Abstract: An implant structure is provided. The implant structure includes an implant body and a screw portion. The screw portion is coupled to a second surface of the implant body such that the implant structure can be implanted into an injured bone via the screw portion. Thus, the implant body partially replaces and thereby repairs the injured bone. Threads of the screw portion have at least a barb unit for preventing the implant structure from rotating in the loosening direction of the screw portion. The at least a barb unit also prevents the implant structure from loosening and displacement so that the service life of the implant structure can be extended.

Abstract: A spine fixation device is provided. The spine fixation device includes a bone screw, a fixation carrier, and a first locking member. The fixation carrier is rotatably coupled to a fixation unit of the bone screw. The first locking member conjugates the fixation carrier and the bone screw together. A screw unit of the bone screw is implanted into a vertebra. As the fixation carrier is rotatably coupled to the bone screw, the bone screw remains fastened to the vertebra while the fixation carrier is rotated. Through rotational adjustment of the fixation carrier, U-shaped openings of the fixation carrier are adjustable in direction. Thus, the disposition angle of a rod disposed in the U-shaped openings is easily adjustable by rotating the fixation carrier. As a result, the rod can fit an angle of the spine while surgical complexity is reduced.

Abstract: A flexible spinal fixation device and a rod thereof are provided. The flexible spinal fixation device includes at least two bone screws and a rod. The rod is fixedly coupled to the bone screws, and the bone screws are implanted into a patient's vertebrae. The rod has a flexible part and is thereby rendered flexible. After the flexible spinal fixation device is implanted into the patient's spine, the patient's spine can stoop as in a healthy condition. Moreover, vertebral stress around an injured vertebra and force between the bone screws and the rod can both be reduced. The flexible spinal fixation device also prevents premature vertebral aging and has an extended service life.

Abstract: An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop.

Abstract: A light condensing structure for illuminating device includes a lamp shade; an optical unit located at an open end of the lamp shade and provided on one of two opposite sides with a plurality of concentric annular light condensing sections, each of which has an upward tapered cross-sectional shape; and a light-emitting element mounted in the lamp shade to face toward the other side of the optical unit. Divergent lights from the light-emitting element can be totally reflected (refracted) by the light condensing sections of the optical unit, so that an increased illuminating brightness can be achieved for the illuminating device.

Abstract: The present invention is an optical device that is not axially symmetric; comprising of a lampshade at least; wherein, an optical unit mounted to the transverse of lampshade, an illuminant mounted inside the lampshade where corresponding to the center of inner lateral to the optical unit; meanwhile, the optical unit is geometrically structured in a non-axisummetric configuration while the optical unit is fitted a reflector with plurality of cascades along the ring at the external lateral; thus, a refraction or reflection against the light emitted from the illuminant can be performed when permeating through the optical unit that beams a strip light pattern achievable.

Abstract: A system and method for a solid state lighting network using a power system architecture, having application in a designated area to achieve energy saving control and intelligent management requirements. The present invention primarily enables implementing single or integral control of each LED light emitting device installed within a local area via a control device. The entire system is constructed using existing alternating current power lines, and the control method uses the existing power lines as channels for conveying electronic signals, and implements conversion of control signals. Moreover, alternating current carrier waves are used to complete transmission of the electronic signals, thereby achieving effective control of each LED light emitting device within a local area.

Abstract: A candle lighting type reflective lampshade comprises a lampshade main body being made with a reverse cone body on the upper half thereof and a cover layer on the inner cone surface thereof, wherein the cone surface forming a pair of symmetrical parabolic curves includes a ring type aperture on the top thereof thereby allowing the underside light source to achieve secondary full reflection; the base of lampshade main body comprises a plurality of inclined surfaces being ringly peripherally installed thereon and being installed with a plurality of lamp source bases below the inclined surfaces, while the light source is effectively controlled by the lamp source base to beam the light on the cone top portion of the reverse cone body so as to fully reflect each light beam and to achieve uniform dispersion of the light source.

