Abstract: An automatic vehicle positioning management system includes an on-vehicle apparatus and a portable device. The on-vehicle apparatus, installed on a vehicle, acquires a first location of the vehicle through wireless positioning. The first location is sent to the portable device which acquires a second location of the vehicle through GPS. When multiple vehicles form a fleet, each vehicle respectively sends its first and second locations to a server through its portable device. The second location of each vehicle is corrected by operations of point error analysis, image overlay and point error correction, so that the fleet can be managed more precisely.

Abstract: An automatic vehicle positioning management system includes an on-vehicle apparatus and a portable device. The on-vehicle apparatus, installed on a vehicle, acquires a first location of the vehicle through wireless positioning. The first location is sent to the portable device which acquires a second location of the vehicle through GPS. When multiple vehicles form a fleet, each vehicle respectively sends its first and second locations to a server through its portable device. The second location of each vehicle is corrected by operations of point error analysis, image overlay and point error correction, so that the fleet can be managed more precisely.

Abstract: A contact detection circuit is applied to a four-terminal measurement device. The contact detection circuit comprises a first isolator, a signal generator, a multiplier and a calculator. The first isolator comprises a primary side and a secondary side, with the secondary side comprising a first terminal and a second terminal, with the first terminal configured to be electrically connected to a driving terminal and the second terminal configured to be electrically connected to a measuring terminal. The signal generator is configured to provide a measuring signal. The multiplier is configured to generate an output signal based on the measuring signal and a first reflected signal when the first reflected signal is induced at the primary side of the first isolator based on the measuring signal. The calculator calculates contact resistance between the driving terminal and the measuring terminal based on a direct-current component of the output signal.

Abstract: An output control method for a controller includes the following steps. At each of detection time points, the controller detects a detection voltage value and a detection current value of a load. In a voltage control mode, the controller generates a setting parameter to control the power amplifier according to part of the detection voltage values. In a current control mode, the controller generates the setting parameter to control the power amplifier according to part of the detection current values. When the controller switches to the voltage control mode or the current control mode, the controller determines a ratio between the detection current value and the detection voltage value at one of the detection time points and the setting parameter is generated according to the ratio. Therefore, the bandwidth is substantially the same no matter if the controller operates in the voltage control mode or the current control mode.

Abstract: A chip package includes a patterned conducting plate having a plurality of conducting sections electrically separated from each other, a plurality of conducting pads disposed on an upper surface of the patterned conducting plate, wherein a recess extending from a surface of one of the conducting pads towards an inner portion of the corresponding one of the conducting pads, a chip disposed on the conducting pads, a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate, and an insulating support layer partially surrounding the conducting bumps.

Abstract: A contact detection circuit is applied to a four-terminal measurement device. The contact detection circuit comprises a first isolator, a signal generator, a multiplier and a calculator. The first isolator comprises a primary side and a secondary side, with the secondary side comprising a first terminal and a second terminal, with the first terminal configured to be electrically connected to a driving terminal and the second terminal configured to be electrically connected to a measuring terminal. The signal generator is configured to provide a measuring signal. The multiplier is configured to generate an output signal based on the measuring signal and a first reflected signal when the first reflected signal is induced at the primary side of the first isolator based on the measuring signal. The calculator calculates contact resistance between the driving terminal and the measuring terminal based on a direct-current component of the output signal.

Abstract: An output control method for a controller includes the following steps. At each of detection time points, the controller detects a detection voltage value and a detection current value of a load. In a voltage control mode, the controller generates a setting parameter to control the power amplifier according to part of the detection voltage values. In a current control mode, the controller generates the setting parameter to control the power amplifier according to part of the detection current values. When the controller switches to the voltage control mode or the current control mode, the controller determines a ratio between the detection current value and the detection voltage value at one of the detection time points and the setting parameter is generated according to the ratio. Therefore, the bandwidth is substantially the same no matter if the controller operates in the voltage control mode or the current control mode.

Abstract: A wafer-level lens structure for contact image sensor (CIS) module includes a printed circuit board (PCB) and an image sensor electrically connected to the PCB and comprising a circuit area and a light sensitive area. The light sensitive area comprises an optoelectronic conversion array, a first lens array arranged on the optoelectronic conversion array and comprising a plurality of first cover lens, each of first cover lens having a first curved face to focus the external image light to the optoelectronic conversion array, and an aperture array arranged on the first lens array and comprising a plurality of apertures to expose the first curved face, the aperture array controlling a light amount passing through the cover lens. The first curved face of the cover lens has such a curvature that a predetermined focus point can be achieved by the plurality of first cover lens.

Abstract: A wafer-level lens structure for contact image sensor (CIS) module includes a printed circuit board (PCB) and an image sensor electrically connected to the PCB and comprising a circuit area and a light sensitive area. The light sensitive area comprises an optoelectronic conversion array, a first lens array arranged on the optoelectronic conversion array and comprising a plurality of first cover lens, each of first cover lens having a first curved face to focus the external image light to the optoelectronic conversion array, and an aperture array arranged on the first lens array and comprising a plurality of apertures to expose the first curved face, the aperture array controlling a light amount passing through the cover lens. The first curved face of the cover lens has such a curvature that a predetermined focus point can be achieved by the plurality of first cover lens.

