Patents by Inventor Ming-Hsien Wu

Ming-Hsien Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210091265
    Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.
    Type: Application
    Filed: December 7, 2020
    Publication date: March 25, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yih-Der Guo, Ming-Hsien Wu, Yi-Chen Lin, Yao-Jun Tsai, Yen-Hsiang Fang
  • Patent number: 10948049
    Abstract: A transmission mechanism includes first and second transmission, first and second shafts, a clutch, and a one-way bearing. In the first gear, power is output through the first driving transmission and the one-way bearing; and in the second gear, the power is output through the clutch, the second driving transmission and the one-way bearing.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 16, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Ping Yang, Meng-Ru Wu, Ming-Hsien Yang, Peng-Yu Chen, Jui-Tang Tseng
  • Publication number: 20210057611
    Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.
    Type: Application
    Filed: December 24, 2019
    Publication date: February 25, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yih-Der Guo, Ming-Hsien Wu, Yi-Chen Lin, Yao-Jun Tsai, Yen-Hsiang Fang
  • Patent number: 10930085
    Abstract: A packing structure including a first packing component, a second packing component, and two lenses is provided. The second packing component is adapted to be combined with the first packing component detachably, such that a containing space is formed between the first packing component and the second packing component. The containing space is adapted to contain an electronic device. The two lenses are disposed on the second packing component. An image displayed by a display surface of the electronic device is adapted to be transmitted to outside of the containing space through the two lenses, so as to form a virtual reality image.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: February 23, 2021
    Assignee: Acer Incorporated
    Inventors: Shu-Hsien Chung, Jhih-Hsien Wu, Chung-Hsien Lee, Ming-Haw Wang
  • Publication number: 20200388497
    Abstract: First, second, and third trenches are formed in a layer over a substrate. The third trench is substantially wider than the first and second trenches. The first, second, and third trenches are partially filled with a first conductive material. A first anti-reflective material is coated over the first, second, and third trenches. The first anti-reflective material has a first surface topography variation. A first etch-back process is performed to partially remove the first anti-reflective material. Thereafter, a second anti-reflective material is coated over the first anti-reflective material. The second anti-reflective material has a second surface topography variation that is smaller than the first surface topography variation. A second etch-back process is performed to at least partially remove the second anti-reflective material in the first and second trenches. Thereafter, the first conductive material is partially removed in the first and second trenches.
    Type: Application
    Filed: August 24, 2020
    Publication date: December 10, 2020
    Inventors: Jin-Dah Chen, Ming-Feng Shieh, Han-Wei Wu, Yu-Hsien Lin, Po-Chun Liu, Stan Chen
  • Publication number: 20200346195
    Abstract: A catalyst for preparing chloroethylene by cracking 1,2-dichloroethane and a preparation and regeneration method thereof are disclosed in the present application. A catalyst for preparing chloroethylene by cracking 1,2-dichloroethane includes a carrier and a nitrogen-containing carbon as an active component of the catalyst with the nitrogen-containing carbon being loaded on the carrier. The method for preparing the catalyst includes: supporting an organic matter on an inorganic porous carrier and then performing a carbonization-nitridation process by pyrolysis in an atmosphere containing the nitrogen-containing compound. The method for regenerating the catalyst includes: calcinating the catalyst with deactivated carbon deposit in an oxidizing atmosphere to remove all the carbonaceous portions on the surface, and repeating the above preparation process of the catalyst.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 5, 2020
    Applicants: DALIAN INSTITUTE OF CHEMICAL PHYSICS, CHINESE ACADEMY OF SCIENCES, FORMOSA PLASTICS CORPORATION
    Inventors: Jinming XU, Sisi FAN, Yanqiang HUANG, Tao ZHANG, Chin Lien HUANG, Wan Tun HUNG, Yu Cheng CHEN, Chien Hui WU, Ya Wen CHENG, Ming Hsien WEN, Chao Chin CHANG, Tsao Cheng HUANG
  • Publication number: 20200301083
    Abstract: The present invention is to provide an optical transceiver module comprising a housing, a substrate, an optical receiving device and a plurality of optical transmitting devices. The substrate is disposed in the housing. The optical receiving device is disposed on the substrate. The plurality of optical transmitting devices are connected to the substrate, and there is a tilt angle between the optical transmitting devices and the substrate.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 24, 2020