Abstract: A testing method for a LED module and its associated elements includes the steps of: providing a LED module on which a plurality of light-emitting diodes is arranged; providing an integration detector, and mounting it above the LED module; providing an electrically conducting means having a plurality of conductive terminals and an electronic signal connector electrically connected to the conductive terminals; electrically connecting the light-emitting diodes with the conductive terminals; using the electronic signal connector to change the ON/OFF states of the electrical signals of the light-emitting diodes and the conductive terminals; and detecting the photo-electrical properties of each light-emitting diode via the integration detector.

Abstract: An LED includes a cooling block, an LED chip, two insulating layers, two electrically conductive layers and two gold wires. According to the invention, two open trenches are arranged by opening on the cooling block; the LED chip is fixed on a surface of the cooling block; the insulating layers are plated on inner walls of the trenches; the electrically conductive layers are plated on the insulating layers and are insulated from the cooling block; the gold wires are electrically conducted to the electrically conductive layers and the LED chip; since the insulating layers are only plated on parts, where the cooling block contacts the electrically conductive layers, the other parts of the cooling block are exposed, such that the cooling area is increased and the cooling performance is promoted; in addition, the invention is further to provide a cooling block assembly constituted by these cooling blocks.

Abstract: A heat dissipating mechanism includes a housing. A hollow space is formed inside the housing. The heat dissipating mechanism further includes an airflow guiding structure installed inside the hollow space for separating the hollow space into a first channel and a second channel. An inlet and an outlet are formed on the airflow guiding structure. Airflow enters the first channel via the inlet and jets out of the outlet for mixing with thermal current generated by a heat source in the second channel.

Abstract: A heat dissipation device adapted for dissipating heat generated by a heat source is provided. The heat dissipation device includes a base and a heat dissipation fin assembly. The base is disposed on the heat source. The heat dissipation fin assembly is disposed on the base and includes a plurality of parallel fins. The heat dissipation fins assembly has opposite air inlet side and air outlet side. A turbulence generating structure is formed by at least a part of the fins or holes at the air inlet or the air outlet of the heat dissipation fin assembly.

Abstract: An improved structure of light emitting diode comprises that a copper clad laminate is made with a rectangular type slot thereon and a ring type slot on the outside boundary to enclose the rectangular type slot, while side wall of the slot form a natural guide angle with the surface of the copper clad laminate to further form an island type platform; a conductor being made between rectangular type slot and ring type slot is penetrated through the copper clad laminate and externally enclosed by the insulator thereby allowing conductor to be insulated; a light emitting diode chip is installed thereon; a fluorescent glue is optionally installed on the light emitting diode with a covering range smaller than the natural guiding angle of the rectangular type slot, wherein the copper clad laminate is installed on the printed circuit board.

Abstract: The preferred embodiment the invention proposes pertains to a light source system structure, claimticularly referring to a multiple light-source source packaging structure, which is comprised of a surface wrapped with a multiple number of packagers, and inside the packagers is a placement space, and the surface of the packager is of a smooth surface; a micro-Fresnel lens unit, which is mounted in the placement space, and the micro-Fresnel lens unit is comprised of a multiple number of encircling micro-Fresnel lenses, with a concave slot located at the center of the encircling micro-Fresnel lens unit and a light source mounted beneath the concave slot, where the light created from the light source can be deflected and projected through the micro-Fresnel lens unit, through which to further control the angle of each light beam, together with a circuit control switch linked to the light source to further control the distance of light projection from the multiple number of packagers, enabling the distance of proje

Abstract: An electronic device having a heat-dissipating module includes a housing and an electronic component (e.g., a central processing unit) disposed within the housing. The heat-dissipating module is used for dissipating heat of the electronic component, and includes a two-phase flow heat-dissipating loop and a thermoelectric cooling component. The two-phase flow heat-dissipating loop can be a loop heat pipe (LHP) or a capillary pumped loop (CPL). The thermoelectric cooling component includes a cooling portion and a heat-generating portion respectively to cool or heat necessary portions of the two-phase flow heat-dissipating loop, or directly cool the electronic component through the cooling portion, thereby increasing the heat-dissipation effect of the two-phase flow heat-dissipating loop.