Patents by Inventor Ming-Chang Wu
Ming-Chang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240111121Abstract: An imaging lens module includes a plastic lens barrel, a first optical element assembly and a second optical element assembly, wherein both of the first optical element assembly and the second optical element assembly are disposed in the plastic lens barrel. The plastic lens barrel includes a first inner annular surface and a second inner annular surface. The first inner annular surface forms a first receiving space. The second inner annular surface forms a second receiving space. The first optical element assembly is disposed in the first receiving space and includes a plurality of optical lens elements and a first retainer. The second optical element assembly is disposed in the second receiving space and includes a first light blocking sheet and a second retainer.Type: ApplicationFiled: December 13, 2023Publication date: April 4, 2024Inventors: Chien-Hsun WU, Lin-An CHANG, Ming-Ta CHOU
-
Patent number: 11929767Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.Type: GrantFiled: August 16, 2022Date of Patent: March 12, 2024Assignee: MEDIATEK INC.Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
-
Patent number: 11829317Abstract: A cable includes a first plug, a second plug, and a controller. The first plug is configured to be connected with a host. The second plug is configured to be connected with a device. The controller is coupled between the first plug and the second plug, and is configured to monitor a connection message transferred between the host and the device, and to determine, according to the connection message, a transfer mode that the host and the device is to enter, and to set a plurality of electrical parameters to be a corresponding one set in a plurality of sets of predetermined parameters.Type: GrantFiled: January 5, 2021Date of Patent: November 28, 2023Assignee: REALTEK SEMICONDUCTOR CORPORATIONInventors: Ming-Chang Wu, Kai Liu, Yao Feng, Neng-Hsien Lin, Chen Shen
-
Publication number: 20230280228Abstract: A detection system adapted for a liquid-cooling system includes a pressurizing device and at least one pressure sensor, the pressurizing device is configured to connect to and to pressure the liquid-cooling system, the pressure sensor is configured to measure a transient pressure response in response to detecting residual air bubbles in the liquid-cooling system.Type: ApplicationFiled: August 31, 2022Publication date: September 7, 2023Inventors: Tzu-Han TING, MING-CHANG WU, WEI-CHUNG HSIAO
-
Publication number: 20230232580Abstract: A flow path module, adapted to a heat exchange element and a coolant and including a pipeline structure and at least one flow resistance element, is provided. The pipeline structure is adapted to be connected to the heat exchange element. The flow resistance element is disposed in the pipeline structure, and the coolant flows through the heat exchange element from the pipeline structure. A flow resistance of the flow resistance element is adapted to be adjusted corresponding to a flow resistance of the heat exchange element. A coolant distribution device and a server are also provided.Type: ApplicationFiled: April 25, 2022Publication date: July 20, 2023Applicant: Wistron CorporationInventors: Yu-Tang Ju, Ming-Chang Wu
-
Publication number: 20210206662Abstract: A water sterilizing tube includes a shell, an outer tube, an inner tube and a UV lighting module. The shell has a first end, a second end and an annular wall. The first end is provided with a water inlet and a water outlet. The outer tube is coaxially disposed in the shell. An end of the outer tube communicates with the water outlet. An air gap is formed between the outer tube and the annular wall. The inner tube is coaxially disposed in the outer tube. An end of the inner tube communicates with the water inlet. An extended channel is formed between the outer and inner tubes. The UV lighting module has a UV light corresponding to the outer tube. An axis line of the outer and the inner tube and a direction of light emitting of the UV light are superposed with each other.Type: ApplicationFiled: March 16, 2020Publication date: July 8, 2021Inventors: Chih-Hung WEI, Ming-Chang WU, Jian-Yang WU, Guan-Yao HUANG, Po-Ning CHANG, Wun-Ru LIAO, Chih-Yang HSU
-
Publication number: 20210209054Abstract: A cable includes a first plug, a second plug, and a controller. The first plug is configured to be connected with a host. The second plug is configured to be connected with a device. The controller is coupled between the first plug and the second plug, and is configured to monitor a connection message transferred between the host and the device, and to determine, according to the connection message, a transfer mode that the host and the device is to enter, and to set a plurality of electrical parameters to be a corresponding one set in a plurality of sets of predetermined parameters.Type: ApplicationFiled: January 5, 2021Publication date: July 8, 2021Inventors: MING-CHANG WU, KAI LIU, YAO FENG, NENG-HSIEN LIN, CHEN SHEN
