Patents by Inventor Ming-Hsien Wu

Ming-Hsien Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170032203
    Abstract: A biometric device includes a substrate, an image sensor, an optical layer and at least one infrared light emitting diode (IR LED). The image sensor is disposed on the substrate. The optical layer is disposed on the image sensor and includes a diffraction pattern. The IR LED is disposed on the diffraction pattern of the optical layer. The optical layer is located between the IR LED and the image sensor.
    Type: Application
    Filed: July 28, 2016
    Publication date: February 2, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Hsin Chao, Yen-Hsiang Fang, Ming-Hsien Wu
  • Publication number: 20170034922
    Abstract: A detection method for electronic devices including steps as follows is provided. The detection method includes: providing an electronic device substrate; attaching a portion of electronic devices of the electronic device substrate through an electronic device transfer module, wherein the electronic device transfer module includes a plurality of detecting elements corresponding to the portion of the electronic devices, and each of the detecting elements includes at least one pair of electrodes; detecting whether a conducting path between the at least one pair of electrodes is generated or not to confirm a status of contact between the portion of the electronic devices and a contact target; and transferring the portion of the electronic devices attached to the electronic device transfer module to a target substrate. An electronic device transfer module having detecting elements is also provided.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 2, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Shih-Hao Wang, Yi-Chen Lin
  • Publication number: 20160344226
    Abstract: An apparatus for transmission of wireless energy and an apparatus for reception of wireless energy are provided. The apparatus for transmission of wireless energy includes a natural energy conversion module, an energy converter, and an energy transmitter. The natural energy conversion module receives the natural energy and converts the natural energy into a first electric energy. The energy converter is electrically connected to the natural energy conversion module and converts the first electric energy into the wireless energy. The energy transmitter is electrically connected to the energy converter and transmits the wireless energy to an energy receiver.
    Type: Application
    Filed: August 8, 2016
    Publication date: November 24, 2016
    Applicant: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Mu-Tao Chu, Wen-Yih Liao
  • Publication number: 20160313493
    Abstract: The present disclosure relates to a light guide plate and a display apparatus having the same. The light guide plate includes a transparent light guide plate body and a plurality of microstructures. The transparent light guide plate body has a first surface and a second surface opposite to the first surface, wherein the first surface has a surface roughness of less than or equal to 100 nm. The microstructures are disposed on the first surface. A light beam from the transparent light guide plate body is reflected by the microstructures, and another light beam from the transparent light guide plate body passes through the first surface between the microstructures.
    Type: Application
    Filed: April 27, 2015
    Publication date: October 27, 2016
    Inventors: KUN-HSIEN LEE, MING-HSIEN WU, YI-HSUAN TAI, CHIN-MING WANG, HUNG-WEN WANG, HUANG-CHIEH CHIU
  • Publication number: 20160268491
    Abstract: A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 15, 2016
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang
  • Patent number: 9438063
    Abstract: A charge apparatus including a natural energy conversion module, an energy converter, an energy transmitter, an energy receiver, and an electricity storage device is provided. The natural energy conversion module receives the natural energy and converts the natural energy into a first electric energy. The energy converter is electrically connected to the natural energy conversion module and converts the first electric energy into a wireless energy. The energy transmitter is electrically connected to the energy converter and transmits the wireless energy. The energy receiver receives the wireless energy and converts the wireless energy into a second electric energy to charge an external apparatus. The energy transmitter monitors the current charge status of the external apparatus so as to adjust transmitting the wireless energy. The electricity storage device is electrically connected to the natural energy conversion module to store the first electric energy.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: September 6, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Jui-Ying Lin, Mu-Tao Chu, Yu-Chen Yu, Wen-Yih Liao, Ming-Hsien Wu
  • Publication number: 20160172253
    Abstract: A picking-up and placement process for electronic devices comprising: (a) providing a first substrate having a plurality of electronic devices formed thereon, the electronic devices being arranged in an array, and each of the electronic devices comprising a magnetic portion; (b) selectively picking-up parts of the electronic devices from the first substrate via a magnetic force generated from an electric-programmable magnetic module; and (c) bonding the parts of the electronic devices picked-up by the electric-programmable magnetic module with a second substrate.
