Abstract: A method for packaging a multi-wavelength LED array package module includes: forming at least one concave groove on a drive IC structure; arranging a multi-wavelength LED array set in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the multi-wavelength LED array set by a printing, a coating, a stamping, or a stencil printing process; arranging the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.

Abstract: A multi-wavelength light-emitting module with high density electrical connections includes a drive IC structure and a multi-wavelength LED array structure. The drive IC structure has a drive IC unit formed on a top surface thereof. The multi-wavelength LED array structure is disposed on the top surface of the drive IC structure, and the multi-wavelength LED array structure has a conductive trace unit formed on an outer surface thereof and electrically connected to the drive IC unit.

Abstract: An LED array module includes a drive IC structure, at least one LED array, an adhesive element, and a first conductive structure. The drive IC structure has a concave groove formed on a top side thereof. The at least one LED array is received in the at least one concave groove. The adhesive element is disposed between the at least one LED array and the drive IC structure. The first conductive structure is electrically connected between the drive IC structure and the at least one LED array. Moreover, the LED array module can be disposed on a PCB that has at least one input/output pad. A second conductive structure is electrically connected between the drive IC structure and the at least one input/output pad.

Abstract: A method for packaging an LED array module includes: forming at least one concave groove on a drive IC structure; arranging at least one LED array in the at least one concave groove; solidifying a plurality of liquid conductive materials to form a plurality of conductive elements that is electrically connected between the drive IC structure and the at least one LED array via a printing, a coating, a stamping, or a stencil printing process; disposing the drive IC structure on a PCB with at least one input/output pad; and then forming a conductive structure that is electrically connected between the drive IC structure and the at least one input/output pad.

Abstract: A multi-wavelength light-emitting module that includes a PCB, a drive IC structure, a conductive structure, a multi-wavelength LED array set, a plurality of conductive elements, and an optical amplifier structure. The PCB has at least one input/output pad. The drive IC structure is disposed on the PCB and having at least one concave groove formed on top surface thereof. The conductive structure is electrically connected between the drive IC structure and the at least one input/output pad. The multi-wavelength LED array set is received in the at least one concave groove. The conductive elements are electrically connected between drive IC structure and the multi-wavelength LED array set, respectively. The optical amplifier structure is disposed over the multi-wavelength LED array set for receiving light sources from the multi-wavelength LED array set.

Abstract: A symmetrical circuit layout structure includes a number of signal wires, a ground wire and a dielectric layer. The signal wires include a first portion placed on a first plane and a second portion placed on a second plane. The ground wire includes a first portion placed above the first portion of the signal wires and adjacent to the second portion of the signal wires, and a second portion placed below the second portion of the signal wires and adjacent to the first portion of the signal wires. The dielectric layer is placed between the first plane and the second plane.

Abstract: A projection apparatus includes an illuminating unit, an imaging unit, a lens unit, and a control unit. The illuminating unit includes a light source, and a light source driving module operable to drive the light source to provide an illumination beam. The imaging unit is operable so as to modulate the illumination beam into an image beam. The lens unit is disposed on an optical path of the image beam for projecting the image beam. The control unit is coupled electrically to the illuminating unit and the imaging unit. The control unit is configured to execute an activating thread for initializing the imaging unit after controlling initial driving of the light source by the light source driving module, and a monitoring thread for monitoring the light source driving module for a success signal that indicates successful provision of the illumination beam by the light source.

Abstract: An optical alignment method is for a light-emitting module that includes a housing unit, a light-emitting unit disposed in the housing unit, and a lens unit. The optical alignment method includes: (a) through image-capturing techniques, finding a light-emitting point of the light-emitting unit and a predetermined reference point, and determining a total optical path length between the light-emitting point and an imaging plane; (b) finding a first center line that divides the total optical path length in half; (c) through image-capturing techniques, finding opposite first and second edges of the lens unit, and determining a lens length between the first and second edges; (d) finding a second center line that divides the lens length in half; and (e) assembling the lens unit to the housing unit so that the first and second center lines overlap. A light-emitting module and an assembly method therefor are also disclosed.

Abstract: An optical alignment method is for a light-emitting module that includes a housing unit, a light-emitting unit disposed in the housing unit, and a lens unit. The optical alignment method includes: (a) through image-capturing techniques, finding a light-emitting point of the light-emitting unit and a predetermined reference point, and determining a total optical path length between the light-emitting point and an imaging plane; (b) finding a first center line that divides the total optical path length in half; (c) through image-capturing techniques, finding opposite first and second edges of the lens unit, and determining a lens length between the first and second edges; (d) finding a second center line that divides the lens length in half; and (e) assembling the lens unit to the housing unit so that the first and second center lines overlap. A light-emitting module and an assembly method therefor are also disclosed.

Abstract: A light-emitting module includes a base, a connecting unit disposed on the base, a light-emitting unit disposed on the base, and a drive unit electrically coupled to and bridging the connecting unit and the light-emitting unit for driving the light-emitting unit. The base includes a plurality of first bonding pads formed thereon. The connecting unit is electrically coupled to the first bonding pads, and the light-emitting unit is electrically coupled to the first bonding pads via the drive unit and the connecting unit. The connecting unit includes a plurality of connectors aligned in a first direction of the base, and the light-emitting unit includes a plurality of light-emitting elements aligned in the first direction and respectively spaced apart from and aligned with the connectors in a second direction perpendicular to the first direction.