Abstract: A chip package includes a patterned conducting plate having a plurality of conducting sections electrically separated from each other, a plurality of conducting pads disposed on an upper surface of the patterned conducting plate, wherein a recess extending from a surface of one of the conducting pads towards an inner portion of the corresponding one of the conducting pads, a chip disposed on the conducting pads, a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate, and an insulating support layer partially surrounding the conducting bumps.

Abstract: A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.

Abstract: According to an embodiment of the present invention, a chip package is provided. The chip package includes: a patterned conducting plate having a plurality of conducting sections electrically separated from each other; a plurality of conducting pads disposed on an upper surface of the patterned conducting plate; a chip disposed on the conducting pads; a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; and an insulating support layer partially surrounding the conducting bumps.

Abstract: Described herein are techniques pertaining to real-time propagation of an arbitrary audio signal in a fixed virtual environment with dynamic audio sources and receivers. A wave-based numerical simulator is configured to compute response signals in the virtual environment with respect to a sample signal at various source and receiver locations. The response signals are compressed and placed in the frequency domain to generate frequency responses. Such frequency responses are selectively convolved with the arbitrary audio signal to allow real-time propagation with moving sources and receivers in the virtual environment.

Abstract: According to an embodiment of the present invention, a method for forming a chip package is provided. The method includes: providing a conducting plate, wherein a plurality of conducting pads are disposed on an upper surface of the conducting plate; forming a plurality of conducting bumps on a lower surface of the conducting plate; patterning the conducting plate by removing a portion of the conducting plate, wherein the patterned conducting plate has a plurality of conducting sections electrically insulated from each other, and each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; forming an insulating support layer to partially surround the conducting bumps; and disposing a chip on the conducting pads.

Abstract: A solar cell testing system includes a multifunctional testing light source, a measuring unit, and an arithmetic unit. The multifunctional testing light source is configured to be switched to output a simulated solar light to a solar cell or asynchronously output a plurality of narrowband lights to the solar cell. The measuring unit is coupled to the solar cell and measures the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights. The arithmetic unit is coupled to the multifunctional testing light source and the measuring unit; it determines the solar cell's conversion efficiency and spectral response based on the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights.

Abstract: The present invention provides a power bank comprising a battery protection board, controller board, and a host connector. The host connector is compatible with an accessory connector on a fast charger board, and the host connector is connected to the accessory connector for boosting the charging rate of the power bank. The fast charger board connected to the power bank may, for powering laptops and electric bicycles, elevate the output voltage of the power bank to 12V or above. The power bank may further connect with other external components, such as an LED module and a wireless transceiver module, in order to extend the functionality of the power bank.

Abstract: The present invention relates to a portable power bank comprising a battery pack, a first control module and a second control module, wherein the battery pack further comprises at least two cells connected in series, and wherein the first control module and the second control module both electrically connected to a first terminal and a second terminal of the battery pack; the first controller is configured for regulating the DC input voltage for charging the battery pack and the second controller is configured for regulating the DC output voltage for charging an external device.

Abstract: One of the advantages of direct frequency synthesis technique (e.g., flying-adder architecture) is its capability of generating arbitrary frequency by utilizing the time-average-frequency concept. In the clock output of the direct frequency synthesizer, instead of one type of cycle, there are two types of cycles. Unlike the conventional one-type-cycle clock wherein clock energy is concentrated at its designed frequency, Time-Average-Frequency based clock spreads some of its energy into spurious tones, which could be harmful to certain applications. The spurious tones are caused by the periodic carry sequence generated from a fractional part accumulator inside the frequency synthesizer. The invention suggests a method and an apparatus to break this periodicity and convert the spurious tones into broadband noise.

Abstract: A contact image sensing device includes a housing, a light emitting unit, a red lens array, a sensing unit, and a protecting component. The housing includes a top surface, a bottom surface, an accommodating groove, and a slot. The bottom surface is opposite to the top surface. The accommodating groove is formed on the top surface and concave toward to bottom surface. The slot penetrates the top surface and the bottom surface. The light-emitting unit is arrange within the accommodating groove. The rod lens array is arranged within the slot. The sensing unit is arranged below the housing. The protecting component includes a main body, a recess, and a lighting slot communicating with the recess, a top end of the rod lens array is assembled with the recess. The main body of the protecting member forms at least one containing recess. A combining component for combining the rod lens array and the protecting member is disposed within the containing recess.

Abstract: According to an embodiment of the present invention, a method for forming a chip package is provided. The method includes: providing a conducting plate, wherein a plurality of conducting pads are disposed on an upper surface of the conducting plate; forming a plurality of conducting bumps on a lower surface of the conducting plate; patterning the conducting plate by removing a portion of the conducting plate, wherein the patterned conducting plate has a plurality of conducting sections electrically insulated from each other, and each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; forming an insulating support layer to partially surround the conducting bumps; and disposing a chip on the conducting pads.