 2023
    Assignee: Jin Ya Dian Technology Co., Ltd.
    Inventors: Che-Ming Yu, Kuo-Liang Ying
  • Patent number: 11841618
    Abstract: A photoresist apparatus and a method are provided. The photoresist apparatus includes a pre-baking apparatus. The pre-baking apparatus includes: a hot-plate, a first cover over the hot-plate, a second cover over the first cover, a first heating element extending along a topmost surface of the first cover, and a second heating element extending along a topmost surface of the second cover.
    Type: Grant
    Filed: January 3, 2022
    Date of Patent: December 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hung-Jui Kuo, De-Yuan Lu, Chen-Hua Yu, Ming-Tan Lee
  • Patent number: D1007261
    Type: Grant
    Filed: July 25, 2023
    Date of Patent: December 12, 2023
    Inventor: Ming Xue
  • Patent number: D1007520
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: December 12, 2023
    Assignee: CHINA MEDICAL UNIVERSITY
    Inventors: Der-Yang Cho, Chih-Yu Chi, Chia-Huei Chou, Yow-Wen Hsieh, Pei-Ran Sun, Lu-Ching Ho, Ming-Tung Chen