Abstract: A method for rapidly identifying a point mutation in porcine insulin-like-growth factor 2 intron 7 uses published primers to amplify the target DNA fragments by polymerase chain reaction. The DNA fragments are cloned and sequenced for confirmation and method validation. The key positions of the sequence are modified to generate three primers for amplifying different DNA fragments with different genotypes by PCR to avoid additional restriction enzyme digestion. A long primer is used to specifically amplify the lean muscle mass-enhancing allele, a short primer is used to specifically amplify the lean muscle mass-suppressing allele, and the third primer is shared and anneals to the complementary strand. After PCR and electrophoresis, samples with only the 92 bp band are identified as the CC genotype, samples with only the 72 bp band are identified as the GG genotype, and samples with both 92 bp and 72 bp bands are identified as heterozygotes.

Abstract: A hockey table includes a table body, a top board mounted on a top of the table body and formed with a plurality of ventilating holes, and an atomizer mounted in the table body to spray an atomized gas which passes through the ventilating holes of the top board and protrudes outwardly from the top board. Thus, the atomized gas encompasses the top board to simulate a real and lively scene for the players to play the table hockey game, thereby enhancing the amusement effect of playing the hockey.

Abstract: A bottom board for a playing table includes a board body, at least one anti-slip cloth layer enclosed around the board body entirely, and at least one fiber cloth layer enclosed around the anti-slip cloth layer entirely. Each of the board body, the anti-slip cloth layer and the fiber cloth layer has a surface sprayed with a resin layer. Thus, the bottom board has a reinforced hardness, so that the bottom board will not be dimpled due to a violent hit, thereby enhancing the lifetime of the bottom board. In addition, the bottom board is formed integrally and has a smaller volume and a light weight, thereby facilitating assembly, transportation and storage of the bottom board. Further, the bottom board has a waterproof feature so that the bottom board can be used outdoors.

Abstract: An optical alignment method is for an optical module including a housing unit, a light-sensing unit, and a lens unit. The method includes: (a) through image-capturing techniques, finding a light-sensing component of the light-sensing unit and a predetermined reference point, and determining an actual total optical path length between the light-sensing component and an object position; (b) subtracting a correction distance from the actual total optical path length to obtain a corrected total optical path length; (c) finding a first center line that divides the corrected total optical path length in half; (d) through image-capturing techniques, finding opposite first and second edges of the lens unit, and determining a lens length between the first and second edges; (e) finding a second center line that divides the lens length in half; and (f) assembling the lens unit to the housing unit such that the first and second center lines overlap.

Abstract: A pallet assembly is composed of multiple pallet pieces and multiple wedging elements. Each pallet piece has four corners with four individual legs and multiples engaging holes defined on sides of the pallet piece. Each leg is rectangular in transversal cross-section and selectively has a mortise or a tenon to detachably and engages with other corresponding leg on an adjacent stacked pallet piece in the pallet assembly. Moreover, each wedging element is clamped between two adjacent juxtaposed pallet pieces to widen the pallet assembly. Thereby, the pallet assembly is versatile in changing sizes, easy to be assembled and disassembled, stable in use and convenient in storage.

Abstract: A semiconductor wafer is disclosed that includes a plurality of fields, including a plurality of alignment fields. Each alignment field includes a plurality of intra-field small scribe lane primary mark (SSPM) overlay mark pairs there around. The SSPM mark pairs allow for in-situ, non-passive intra-field alignment correction. In one embodiment, there may be between two and four alignment fields, and between two and four SSPM mark pairs around each alignment field. The SSPM marks of each mark pair may be extra scribe-lane marks.

Abstract: A RFID system applying to a three-dimensional jigsaw is provided. The RFID system includes a jigsaw substrate having a plurality of blocks, a plurality of jigsaw units corresponding to each blocks of the jigsaw substrate, a RFID reader having a plurality of antennas positioned in a position of each blocks of the jigsaw substrate, and a plurality of tags positioned in a position of each face of a three-dimensional jigsaw unit corresponding to the positions of the antennas, wherein the RFID reader communicates to the tags using modulated radio signals through the antennas and the tags respond with modulated radio signals in order to determine whether the orientation of the three-dimensional jigsaw unit is correct or not.

Abstract: The light emitting module includes a substrate, a light emitting element and a driving circuit chip. The light emitting element is attached to the substrate and has a plurality of first contacts on a top surface thereof. The driving circuit chip is attached onto the substrate and has a plurality of second contacts in direct connection to the first contacts one on one when being placed above the light emitting element.

Abstract: A light emitting module includes a substrate, a driving circuit chip, a light emitting element and a connector. By providing the connector with conductive bumps and arranging it as a flip chip to contact the conductive bumps with bond pads of the driving circuit chip and the light emitting element, a light emitting module with a reduced bonding pitch but reliable performance can be produced. Alternatively, it can be the driving circuit chip instead of the connector functioning as a flip chip. The driving circuit chip includes conductive bumps in contact with bond pads of the light emitting element and the connector.

Abstract: A symmetrical circuit layout structure includes a number of signal wires, a ground wire and a dielectric layer. The signal wires include a first portion placed on a first plane and a second portion placed on a second plane. The ground wire includes a first portion placed above the first portion of the signal wires and adjacent to the second portion of the signal wires, and a second portion placed below the second portion of the signal wires and adjacent to the first portion of the signal wires. The dielectric layer is placed between the first plane and the second plane.