Abstract: Proteins that bind IL-1? and IL-1? are described along with their use in compositions and methods for treating, preventing, and diagnosing IL-1-related disorders and for detecting IL-1? and IL-1? in cells, tissues, samples, and compositions.

Abstract: Proteins that bind IL-1? and IL-1? are described along with their use in compositions and methods for treating, preventing, and diagnosing IL-1-related disorders and for detecting IL-1? and IL-1? in cells, tissues, samples, and compositions.

Abstract: One embodiment relates to a method to achieve enhanced overlay control while maintaining manufacturing throughput for a fabrication process. Locations of a plurality of alignment structures on a wafer comprising a plurality of reticle fields are determined with a layout tool to define a layout-based wafer map. The topography of the wafer is then measured as a function of wafer position by a surface measuring tool. The layout-based wafer map is then projected onto the measured wafer topography to define a modeled wafer map. A subset of alignment structure locations are measured with an alignment tool in an in-line fabrication flow so as not to delay subsequent fabrication steps. Disagreement between the measured alignment structure locations and modeled alignment structure locations is then minimized mathematically to enhance overlay control while maintaining manufacturing throughput.

Abstract: Proteins that bind IL-1? and IL-1? are described along with their use in compositions and methods for treating, preventing, and diagnosing IL-1-related disorders and for detecting IL-1? and IL-1? in cells, tissues, samples, and compositions.

Abstract: Proteins that bind IL-1? and IL-1? are described along with their use in compositions and methods for treating, preventing, and diagnosing IL-1-related disorders and for detecting IL-1? and IL-1? in cells, tissues, samples, and compositions.

Abstract: A server room power management apparatus and method, the power management apparatus comprising a first PDE (power distribution equipment), at least one second PDE and at least one DM (digital meter); wherein a first network interface unit of the first PDE, a second network interface unit of the second PDE and the DM can be connected to become a network; the power management method uses a first processor of the first PDE to collect power consumptions of the second PDE and the DM; wherein, the first processor can work out power usage effectiveness; thus, the apparatus and method do not need an independent server device, that will reach power saving and reduce apparatus costs.

Abstract: In one example, a processor may schedule a processing thread for execution based on a dynamic scheduling priority. A memory may associate a scheduling priority with a processing thread. A scheduler may adjust the scheduling priority based on a time frame. The scheduler may set a processing schedule for execution of the processing thread based on a scheduling parameter set including the scheduling priority. At least one processing core may execute the processing thread based on the processing schedule.

Abstract: The present application relates to isolated proteins, particularly monoclonal antibodies, in particular CDR-grafted, humanized antibodies which bind to RAGE protein. Specifically, these antibodies have the ability to inhibit the binding of RAGE to its various ligands. The antibodies or portions thereof of described in the present application are useful for treating a disease or disorder characterized by or induced by pathophysiological ligands of RAGE, for example missfolded proteins like amyloid ? and advanced glycation-end-products.

Abstract: A UPS system with network monitoring and attached battery pack information sensing functions includes a UPS apparatus including a UPS body and a UPS monitoring module, and attached battery packs coupled to the UPS body. Each attached battery pack includes a battery pack body, and a battery pack monitoring module that includes a control unit, a sensor module for detecting the status information of the battery pack body, a memory, and a network interface for communication with the UPS monitoring module through a local area network to transmit the status information of the battery pack body. When the battery pack monitoring module transmits the status information to the UPS monitoring module, the manager can link a web browser of an external equipment to a battery pack status page provided by a built-in web server of the UPS monitoring module to get the status information of every attached battery pack.

Abstract: The present disclosure illustrates a cabinet type on-site monitoring device, which comprises a monitoring module and a positioning mechanism, and monitoring method thereof. The monitoring module can automatically detect an electric apparatus installed inside a cabinet for monitoring, and a main body can be combined on a casing structure, or the casing structure is movably pivoted on a cabinet door by using a positioning component and hang holes or a through hole on a support. Manager can watch the monitoring device via window or directly to look over current operation status of respective electric apparatus without opening the cabinet door. A sound or visible warning action is performed when the monitoring module automatically detects and gets real-time status data of any of electric apparatus exceeding a setting normal range, so as to increase convenience and flexibility of on-site immediate management, and keep the electric apparatus operate more efficiently.

Abstract: This invention is directed to the transformation of yeast, and mutants thereof, by electroporation, which result in stably transformed yeast host cells that express recombinant products. This invention also is directed to transformed yeast cells and libraries.

