Patents by Inventor Ming-Fu Tsai

Ming-Fu Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240387507
    Abstract: A method of making a semiconductor device includes manufacturing lines extending in a first direction over doped zones in a substrate, wherein each of the lines has a line width measured along a first direction. The method further includes trimming the lines into line segments having ends over an isolation structure. The method further includes etching a transistor gate electrode over the substrate, wherein transistor gate electrode has a gate electrode width measured along the first direction, and the line width is substantially similar to the gate electrode width.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 21, 2024
    Inventors: Li-Wei CHU, Wun-Jie LIN, Yu-Ti SU, Ming-Fu TSAI, Jam-Wem LEE
  • Publication number: 20240355628
    Abstract: A wafer processing method including following steps is provided. A release layer is formed on a first wafer. An adhesive layer is formed on a second wafer. One of the first wafer and the second wafer is a device wafer. The device wafer includes a valid die region and a trimming region. A handler is applied to place the first wafer on the second wafer, so that the release layer and the adhesive layer are bonded to each other, and the adhesive layer completely covers the valid die region. During the process of placing the first wafer on the second wafer, the handler directly moves the first wafer.
    Type: Application
    Filed: May 23, 2023
    Publication date: October 24, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Chun-Fu Wu, Shih-Ping Lee, Yu-Chun Huo, Chih Feng Sung, Ming-Jui Tsai
  • Publication number: 20240347496
    Abstract: An electronic device includes an electronic unit, an encapsulation layer surrounding the electronic unit, a circuit structure electrically connected to the electronic unit and a bonding component. The circuit structure includes a first metal layer electrically connected to the electronic unit, a first dielectric layer disposed on the first metal layer and having an opening and a second metal layer disposed in the opening. The bonding component overlaps the second metal layer, and at least partially disposed in the opening. In cross-sectional view, a first height between a first dielectric layer top surface and a first metal layer top surface is greater than a second height between a second metal layer top surface and the first metal layer top surface. A difference between the first height and the second height is greater than or equal to 1 ?m and less than or equal to 15 ?m.
    Type: Application
    Filed: March 13, 2024
    Publication date: October 17, 2024
    Applicant: InnoLux Corporation
    Inventors: Ker-Yih KAO, Wen-Hsiang LIAO, Ming-Hsien SHIH, Cheng-Tse TSAI, Yen-Fu LIU
  • Publication number: 20240332158
    Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.
    Type: Application
    Filed: March 7, 2024
    Publication date: October 3, 2024
    Inventors: Ker-Yih KAO, Yen-Fu LIU, Wen-Hsiang LIAO, Te-Hsun LIN, Ju-Li WANG, Dong-Yan YANG, Ming-Hsien SHIH, Cheng-Tse TSAI
  • Patent number: 12100702
    Abstract: A method of making a semiconductor device includes manufacturing doped zones in a first semiconductor material over a substrate. The method further includes forming an isolation structure between adjacent doped zones of the first semiconductor material. The method further includes manufacturing lines extending in a first direction over the doped zones of the first semiconductor material, wherein each of the lines has a line width measured along a second direction perpendicular to the first direction. The method further includes trimming the lines into line segments having ends over the isolation structure. The method further includes etching a transistor gate electrode over the substrate, wherein transistor gate electrode has a gate electrode width measured along the second direction, and wherein the line width is substantially similar to the gate electrode width.
    Type: Grant
    Filed: October 18, 2023
    Date of Patent: September 24, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Li-Wei Chu, Wun-Jie Lin, Yu-Ti Su, Ming-Fu Tsai, Jam-Wem Lee
  • Publication number: 20240272616
    Abstract: A control method applied to a servomotor, wherein the servomotor includes a motor, and the control method includes: setting a mode of the servomotor as a predetermined mode corresponding to a predetermined communication protocol; receiving an input signal from a controller for controlling the motor, wherein the controller is coupled to the servomotor; and switching the mode of the servomotor from the predetermined mode to one of a plurality of candidate modes according to a frequency of the input signal.
    Type: Application
    Filed: February 15, 2023
    Publication date: August 15, 2024
    Applicant: Elite Semiconductor Microelectronics Technology Inc.
