Abstract: The invention employs a group of LED devices as a light source for emitting light with different wavelengths towards the solar cell under test. A set of test signal data composed of mutually orthogonal test signals are used to power the LED devices to emit light. The solar cell, upon receiving light from the LED devices powered by the test signal data, generates detected values which are in turn converted into electric signals. A processor device is then used to separate component signals contributed by the respective LED devices from the signals and compare the component signals to the output power level corresponding to the test signal data and/or to the optical energy levels radiated from the respective LED devices, thereby obtaining the spectral response of the solar cell to the different wavelengths of light.

Abstract: A sunlight simulator and solar cell measuring device consisting of detecting device is disclosed, in which the housing is a closed space consisting of an opening gate, the closed space is internally installed with a light source which is used to emit a light toward the opening gate, and a splitting unit is installed on the travelling path of the light for dividing the light into a first light-beam and a second light-beam, herein the first light-beam is projected onto the solar cell under measurement located at the opening gate as a solar cell measuring device; in addition, a detecting device is installed on the travelling path of the second light-beam for receiving the second light-beam, and then a signal can be outputted by the detecting device in order to monitor the irradiation variation of the light emitted by the light source, thus ensuring the precision of the solar cell measurement.

Abstract: An image sensor package includes a substrate, an image sensor chip, a plurality of metal wires and an encapsulant. The substrate has an upper face, a lower face and a plurality of connecting pads arranged on the upper face. The image sensor chip has an active surface, a back surface opposite to the active surface and a plurality of bonding pads arranged on the active surface. The metal wires electrically connect the bonding pads of the image sensor chip to the connecting pads of the substrate. The transparent cover is arranged above the image sensor chip. A gap is formed between the transparent cover and the image sensor chip. The encapsulant is disposed around the transparent cover and the metal wires, and is used for sealing the metal wires and fixing the transparent cover above the image sensor chip.

Abstract: Described herein are techniques pertaining to real-time propagation of an arbitrary audio signal in a fixed virtual environment with dynamic audio sources and receivers. A wave-based numerical simulator is configured to compute response signals in the virtual environment with respect to a sample signal at various source and receiver locations. The response signals are compressed and placed in the frequency domain to generate frequency responses. Such frequency responses are selectively convolved with the arbitrary audio signal to allow real-time propagation with moving sources and receivers in the virtual environment.

Abstract: A method for reducing resonance energy of an LCD panel includes providing a plurality of driving signal patterns, each defining a non-overlap area width of a synchronization signal and a scan-line charging frequency, and determining an order of the plurality of driving signal patterns to modulate driving signals of the LCD panel accordingly.

Abstract: A method for reducing leakage current in a semiconductor capacitor. The method includes providing a top plate for collecting charge, providing a bottom plate for collecting an opposing charge to the top plate, providing a dielectric layer for insulation between the top plate and the bottom plate, providing a top contact, providing a bottom contact, providing a plurality of vias including top level vias for connecting the top plate to the top contact, and bottom level vias for connecting the bottom plate to the bottom contact; and separating a via and an adjacent structure such that their distance is greater than a minimum via spacing requirement of a foundry design rule for a semiconductor process producing the semiconductor capacitor.

Abstract: A power-saving control circuit and method suitable for circuits including a first-in-first-out (FIFO) register is provided. In the present invention, a logic circuit is disposed between two circuit modules with data transmitted in between. When there is data input into the FIFO register, the logic circuit activates a pulse signal of the circuit module in the receiving end for reading the data. When all the data stored in the FIFO register is read, the pulse signal is turned off so that the power consumed by the pulse signal is reduced without affecting the data transmitting efficiency and the purpose of power-saving is achieved.

Abstract: A power-saving device for a driving circuit of a liquid crystal display panel is provided. The device comprises a first switch, a first capacitor, a second switch, a second capacitor, a third switch, an output buffer and a common electrode or a data line. The first capacitor and the second capacitor are coupled to the common electrode or the data line through the first switch and the second switch respectively. The output buffer is coupled to the common electrode or the data line through the third switch. The output buffer charges or discharges a ground-referenced equivalent capacitor of the data line or the common electrode. The device uses the switches to conduct positive and negative electric charges to the capacitors so that charges produced during the charging and discharging in the driving circuits of the common electrodes and data line can be stored and recycled to avoid unnecessary power waste.

Abstract: A method for reducing leakage current in a semiconductor capacitor. The method includes providing a top plate for collecting charge, providing a bottom plate for collecting an opposing charge to the top plate, providing a dielectric layer for insulation between the top plate and the bottom plate, providing a top contact, providing a bottom contact, providing a plurality of vias including top level vias for connecting the top plate to the top contact, and bottom level vias for connecting the bottom plate to the bottom contact; and separating a via and an adjacent structure such that their distance is greater than a minimum via spacing requirement of a foundry design rule for a semiconductor process producing the semiconductor capacitor.

Abstract: A method of fabricating a CCDM scan module applied for image scan. A circuit board on which electronic devices are mounted is provided. A photo-detector and an integrated circuit device which is either packaged or unpackaged are also mounted on the circuit board to form an image sensor board. The electric connection between the photo-detector, the IC devices and the circuit board is established by wire-bonding technique. A module base is provided, and at least one reflection mirror and one transmission lens are mounted on the module base at predetermined positions. The image sensor board is then mounted on the module base at a position aligned with the lens for focusing an image.