Abstract: An olefin-metathesis catalyst is provided. The olefin-metathesis catalyst includes a magnetic carrier, a polymer having formula (I) grafted on the magnetic carrier, and a ruthenium complex loaded on the polymer. A method for preparing low-molecular-weight nitrile butadiene rubber is also provided. In formula (I), one of X, Y and Z is nitrogen atom, the others are carbon atoms, R1 and R2, independently, include hydrogen, ester group, C1-10 alkyl group, C3-8 cycloalkyl group, 4-ring to 8-ring heterocycloalkyl or C6-10 aryl group, R3 includes hydrogen or C1-10 alkyl group, m ranges from 10 to 2,000, and n ranges from 0 to 1,000.

Abstract: Some embodiments of the present disclosure provide a method of manufacturing a semiconductor device including receiving a FinFET precursor including a fin structure formed between isolation regions, and a gate structure formed over a portion of the fin structure such that a sidewall of the fin structure is in contact with a gate spacer of the gate structure; patterning the fin structure to comprise a pattern of at least one upward step rising from the isolation region; forming a capping layer over the fin structure, the isolation region, and the gate structure; performing an annealing process on the FinFET precursor to form at least two dislocations along the upward step; and removing the capping layer.

Abstract: Proteins that bind IL-1? and IL-1? are described along with their use in compositions and methods for treating, preventing, and diagnosing IL-1-related disorders and for detecting IL-1? and IL-1? in cells, tissues, samples, and compositions.

Abstract: A touch panel is provided. The touch panel includes: a substrate, wherein the substrate includes a viewing region and a border region at an edge of the viewing region; a patterned transparent conductive layer formed on the substrate, wherein the patterned transparent conductive layer is formed on the viewing region and the border region, and the patterned transparent conductive layer has a touch sensitive function; and a patterned metal layer formed on the border region, wherein the patterned metal layer includes a contact region and a trace region connecting to the contact region, and at least a portion of the contact region overlaps with the patterned transparent conductive layer, wherein a shift range between the contact region and the patterned transparent conductive layer disposed on the border region adjacent to the contact region is smaller than about 150 ?m.

Abstract: An uninterruptible power supply system including a rectification circuit, a power calibrating conversion circuit, an inverting conversion circuit, an LC circuit, a first output switch, a second output switch and a relay switch is disclosed. The rectification circuit couples to the main electricity. The power calibrating conversion circuit couples to the rectification circuit, and includes an independent drive unit and a switch unit. The inverting conversion circuit couples to the power calibrating conversion circuit. The LC circuit couples between output neutral terminal and output ground terminal. The first output switch couples between the LC circuit and the inverting conversion circuit. The second output switch couples between the inverting conversion circuit and output live terminal. The relay switch couples between the input neutral terminal and the LC circuit. When the relay switch turns on, the input neutral terminal connects with the output neutral terminal through the LC circuit.

Abstract: A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.

Abstract: A LGF roll-to-roll manufacturing includes the steps of: preparing a first optical layer with a first surface and a second surface; mechanically extruding a first integrated microstructure on the first surface of the first optical layer; subsequently coating a second optical layer on the first or second surface of the first optical layer; and curing the second optical layer to directly form a second microstructure on the first or second surface of the first optical layer. The first integrated microstructure and the second microstructure are separately formed at a time to provide a light guide film structure. In an embodiment, an additional optical layer is provided on the first optical layer.

Abstract: Improved DLL4 binding proteins are described, including antibodies, CDR-grafted antibodies, human antibodies, and DLL4 binding fragments thereof, proteins that bind DLL4 with high affinity, and DLL4 binding proteins that neutralize DLL4 activity. The DLL4 binding proteins are useful for treating or preventing cancers and tumors and especially for treating or preventing tumor angiogenesis, and/or other angiogenesis-dependent diseases such as ocular neovascularization, or angiogenesis-independent diseases characterized by aberrant DLL4 expression or activity such as autoimmune disorders including multiple sclerosis.

Abstract: The disclosure provides a touch panel, including: a substrate, wherein the substrate includes a viewing region and a border region at an edge of the viewing region; a patterned transparent conductive layer formed on the substrate, wherein the patterned transparent conductive layer formed on the viewing region has a touch sensitive function; and a patterned metal layer formed on the patterned transparent conductive layer and on the border region, wherein the patterned metal layer includes a contact region and a trace region connecting to the contact region, and at least a portion of the contact region overlaps with the patterned transparent conductive layer, and a shift range between a formation position of the contact region of the patterned metal layer and a formation position of the patterned transparent conductive layer is smaller than about 150 ?m.