    Inventors: Ming-Fu Tsai, Sheng-Hung Hsu
  • Patent number: 12057647
    Abstract: An antenna module includes a first board, a connecting board, a second board, an antenna radiator, and a circuit reference ground. The first board at least includes a first end. The connecting board has a first and a second connection end. The second board includes a second end and a bottom end. The second board and the connecting board are made of different materials. The antenna radiator extends along the extending direction of the connecting board and the second board, and defines a first and a second radiation end. The circuit reference ground extends along the extending direction of the first board, the connecting board, and the second board, and defines a first reference end formed on the first board and a second reference formed on the second board. The circuit reference ground and the antenna radiator are spaced apart and form an interval.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: August 6, 2024
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Wei Sheng Liao, Tien-Fu Hung, Ming-Hung Tsai
  • Patent number: 12051896
    Abstract: A device is disclosed herein. The device includes a bias generator, an ESD driver, and a logic circuit. The bias generator includes a first transistor. The ESD driver includes a second transistor and a third transistor coupled to each other in series. The logic circuit is configured to generate a logic control signal. When the first transistor is turned on by a detection signal, the first transistor is turned off.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Lin Peng, Yu-Ti Su, Chia-Wei Hsu, Ming-Fu Tsai, Shu-Yu Su, Li-Wei Chu, Jam-Wem Lee, Chia-Jung Chang, Hsiang-Hui Cheng
  • Publication number: 20240222363
    Abstract: A semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. The first diode is coupled between an input/output (I/O) pad and a first voltage terminal. The second diode is coupled with the first diode, the I/O pad and a second voltage terminal. The clamp circuit is coupled between the first voltage terminal and the second voltage terminal. The second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (ESD) current flowing between the I/O pad and the first voltage terminal. The third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the ESD current flowing between the I/O pad and the first voltage terminal.
    Type: Application
    Filed: March 14, 2024
    Publication date: July 4, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Lin PENG, Li-Wei CHU, Ming-Fu TSAI, Jam-Wem LEE, Yu-Ti SU
  • Patent number: 12002706
    Abstract: Methods and devices are provided herein for enhancing robustness of a bipolar electrostatic discharge (ESD) device. The robustness of a bipolar ESD device includes providing an emitter region and a collector region adjacent to the emitter region. An isolation structure is provided between the emitter region and the collector region. A ballasting characteristic at the isolation structure is modified by inserting at least one partition structure therein. Each partition structure extends substantially abreast at least one of the emitter and the collector regions.
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Alexander Kalnitsky, Jen-Chou Tseng, Chia-Wei Hsu, Ming-Fu Tsai
  • Publication number: 20240178216
    Abstract: A semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.
    Type: Application
    Filed: February 7, 2024
    Publication date: May 30, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Lin PENG, Li-Wei CHU, Ming-Fu TSAI, Jam-Wem LEE, Yu-Ti SU
  • Patent number: 11961834
    Abstract: A semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. The first diode is coupled between an input/output (I/O) pad and a first voltage terminal. The second diode is coupled with the first diode, the I/O pad and a second voltage terminal. The clamp circuit is coupled between the first voltage terminal and the second voltage terminal. The second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (ESD) current flowing between the I/O pad and the first voltage terminal. The third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the ESD current flowing between the I/O pad and the first voltage terminal.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Lin Peng, Li-Wei Chu, Ming-Fu Tsai, Jam-Wem Lee, Yu-Ti Su
  • Publication number: 20240120735
    Abstract: An electrostatic discharge (ESD) circuit includes a first ESD detection circuit, a first discharging circuit and a first ESD assist circuit. The first ESD detection circuit is coupled between a first node having a first voltage and a second node having a second voltage. The first discharging circuit includes a first transistor. The first transistor has a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to the first ESD detection circuit by a third node. The first drain is coupled to the first node. The first source and the first body terminal are coupled together at the second node. The first ESD assist circuit is coupled between the second and third node, and configured to clamp a third voltage of the third node at the second voltage during an ESD event at the first or second node.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Chia-Lin HSU, Ming-Fu TSAI, Yu-Ti SU, Kuo-Ji CHEN
  • Patent number: 11929363
    Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Lin Peng, Li-Wei Chu, Ming-Fu Tsai, Jam-Wem Lee, Yu-Ti Su
  • Publication number: 20240047453
    Abstract: A method of making a semiconductor device includes manufacturing doped zones in a first semiconductor material over a substrate. The method further includes forming an isolation structure between adjacent doped zones of the first semiconductor material. The method further includes manufacturing lines extending in a first direction over the doped zones of the first semiconductor material, wherein each of the lines has a line width measured along a second direction perpendicular to the first direction. The method further includes trimming the lines into line segments having ends over the isolation structure. The method further includes etching a transistor gate electrode over the substrate, wherein transistor gate electrode has a gate electrode width measured along the second direction, and wherein the line width is substantially similar to the gate electrode width.