    Inventors: Chun-Yang CHANG, Yun-Cheng HUANG, Wen-Hsien LI, Cheng-Hung LU, Ming-Ju CHEN, Chang-Cherng WU
  • Patent number: 10755936
    Abstract: First, second, and third trenches are formed in a layer over a substrate. The third trench is substantially wider than the first and second trenches. The first, second, and third trenches are partially filled with a first conductive material. A first anti-reflective material is coated over the first, second, and third trenches. The first anti-reflective material has a first surface topography variation. A first etch-back process is performed to partially remove the first anti-reflective material. Thereafter, a second anti-reflective material is coated over the first anti-reflective material. The second anti-reflective material has a second surface topography variation that is smaller than the first surface topography variation. A second etch-back process is performed to at least partially remove the second anti-reflective material in the first and second trenches. Thereafter, the first conductive material is partially removed in the first and second trenches.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: August 25, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jin-Dah Chen, Ming-Feng Shieh, Han-Wei Wu, Yu-Hsien Lin, Po-Chun Liu, Stan Chen
  • Publication number: 20200247761
    Abstract: The present invention related to novel sulfonamides or amides as TLR-4 antagonists, and pharmaceutical formulations containing the same and the methods of use thereof. Uses of the present novel sulfonamides or amides include, but are not limited to, the prophylaxis and/or treatment of autoimmune, inflammation, or infection related disorders.
    Type: Application
    Filed: January 25, 2018
    Publication date: August 6, 2020
    Applicant: TAIWANJ PHARMACEUTICALS CO., LTD
    Inventors: Syaulan S. YANG, Kuang-Yuan LEE, Meng-Hsien LIU, Ming-Yu HSIAO, Huang-Kai PENG, Chiung-Wen WANG, Edwin SC WU, Peter JS CHIU
  • Publication number: 20200251456
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Application
    Filed: April 23, 2020
    Publication date: August 6, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20200189255
    Abstract: A three-dimensional fabric composite structure and a preparation method thereof are provided. The three-dimensional fabric composite structure includes a three-dimensional fabric layer, first and second adhesive layers, and first and second bonding layers. The three-dimensional fabric layer has a first surface and a second surface opposite to each other. The first and second adhesive layers are respectively disposed on the first and second surfaces. The first and second bonding layers are respectively disposed on the first and second adhesive layers. The materials of the first and second bonding layers include polyether thermoplastic polyurethane (TPU) or polyester thermoplastic polyurethane.
    Type: Application
    Filed: November 28, 2019
    Publication date: June 18, 2020
    Applicant: TOMLONG TECHSTILE CORPORATION
    Inventor: Ming-Hsien Wu
  • Publication number: 20200192110
    Abstract: A display device includes an imaging element, a flat surface light source and a polarization beam splitter. The flat surface light source is used for providing plural illumination beams. A normal line of the flat surface light source and a normal line of the imaging element are not perpendicular to each other. The polarization beam splitter is arranged between the flat surface light source and the imaging element, and has a geometric surface. When the illumination beams from the flat surface light source are projected on the geometric surface, the illumination beams are reflected to the imaging element. The imaging beams from the imaging element are transmitted through the geometric surface. Consequently, an image is outputted. An imaging surface of the imaging surface can be irradiated uniformly by the illumination beams on within a specified viewing angle.
    Type: Application
    Filed: March 28, 2019
    Publication date: June 18, 2020
    Inventors: SHIH-PING WU, YU-SHENG LIU, CHI-WEI CHEN, MING-HSIEN TSAI
  • Patent number: 10679081
    Abstract: A biometric device includes a substrate, an image sensor, at least one infrared light emitting diode (IR LED), a supporting structure and an optical layer. The image sensor is disposed on the substrate. The at least one IR LED is disposed on the substrate. The supporting structure is disposed on the substrate and located between the image sensor and the at least one infrared light emitting diode. The optical layer is disposed on the supporting structure, covers the image sensor, and includes a coded pattern.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: June 9, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Ming-Hsien Wu, Po-Hsun Wang
  • Publication number: 20200144207
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.
