Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Abstract: A transmission mechanism includes first and second transmission, first and second shafts, a clutch, and a one-way bearing. In the first gear, power is output through the first driving transmission and the one-way bearing; and in the second gear, the power is output through the clutch, the second driving transmission and the one-way bearing.

Abstract: A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Abstract: A packing structure including a first packing component, a second packing component, and two lenses is provided. The second packing component is adapted to be combined with the first packing component detachably, such that a containing space is formed between the first packing component and the second packing component. The containing space is adapted to contain an electronic device. The two lenses are disposed on the second packing component. An image displayed by a display surface of the electronic device is adapted to be transmitted to outside of the containing space through the two lenses, so as to form a virtual reality image.

Abstract: First, second, and third trenches are formed in a layer over a substrate. The third trench is substantially wider than the first and second trenches. The first, second, and third trenches are partially filled with a first conductive material. A first anti-reflective material is coated over the first, second, and third trenches. The first anti-reflective material has a first surface topography variation. A first etch-back process is performed to partially remove the first anti-reflective material. Thereafter, a second anti-reflective material is coated over the first anti-reflective material. The second anti-reflective material has a second surface topography variation that is smaller than the first surface topography variation. A second etch-back process is performed to at least partially remove the second anti-reflective material in the first and second trenches. Thereafter, the first conductive material is partially removed in the first and second trenches.

Abstract: A catalyst for preparing chloroethylene by cracking 1,2-dichloroethane and a preparation and regeneration method thereof are disclosed in the present application. A catalyst for preparing chloroethylene by cracking 1,2-dichloroethane includes a carrier and a nitrogen-containing carbon as an active component of the catalyst with the nitrogen-containing carbon being loaded on the carrier. The method for preparing the catalyst includes: supporting an organic matter on an inorganic porous carrier and then performing a carbonization-nitridation process by pyrolysis in an atmosphere containing the nitrogen-containing compound. The method for regenerating the catalyst includes: calcinating the catalyst with deactivated carbon deposit in an oxidizing atmosphere to remove all the carbonaceous portions on the surface, and repeating the above preparation process of the catalyst.

Abstract: The present invention is to provide an optical transceiver module comprising a housing, a substrate, an optical receiving device and a plurality of optical transmitting devices. The substrate is disposed in the housing. The optical receiving device is disposed on the substrate. The plurality of optical transmitting devices are connected to the substrate, and there is a tilt angle between the optical transmitting devices and the substrate.

Abstract: First, second, and third trenches are formed in a layer over a substrate. The third trench is substantially wider than the first and second trenches. The first, second, and third trenches are partially filled with a first conductive material. A first anti-reflective material is coated over the first, second, and third trenches. The first anti-reflective material has a first surface topography variation. A first etch-back process is performed to partially remove the first anti-reflective material. Thereafter, a second anti-reflective material is coated over the first anti-reflective material. The second anti-reflective material has a second surface topography variation that is smaller than the first surface topography variation. A second etch-back process is performed to at least partially remove the second anti-reflective material in the first and second trenches. Thereafter, the first conductive material is partially removed in the first and second trenches.

Abstract: The present invention related to novel sulfonamides or amides as TLR-4 antagonists, and pharmaceutical formulations containing the same and the methods of use thereof. Uses of the present novel sulfonamides or amides include, but are not limited to, the prophylaxis and/or treatment of autoimmune, inflammation, or infection related disorders.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A three-dimensional fabric composite structure and a preparation method thereof are provided. The three-dimensional fabric composite structure includes a three-dimensional fabric layer, first and second adhesive layers, and first and second bonding layers. The three-dimensional fabric layer has a first surface and a second surface opposite to each other. The first and second adhesive layers are respectively disposed on the first and second surfaces. The first and second bonding layers are respectively disposed on the first and second adhesive layers. The materials of the first and second bonding layers include polyether thermoplastic polyurethane (TPU) or polyester thermoplastic polyurethane.

Abstract: A display device includes an imaging element, a flat surface light source and a polarization beam splitter. The flat surface light source is used for providing plural illumination beams. A normal line of the flat surface light source and a normal line of the imaging element are not perpendicular to each other. The polarization beam splitter is arranged between the flat surface light source and the imaging element, and has a geometric surface. When the illumination beams from the flat surface light source are projected on the geometric surface, the illumination beams are reflected to the imaging element. The imaging beams from the imaging element are transmitted through the geometric surface. Consequently, an image is outputted. An imaging surface of the imaging surface can be irradiated uniformly by the illumination beams on within a specified viewing angle.

Abstract: A biometric device includes a substrate, an image sensor, at least one infrared light emitting diode (IR LED), a supporting structure and an optical layer. The image sensor is disposed on the substrate. The at least one IR LED is disposed on the substrate. The supporting structure is disposed on the substrate and located between the image sensor and the at least one infrared light emitting diode. The optical layer is disposed on the supporting structure, covers the image sensor, and includes a coded pattern.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A method for detecting abnormality adapted to detect abnormal operations of an operating system is provided. The method includes: calculating a safe range of usage of the operating system during one or more time periods according to a historical data stream; calculating abnormal ratios corresponding to the one or more time periods according to a current data stream and the safe range of usage; selecting one or more abnormal time periods from the one or more time periods according to a threshold and the abnormal ratios; calculating an abnormal indicator for each of the one or more abnormal time periods according to the historical data stream and the current data stream; and ranking the one or more abnormal time periods according to the abnormal indicator(s).

Abstract: A spliced display including a transparent substrate, a plurality of (light-emitting diode) LED modules, at least one control element, and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The LED modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the LED modules includes a driving backplane and a plurality of micro LEDs, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the LED modules via the signal transmission structure, and the LED modules are connected to each other via the signal transmission structure.

Abstract: A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.

Abstract: A head-mounted display and an optical device are provided. The head-mounted display includes a display element, the optical device and an optical lens. Along an optical axis of the head-mounted display, the optical device includes a polarization beam splitter, a first phase retarder, a beam splitting element and a second phase retarder sequentially. The optical device receives plural light beams from the display element. The optical device is capable of travelling the light beams back and forth many times. The distance between the display element of the head-mounted display and the human eyes is shortened. Consequently, thus the volume of the head-mounted display is reduced.

Abstract: A parking mechanism used in gearbox, including a ratchet pawl and a cam set for driving the ratchet pawl. The cam set includes a shaft, a first and a second cam pivotally engaged with the shaft, wherein the shaft drives the first cam and the second cam to rotate, so as to drive the ratchet pawl to engage with a gear wheel that is pivotally engaged with a shaft member and to stop the shaft member. The cam set as a driving means simplifies the parking mechanism and is easy to be manufactured and disassembled.