    Type: Application
    Filed: November 30, 2015
    Publication date: June 16, 2016
    Inventors: Ming-Hsien Wu, Yen-Hsiang Fang, Chia-Hsin Chao
  • Patent number: 9357188
    Abstract: A photography and projection apparatus including a light emitting and sensing module and a projection lens is provided. The light emitting and sensing module has a light emitting and sensing area, and includes a light emitting unit array and a light sensing unit array. The light emitting unit array includes a plurality of light emitting units arranged in an array. The light emitting units are distributed in the light emitting and sensing area. The light emitting unit array is adapted to provide an image beam. The light sensing unit array includes a plurality of light sensing units arranged in an array. The light sensing units are distributed in the light emitting and sensing area. The projection lens is disposed on a transmission path of the image beam. A light emitting and sensing module is also provided.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: May 31, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Wen-Yung Yeh, Chia-Hsin Chao, Mu-Tao Chu, Jui-Ying Lin
  • Patent number: 9356179
    Abstract: A display panel comprising a substrate, a meshed shielding pattern, a plurality of light-emitting devices and a solar cell is provided. The substrate has a first surface and a second surface opposite to the first surface, the substrate comprises a first circuit layer disposed over the first surface and a second circuit layer disposed over the second surface. The meshed shielding pattern is disposed on first surface of the substrate to define a plurality of pixel regions over the substrate. The light-emitting devices are disposed on the first surface of the substrate and electrically connected to the first circuit layer, and at least one of the light-emitting devices is disposed in one of the pixel regions. The solar cell is disposed on the second surface of the substrate and electrically connected to the second circuit layer.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: May 31, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Chia-Hsin Chao, Yen-Hsiang Fang, Yi-Chen Lin, Ying-Chien Chu, Mu-Tao Chu
  • Patent number: 9337229
    Abstract: A semiconductor device includes an epitaxial layer including a first surface and a silicon layer disposed on the first surface and including a second surface opposite to the first surface, wherein the silicon layer includes a plurality of pillars on the second surface, a portion of the plurality of pillars on a predetermined portion of the second surface are in substantially same dimension, each of the plurality of pillars on the predetermined portion of the second surface stands substantially orthogonal to the second surface, the plurality of pillars are configured for absorbing an electromagnetic radiation of a predetermined wavelength projected from the epitaxial layer and generating an electrical energy in response to the absorption of the electromagnetic radiation.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: May 10, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chien Nan Tu, Yu-Lung Yeh, Ming-Hsien Wu, Li-Ming Sun
  • Publication number: 20160104695
    Abstract: A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.
    Type: Application
    Filed: December 16, 2015
    Publication date: April 14, 2016
    Inventors: Wen-Yung Yeh, Chia-Hsin Chao, Ming-Hsien Wu, Kuang-Yu Tai
  • Patent number: 9306117
    Abstract: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.
    Type: Grant
    Filed: December 27, 2014
    Date of Patent: April 5, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Hsien Wu, Ying-Chien Chu, Shih-Hao Wang, Yen-Hsiang Fang, Mu-Tao Chu
  • Publication number: 20160071899
    Abstract: A method for forming an image-sensor device is provided. The method includes providing a first semiconductor substrate having a first surface and a second surface opposite to the first surface. The method includes forming a device layer over the first surface of the first semiconductor substrate. The method includes bonding the first semiconductor substrate to a second semiconductor substrate after the formation of the device layer. The second surface faces the second semiconductor substrate. The method includes forming a diffusion layer between the first semiconductor substrate and the second semiconductor substrate. The diffusion layer has a dopant concentration gradient that increases in a direction from the first semiconductor substrate toward the second semiconductor substrate.