    Type: Application
    Filed: December 20, 2019
    Publication date: May 7, 2020
    Inventors: Sheng-Chau CHEN, Shih-Pei CHOU, Ming-Che LEE, Kuo-Ming WU, Cheng-Hsien CHOU, Cheng-Yuan TSAI, Yeur-Luen TU
  • Patent number: 10636775
    Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: April 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-Yu Chen, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Li-Hsien Huang, Po-Hao Tsai, Ming-Shih Yeh, Ta-Wei Liu
  • Publication number: 20200110689
    Abstract: A method for detecting abnormality adapted to detect abnormal operations of an operating system is provided. The method includes: calculating a safe range of usage of the operating system during one or more time periods according to a historical data stream; calculating abnormal ratios corresponding to the one or more time periods according to a current data stream and the safe range of usage; selecting one or more abnormal time periods from the one or more time periods according to a threshold and the abnormal ratios; calculating an abnormal indicator for each of the one or more abnormal time periods according to the historical data stream and the current data stream; and ranking the one or more abnormal time periods according to the abnormal indicator(s).
    Type: Application
    Filed: February 21, 2019
    Publication date: April 9, 2020
    Applicant: Acer Cyber Security Incorporated
    Inventors: Chun-Hsien Li, Chien-Hung Li, Jun-Mein Wu, Ming-Kung Sun, Zong-Cyuan Jhang, Yin-Hsong Hsu, Chiung-Ying Huang, Tsung-Hsien Tsai
  • Publication number: 20200111391
    Abstract: A spliced display including a transparent substrate, a plurality of (light-emitting diode) LED modules, at least one control element, and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The LED modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the LED modules includes a driving backplane and a plurality of micro LEDs, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the LED modules via the signal transmission structure, and the LED modules are connected to each other via the signal transmission structure.
    Type: Application
    Filed: December 22, 2018
    Publication date: April 9, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Ming-Hsien Wu, Yen-Hsiang Fang, Po-Hsun Wang, Li-Chun Huang
  • Publication number: 20200111771
    Abstract: A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.
    Type: Application
    Filed: December 8, 2019
    Publication date: April 9, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Wei-Sheng Su, Chia-Hsin Chao, Mao-Chi Lin, Yen-Hsiang Fang, Li-Chun Huang, Ming-Hsien Wu
  • Publication number: 20200089017
    Abstract: A head-mounted display and an optical device are provided. The head-mounted display includes a display element, the optical device and an optical lens. Along an optical axis of the head-mounted display, the optical device includes a polarization beam splitter, a first phase retarder, a beam splitting element and a second phase retarder sequentially. The optical device receives plural light beams from the display element. The optical device is capable of travelling the light beams back and forth many times. The distance between the display element of the head-mounted display and the human eyes is shortened. Consequently, thus the volume of the head-mounted display is reduced.
    Type: Application
    Filed: October 31, 2018
    Publication date: March 19, 2020
    Inventors: SHIH-PING WU, CHI-WEI CHEN, YU-SHENG LIU, MING-HSIEN TSAI
  • Publication number: 20200072351
    Abstract: A parking mechanism used in gearbox, including a ratchet pawl and a cam set for driving the ratchet pawl. The cam set includes a shaft, a first and a second cam pivotally engaged with the shaft, wherein the shaft drives the first cam and the second cam to rotate, so as to drive the ratchet pawl to engage with a gear wheel that is pivotally engaged with a shaft member and to stop the shaft member. The cam set as a driving means simplifies the parking mechanism and is easy to be manufactured and disassembled.
    Type: Application
    Filed: November 20, 2018
    Publication date: March 5, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Po-Wen CHEN, Li-Te HUANG, Chia TSAO, Meng-Ru WU, Ming-Hsien YANG, Cheng-Ping YANG, Jui-Tang TSENG