Abstract: An anti-press fan structure includes a fan frame and a fan impeller. The fan impeller has a support shaft supporting the fan impeller disposed in the fan frame. The support shaft has a protrusion section protruding from the fan frame to bear and connect with an external unit positioned above the fan impeller so as to keep an axial space between the fan impeller and the external unit. Accordingly, the fan impeller is prevented from being compressed by the external unit and the pressure applied to the fan frame is dispersed.

Abstract: A semiconductor structure includes: a substrate; a first passivation layer over the substrate; a second passivation layer over the first passivation layer; and a magnetic core in the second passivation layer, wherein the magnetic core includes a first magnetic material layer and a second magnetic material layer over the first magnetic material layer, the first magnetic material layer and the second magnetic material layer are separated by a high resistance isolation layer, and the high resistance isolation layer has a resistivity greater than about 1.3 ohm-cm.

Abstract: A spindle device is mountable with a tool holder, and includes a rotating spindle rotatably mounted to a spindle main body and extending axially to have an axial end surface. A contactless power transmission module is disposed on a flange end surface of the spindle main body and an outer peripheral wall of the rotating spindle for supplying power. An electrically connecting module includes two conductive units each disposed in the rotating spindle and electrically connected with the power transmission module. Each conductive unit has an electrically conductive post extending axially and exposed from the axial end surface for conducting the power to the tool holder.

Abstract: A disk-shaped fan impeller structure includes a plate body having an inner rim and an outer rim. The inner rim is connected with a hub via multiple connection members. The outer rim extends in a direction away from the hub. The connection members are annularly disposed on outer circumference of the hub at intervals to radially extend toward the inner rim of the plate body. A top face and a bottom face are defined between the inner rim and outer rim. Multiple upper boss bodies are arranged on the top face at intervals. Multiple first gaps are distributed between the upper boss bodies. By means of the boss bodies, the periodical noise problem of the conventional fan impeller can be improved.

Abstract: A tray-type fan impeller structure includes a plate body annularly disposed around a hub. The plate body has a connection side connected with the hub and a free side extending in a direction away from the hub. Multiple boss bodies are arranged on a top face or the top face and a bottom face of the plate body at intervals. By means of the boss bodies, the periodical noise problem caused by the conventional blades is improved.

Abstract: An anti-press fan structure includes a fan frame and a fan impeller. The fan impeller has a support shaft supporting the fan impeller disposed in the fan frame. The support shaft has a protrusion section protruding from the fan frame to bear and connect with an external unit positioned above the fan impeller so as to keep an axial space between the fan impeller and the external unit. Accordingly, the fan impeller is prevented from being compressed by the external unit and the pressure applied to the fan frame is dispersed.

Abstract: A pressproof fan structure includes: a fan frame having an upper case and a lower case; a support shaft having one end inserted into the lower case, and the other end protruding out from the upper case; an oil-retaining bearing having a bearing hole, in which the support shaft is fitted; a rotor assembly fitted around and connected with the oil-retaining bearing; a restriction member fitted around the support shaft near the oil-retaining bearing; a thrust member fitted around the support shaft near the oil-retaining bearing; and a stator assembly disposed on the lower case near the oil-retaining bearing without contacting.

Abstract: A semiconductor structure includes: a substrate; a first passivation layer over the substrate; a second passivation layer over the first passivation layer; and a magnetic core in the second passivation layer; wherein the magnetic core includes a first magnetic material layer and a second magnetic material layer over the first magnetic material layer, the first magnetic material layer and the second magnetic material layer are separated by a high resistance isolation layer, and the high resistance isolation layer has a resistivity greater than about 1.3 ohm-cm.

Abstract: A configuration management system tracks the configuration of a computing environment based on a tracking policy. The configuration management system detects a change to a configuration setting included in the tracking policy, and classifies the change. The classification is indicative of an effect of the change on an ability to manage operation of the computing environment. The configuration management system initiates an action, based at least in part on the classification, in response to the change.

Abstract: A configuration management service tracks the configuration of a managed computing environment in accordance with a first version of a tracking policy. When an updated version of the tracking policy is received, the configuration management service initiates tracking of the configuration in accordance with the second version of the tracking policy, while continuing to track the configuration in accordance with the first version. A change to the configuration is detected based on the first version of the tracking policy. The change is verified based on the second version of the tracking policy, and a notification of the change is provided.

Abstract: Particular embodiments described herein provide for an expandable heat sink for an electronic device. The expandable heat sink includes flexible thermal conductive material and an activator. The activator can cause the expandable heat sink to be in a retracted configuration with a retracted height or in an expanded configuration with an expanded height, wherein the expanded height is greater than the retracted height. In an example, the flexible thermal conductive material includes graphite sheets.

Abstract: A semiconductor structure includes: a substrate; a first passivation layer over the substrate; a second passivation layer over the first passivation layer; and a magnetic core in the second passivation layer; wherein the magnetic core includes a first magnetic material layer and a second magnetic material layer over the first magnetic material layer, the first magnetic material layer and the second magnetic material layer are separated by a high resistance isolation layer, and the high resistance isolation layer has a resistivity greater than about 1.3 ohm-cm.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.

Abstract: A semiconductor structure includes: a substrate; a first passivation layer over the substrate; a second passivation layer over the first passivation layer; and a magnetic core in the second passivation layer; wherein the magnetic core includes a first magnetic material layer and a second magnetic material layer over the first magnetic material layer, the first magnetic material layer and the second magnetic material layer are separated by a high resistance isolation layer, and the high resistance isolation layer has a resistivity greater than about 1.3 ohm-cm.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.

Abstract: An online object reservation system includes a database and an object reservation server. The database stores multiple objects associated with individual selection status. The object reservation server establishes a continuous connection with a client to provide a reservation page and receive reservation requirements from the client. The object reservation server automatically selects connection objects according to the reservation requirements. The object reservation server also establishes other connections with other clients. Whenever the selection status of any of the objects is altered, the object reservation server sends a refresh notification to the client to update contents rendered on the reservation page.

Abstract: A semiconductor structure includes: a substrate; a first passivation layer over the substrate; a second passivation layer over the first passivation layer; and a magnetic core in the second passivation layer; wherein the magnetic core includes a first magnetic material layer and a second magnetic material layer over the first magnetic material layer, the first magnetic material layer and the second magnetic material layer are separated by a high resistance isolation layer, and the high resistance isolation layer has a resistivity greater than about 1.3 ohm-cm.

Abstract: A semiconductor structure includes: a substrate; a first passivation layer over the substrate; a second passivation layer over the first passivation layer; and a magnetic core in the second passivation layer; wherein the magnetic core includes a first magnetic material layer and a second magnetic material layer over the first magnetic material layer, the first magnetic material layer and the second magnetic material layer are separated by a high resistance isolation layer, and the high resistance isolation layer has a resistivity greater than about 1.3 ohm-cm.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.