-
Patent number: 9821348Abstract: A method for cleaning an edge of a semiconductor wafer in a wafer edge exposure (WEE) apparatus includes positioning the semiconductor wafer having a resist thereon in a wafer positioning device. A brush bar is positioned adjacent a backside of the semiconductor wafer in the wafer positioning device. The brush bar engages and cleans a backside of the semiconductor wafer while the semiconductor wafer is disposed in the wafer positioning device. A height of an edge of the semiconductor wafer is detected. The focusing position of exposure light radiated toward the edge is controlled on the basis of a height of the edge. Exposure light is radiated towards an edge after the cleaning step.Type: GrantFiled: October 22, 2013Date of Patent: November 21, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Chang Wu, Jia-Hung Hsu
-
Patent number: 9702537Abstract: A fluid cooled lamp includes: a heat conductive pipe has multiple heat conductive surfaces and a hollow channel; multiple illumination modules arranged at each heat conductive surface; a junction assembly for inlet and outlet of fluid including an inlet joint and an outlet joint, the inlet joint and the outlet joint are respectively communicated with both ends of the hollow channel; a flow guiding inner tube communicated with inlet joint and located in the hollow channel, multiple spray holes are disposed in the flow guiding inner tube, the fluid is sprayed from each spray hole and impacts an inner wall of the heat conductive pipe to remove heat.Type: GrantFiled: March 9, 2016Date of Patent: July 11, 2017Assignee: HIGH POWER LIGHTING CORP.Inventors: Chih-Hung Wei, Ming-Chang Wu, Jian-Yang Wu, Chih-Yang Hsu, Wun-Ru Liao, Yu-Ting Liu
-
Publication number: 20170049007Abstract: A meshed cooling structure includes a cooling mesh and a thermally conductive component. The cooling mesh includes a plurality of mesh layers. Each mesh layer includes a plurality of cooling wires which are interlaced, and each cooling wire of each mesh layer has a caliber different from one another. The thermally conductive component supports and transfers heat to the cooling mesh. The thermally conductive component includes a base and a plurality of supporting bodies spaced side by side. A supporting height is formed between one side of each supporting body and the other side opposite to the one side. The one side of each supporting body supports and in contact with the cooling mesh. The other side of each supporting body is connected to the base. Each cooling wire and each supporting body are opposite to each other obliquely.Type: ApplicationFiled: December 29, 2015Publication date: February 16, 2017Inventors: Chih-Hung WEI, Ming-Chang WU, Jian-Yang WU, Pu WEN, Chih-Yang HSU
-
Patent number: 9568245Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.Type: GrantFiled: April 8, 2015Date of Patent: February 14, 2017Assignee: CHROMA ATE INC.Inventors: Hsiu-Wei Kuo, Xin-Yi Wu, Ben-Mou Yu, Ming-Chang Wu, Mao-Sheng Liu, Kuei-Wen Lien
-
Patent number: 9562725Abstract: A heat dissipating device includes a base, a heat pipe disposed on the base, and a plurality of first and second heat dissipating fins. Each first heat dissipating fin includes a fin body having a first through hole for extension of the heat pipe therethrough. The first and second heat dissipating fins are mounted on the heat pipe in a stack and in a spaced-apart alternating arrangement. Each second heat dissipating fin includes a fin body having a second through hole for extension of the heat pipe therethrough, two adjacent lateral edges, and a cut edge interconnecting the lateral edges such that each second heat dissipating fin has a smaller area than each first heat dissipating fin. Thus, the flow field resistance of the heat dissipating device can be reduced to increase the amount of airflow through the heat dissipating device for enhancing the heat dissipating efficiency.Type: GrantFiled: November 5, 2013Date of Patent: February 7, 2017Assignee: WISTRON CORPORATIONInventors: Yen-Yu Chao, Ming-Chang Wu, Ming-Wei Tien
-
Publication number: 20160377277Abstract: A fluid cooled lamp includes: a heat conductive pipe has multiple heat conductive surfaces and a hollow channel; multiple illumination modules arranged at each heat conductive surface; a junction assembly for inlet and outlet of fluid including an inlet joint and an outlet joint, the inlet joint and the outlet joint are respectively communicated with both ends of the hollow channel; a flow guiding inner tube communicated with inlet joint and located in the hollow channel, multiple spray holes are disposed in the flow guiding inner tube, the fluid is sprayed from each spray hole and impacts an inner wall of the heat conductive pipe to remove heat.Type: ApplicationFiled: March 9, 2016Publication date: December 29, 2016Inventors: Chih-Hung WEI, Ming-Chang WU, Jian-Yang WU, Chih-Yang HSU, Wun-Ru LIAO, Yu-Ting LIU