    Type: Application
    Filed: October 18, 2023
    Publication date: February 8, 2024
    Inventors: Li-Wei CHU, Wun-Jie LIN, Yu-Ti SU, Ming-Fu TSAI, Jam-Wem LEE
  • Patent number: 11855452
    Abstract: An ESD power clamp device includes an ESD detection circuit; a controlling circuit coupled with the ESD detection circuit; a field effect transistor (FET) coupled with the controlling circuit, and an impedance element coupled with the FET. The FET includes a drain terminal coupled with a first supply node; a gate terminal coupled with the controlling circuit; a source terminal coupled with a second supply node via the impedance element; and a bulk terminal coupled with second supply node.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ken-Hao Fan, Yu-Ti Su, Tzu-Cheng Kao, Ming-Fu Tsai, Chia-Lin Hsu
  • Patent number: 11848554
    Abstract: An electrostatic discharge (ESD) circuit includes an ESD detection circuit, a clamp circuit and an ESD assist circuit. The ESD detection circuit is coupled between a first and a second node. The first node has a first voltage. The second node has a second voltage. The clamp circuit includes a first transistor having a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to at least the ESD detection circuit by a third node. The first drain is coupled to the second node. The first source and the first body terminal are coupled together at the first node. The ESD assist circuit is coupled between the first node and the third node, and is configured to clamp a third voltage of the third node at the first voltage during an ESD event at the first node or the second node.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: December 19, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Lin Hsu, Ming-Fu Tsai, Yu-Ti Su, Kuo-Ji Chen
  • Patent number: 11837598
    Abstract: A semiconductor device includes a first doped zone and a second doped zone in a first semiconductor material, the first doped zone being separated from the second doped zone; an isolation structure between the first doped zone and the second doped zone; and a first line segment over a top surface of the first doped zone, where the ends of the first line segment and the ends of the second line are over the isolation structure. The first line segment and the second line segment have a first width; and a dielectric material is between the first line segment and the second line segment and over the isolation structure. The first width is substantially similar to a width of a gate electrode in the semiconductor device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: December 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Li-Wei Chu, Wun-Jie Lin, Yu-Ti Su, Ming-Fu Tsai, Jam-Wem Lee
  • Publication number: 20230352338
    Abstract: Methods and devices are provided herein for enhancing robustness of a bipolar electrostatic discharge (ESD) device. The robustness of a bipolar ESD device includes providing an emitter region and a collector region adjacent to the emitter region. An isolation structure is provided between the emitter region and the collector region. A ballasting characteristic at the isolation structure is modified by inserting at least one partition structure therein. Each partition structure extends substantially abreast at least one of the emitter and the collector regions.
    Type: Application
    Filed: July 3, 2023
    Publication date: November 2, 2023
    Inventors: Alexander Kalnitsky, Jen-Chou Tseng, Chia-Wei Hsu, Ming-Fu Tsai
  • Patent number: 11777424
    Abstract: A method for determining an initial rotor position of a permanent magnet synchronous motor (PMSM) includes: generating a plurality of transient currents by applying a plurality of voltages to each phase stator winding of a three phase stator winding of the PMSM; generating three phase current differences according to the plurality of transient currents; determining a first zone in which the initial rotor position of the PMSM is located according to the three phase current differences, wherein angles between 0-360 degrees are divided into a plurality of zones, and the first zone is selected from the plurality of zones; calculating three line current differences according to the three phase current differences; and determining the initial rotor position of the PMSM according to the first zone and the three line current differences.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: October 3, 2023
    Assignee: Elite Semiconductor Microelectronics Technology Inc.
    Inventors: Shih-Chieh Wang, Yong-Yi Jhuang, Ming-Fu Tsai