    Type: Application
    Filed: November 10, 2015
    Publication date: March 10, 2016
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Nan TU, Yu-Lung YEH, Ming-Hsien WU
  • Patent number: 9281451
    Abstract: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: March 8, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Yung Yeh, Kuo-Tung Tiao, Chia-Hsin Chao, Hsi-Hsuan Yen, Ming-Hsien Wu, Jui-Ying Lin, Ying-Chien Chu
  • Patent number: 9202837
    Abstract: An image-sensor device includes a first semiconductor substrate. The image-sensor device further includes a second semiconductor substrate under the first semiconductor substrate. The first semiconductor substrate has a first dopant concentration less than a second dopant concentration of the second semiconductor substrate. A ratio of a first resistance of the first semiconductor substrate to a second resistance of the second semiconductor substrate is larger than or equal to about 100. The image-sensor device also includes a diffusion layer positioned between the first semiconductor substrate and the second semiconductor substrate. A ratio of a first thickness of the diffusion layer to a second thickness of the first semiconductor substrate ranges from about 0.1 to about 1.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: December 1, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Nan Tu, Yu-Lung Yeh, Ming-Hsien Wu
  • Patent number: 9148021
    Abstract: A method for controlling an alternating current (AC) output of a photovoltaic (PV) device, and an AC PV device are introduced herein. The method includes: receiving solar radiant energy by using a PV cell array and then converting the solar radiant energy into a direct current (DC) energy output; and selecting an arrangement and combination sequence of the PV cells by using a control module, to vary a voltage according to a timing (frequency), so that a sine-like wave output is obtained at an output terminal.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: September 29, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Jung-Tsung Hsu, Wen-Yung Yeh, Ming-Hsien Wu, Wen-Yih Liao, Mu-Tao Chu
  • Publication number: 20150206690
    Abstract: Embodiments of a method for generating ions in an ion source are provided. The method for generating ions in an ion source includes introducing a dopant gas and a diluent gas into an ion source arc chamber. The method for generating ions in an ion source further includes generating plasma in the ion source arc chamber based on the dopant gas and the diluent gas.
    Type: Application
    Filed: January 17, 2014
    Publication date: July 23, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Hui LI, Stanley CHANG, Po-Yi TSENG, Chia-Cheng LIU, Chang-Chun WU, Shen-Han LIN, Chih-Wen HUANG, Ming-Hsien WU
  • Publication number: 20150206915
    Abstract: An image-sensor device includes a first semiconductor substrate. The image-sensor device further includes a second semiconductor substrate under the first semiconductor substrate. The first semiconductor substrate has a first dopant concentration less than a second dopant concentration of the second semiconductor substrate. A ratio of a first resistance of the first semiconductor substrate to a second resistance of the second semiconductor substrate is larger than or equal to about 100. The image-sensor device also includes a diffusion layer positioned between the first semiconductor substrate and the second semiconductor substrate. A ratio of a first thickness of the diffusion layer to a second thickness of the first semiconductor substrate ranges from about 0.1 to about 1.
    Type: Application
    Filed: January 22, 2014
    Publication date: July 23, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Chien-Nan TU, Yu-Lung YEH, Ming-Hsien WU
  • Publication number: 20150187827
    Abstract: A semiconductor device includes an epitaxial layer including a first surface and a silicon layer disposed on the first surface and including a second surface opposite to the first surface, wherein the silicon layer includes a plurality of pillars on the second surface, a portion of the plurality of pillars on a predetermined portion of the second surface are in substantially same dimension, each of the plurality of pillars on the predetermined portion of the second surface stands substantially orthogonal to the second surface, the plurality of pillars are configured for absorbing an electromagnetic radiation of a predetermined wavelength projected from the epitaxial layer and generating an electrical energy in response to the absorption of the electromagnetic radiation.
    Type: Application
    Filed: April 3, 2014
    Publication date: July 2, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: CHIEN NAN TU, YU-LUNG YEH, MING-HSIEN WU, LI-MING SUN
  • Publication number: 20150159837
    Abstract: An illumination assembly and a display panel are provided. The illumination assembly has an optical plate, a pattern layer, and a light source. The optical plate is made of transparent material and has a surface and at least one side connected to the surface. The pattern layer is disposed on the surface and having a plurality of microstructures. The light source is disposed adjacent to the optical plate.
    Type: Application
    Filed: December 11, 2014
    Publication date: June 11, 2015
    Inventors: Yi-Hsuan TAl, Ming-Hsien WU, Pao-Yuan HSU