-
Patent number: 9360224Abstract: An air condition system includes a casing, a first heat exchanger, a fan and a second heat exchanger. A host is held by the casing. The first heat exchanger is disposed inside the casing. Air flows into the casing, and is processed by the first heat exchanger. Then, the air processed by the heat exchange procedure flows forward the host. The fan exhausts the air passing through the host. The second heat exchanger disposed on the fan and inside the casing. The air exhausted by the fan is processed by the second heat exchanger, and flows out of the casing by wind force of the fan.Type: GrantFiled: June 25, 2013Date of Patent: June 7, 2016Assignee: Wistron CorporationInventors: Chun-Hung Pan, Shue-Liang Lin, Ming-Chang Wu
-
Publication number: 20150323257Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.Type: ApplicationFiled: April 8, 2015Publication date: November 12, 2015Inventors: Hsiu-Wei KUO, Xin-Yi WU, Ben-Mou YU, Ming-Chang WU, Mao-Sheng LIU, Kuei-Wen LIEN
-
Patent number: 9113650Abstract: A pectic enzyme treated pectin (PET-pectin) and a method of producing the same are disclosed. Citrus pectin solution is subjected to an enzymatic hydrolysis by using a mixed pectinase solution under an acidic condition, so as to obtain PET-pectin that is completely hydrolyzed. The PET-pectin has several biological functions, including stability of emulsification, anti-oxidation and inhibition of cancer cell growth, thereby being applied on food emulsion stabilizers, food antioxidants and compositions for inhibiting cancer cell growth and so on.Type: GrantFiled: June 6, 2012Date of Patent: August 25, 2015Assignee: NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Ming-Chang Wu, Yuh-Tai Wang, Ping-Hsiu Huang
-
Publication number: 20150107620Abstract: A method for cleaning an edge of a semiconductor wafer in a wafer edge exposure (WEE) apparatus includes positioning the semiconductor wafer having a resist thereon in a wafer positioning device. A brush bar is positioned adjacent a backside of the semiconductor wafer in the wafer positioning device. The brush bar engages and cleans a backside of the semiconductor wafer while the semiconductor wafer is disposed in the wafer positioning device. A height of an edge of the semiconductor wafer is detected. The focusing position of exposure light radiated toward the edge is controlled on the basis of a height of the edge. Exposure light is radiated towards an edge after the cleaning step.Type: ApplicationFiled: October 22, 2013Publication date: April 23, 2015Inventors: Ming-Chang Wu, Jia-Hung Hsu
-
Patent number: 8743537Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.Type: GrantFiled: June 7, 2012Date of Patent: June 3, 2014Assignee: Wistron CorporationInventors: Wen-Hsiung Yang, Wei-Chung Hsiao, Shih-Huai Cho, Ming-Chang Wu
-
Publication number: 20140124173Abstract: A heat dissipating device includes a base, a heat pipe disposed on the base, and a plurality of first and second heat dissipating fins. Each first heat dissipating fin includes a fin body having a first through hole for extension of the heat pipe therethrough. The first and second heat dissipating fins are mounted on the heat pipe in a stack and in a spaced-apart alternating arrangement. Each second heat dissipating fin includes a fin body having a second through hole for extension of the heat pipe therethrough, two adjacent lateral edges, and a cut edge interconnecting the lateral edges such that each second heat dissipating fin has a smaller area than each first heat dissipating fin. Thus, the flow field resistance of the heat dissipating device can be reduced to increase the amount of airflow through the heat dissipating device for enhancing the heat dissipating efficiency.Type: ApplicationFiled: November 5, 2013Publication date: May 8, 2014Applicant: Wistron CorporationInventors: Yen-Yu CHAO, Ming-Chang WU, Ming-Wei Tien
-
Publication number: 20140083658Abstract: An air condition system includes a casing, a first heat exchanger, a fan and a second heat exchanger. A host is held by the casing. The first heat exchanger is disposed inside the casing. Air flows into the casing, and is processed by the first heat exchanger. Then, the air processed by the heat exchange procedure flows forward the host. The fan exhausts the air passing through the host. The second heat exchanger disposed on the fan and inside the casing. The air exhausted by the fan is processed by the second heat exchanger, and flows out of the casing by wind force of the fan.Type: ApplicationFiled: June 25, 2013Publication date: March 27, 2014Inventors: Chun-Hung Pan, Shue-Liang Lin, Ming-Chang Wu