Abstract: The present invention discloses a reference cell circuit which is applied to a non-volatile memory. The reference cell circuit includes a reference cell array, a first current mirror circuit, and a second current mirror circuit. The reference cell array includes at least one row of floating gate transistors. The first current mirror circuit is arranged to generate a mirror current according to a reference current generated by the reference cell array. The second current mirror circuit is arranged to receive the mirror current and generate an adjusted reference current according to the mirror current and a selected one of a plurality of enable signals, wherein the plurality of enable signals correspond to a plurality operations of the non-volatile memory and the adjusted reference current is arranged to determine logical state of a plurality of memory cells of the non-volatile memory.

Abstract: The present invention discloses a reference cell circuit which is applied to a non-volatile memory. The reference cell circuit includes a reference cell array, a first current mirror circuit, and a second current mirror circuit. The reference cell array includes at least one row of floating gate transistors. The first current mirror circuit is arranged to generate a mirror current according to a reference current generated by the reference cell array. The second current mirror circuit is arranged to receive the mirror current and generate an adjusted reference current according to the mirror current and a selected one of a plurality of enable signals, wherein the plurality of enable signals correspond to a plurality operations of the non-volatile memory and the adjusted reference current is arranged to determine logical state of a plurality of memory cells of the non-volatile memory.

Abstract: A core-based multi-bit memory (400) having a dual-bit dynamic referencing architecture (408, 410) fabricated on the memory core (401). A first reference array (408) and a second reference array (410) are fabricated on the memory core (401) such that a reference cell pair (185) comprising one cell (182) of the first reference array (408) and a corresponding cell (184) of the second reference array (410) are read and averaged to provide a reference voltage for reading a data array(s).

Abstract: A core-based multi-bit memory (400) having a dual-bit dynamic referencing architecture (408, 410) fabricated on the memory core (401). A first reference array (408) and a second reference array (410) are fabricated on the memory core (401) such that a reference cell pair (185) comprising one cell (182) of the first reference array (408) and a corresponding cell (184) of the second reference array (410) are read and averaged to provide a reference voltage for reading a data array(s).

Abstract: A core-based multi-bit memory (400) having a dual-bit dynamic referencing architecture (408, 410) fabricated on the memory core (401). A first reference array (408) and a second reference array (410) are fabricated on the memory core (401) such that a reference cell pair (185) comprising one cell (182) of the first reference array (408) and a corresponding cell (184) of the second reference array (410) are read and averaged to provide a reference voltage for reading a data array(s).

Abstract: A system and method for column selection in a non-volatile memory cell array is disclosed. A group of memory cells is arranged in a rectangular array having rows (X-dimension) and columns (Y-dimension). Within a row, the sources and drains of the memory cells are connected to form a linear chain. A common word line is coupled to each gate in the row. A separate column line is coupled to each node between adjacent memory cells of the chain. A four column Y-decoder is used to select column lines for sense operations. A voltage source is applied to two of the four column lines during the sense operation. Current on one of the column lines may be sensed to provide a measurement for read or verification.

Abstract: A method for controlling gate voltage in a memory device is described. The method includes providing a circuit that is adapted to be coupled with the memory device. The circuit is for generating a reference voltage. The method further includes utilizing the reference voltage provided by the circuit to apply a voltage at a gate of the memory device. The voltage has a value corresponding to a temperature of the memory device. The method also includes retaining a proportional relationship between the reference voltage and the temperature of the memory device, regardless of the change in the temperature of the memory device. The reference voltage provides a substantially constant programming time for the memory device regardless of the temperature of the memory device.

Abstract: A ground structure for page read and page write for flash memory. An array structure of flash memory cells comprises a plurality of sectors. Each sector comprises I/O blocks plus reference arrays and an array of redundant cells. Each I/O block comprises sub I/O blocks. Each sub I/O block within an I/O block, as well as other structures including reference cells, redundant cells and edge structures is coupled to a unique ground reference signal. These unique ground reference signals may be selectively coupled to a system ground or a biased ground reference. This novel ground arrangement enables a page read operation in which one bit from each sub I/O block can be read simultaneously. In addition, one bit from each I/O block may be programmed simultaneously. Further, the ground reference voltage for cells of the array may be selectively adjusted to optimize operation.

Abstract: A core-based multi-bit memory (400) having a dual-bit dynamic referencing architecture (408, 410) fabricated on the memory core (401). A first reference array (408) and a second reference array (410) are fabricated on the memory core (401) such that a reference cell pair (185) comprising one cell (182) of the first reference array (408) and a corresponding cell (184) of the second reference array (410) are read and averaged to provide a reference voltage for reading a data array(s).

Abstract: An exemplary memory sector erase method comprises the steps of pre-programming a first bit and a second bit of a plurality of core memory cells of a plurality of memory blocks of a target memory sector, pre-programming one of a third bit and a fourth bit of a first neighboring memory cell adjacent to the target memory sector, and erasing the first bit and the second bit of the plurality of core memory cells of the plurality of memory blocks. According to another embodiment, the method further comprises programming the one of the third bit and the fourth bit of the first neighboring memory cell after the erasing step.

Abstract: An array of non-volatile memory cells includes active columns of cells wherein a data pattern may be stored adjacent to damaged or inactive columns wherein data is not stored. A method of storing a data pattern and reproducing the data pattern within such an array comprises storing a charge within a selected plurality of the memory cells within the active column. The selected plurality of memory cells represents a portion of the data pattern. An inactive memory cell programming pattern is identified. The inactive memory cell programming pattern identifies all, or a selected plurality, of the memory cells in the inactive column in which a charge is to be stored for the purpose of periodically storing a charge in the memory cells first inactive column to prevent over erasure, during bulk erase, and leakage from the inactive cells to adjacent active cells. A charge is stored on the selected plurality of the memory cells in the first inactive column.

Abstract: Embodiments of the present invention are directed to a method and system to minimize page programming time for page programmable memory devices. In one embodiment, the present invention comprises program logic that programs a page programmable memory device with a plurality of words during a page programming cycle and a detector coupled to the program logic that identifies a particular word in that plurality of words which does not require programming. When the detector identifies a particular word which does not require programming, it sends an indication to the program logic component which, in response to the signal, reduces the length of the page programming cycle.

Abstract: A method of programming a memory unit having a plurality of dual cell core memory devices and at least one dual cell dynamic reference device. The memory unit is subjected to an erase configuration operation such that each cell of the core memory devices is in a blank state and such that a threshold voltage of the at least one dynamic reference device is less than a charged program level threshold voltage. Thereafter, the at least one dynamic reference and the core memory devices are programmed using a page programming routine.

Abstract: A system and method for column selection in a non-volatile memory cell array is disclosed. A group of memory cells is arranged in a rectangular array having rows (X-dimension) and columns (Y-dimension). Within a row, the sources and drains of the memory cells are connected to form a linear chain. A common word line is coupled to each gate in the row. A separate column line is coupled to each node between adjacent memory cells of the chain. A four column Y-decoder is used to select column lines for sense operations. A voltage source is applied to two of the four column lines during the sense operation. Current on one of the column lines may be sensed to provide a measurement for read or verification.

Abstract: A memory integrated circuit (100) includes a first bank (102) of memory cells and a second bank (104) of memory cells. A sensing circuit (114) is coupled to the first and second banks of memory cells to determine a data state of a selected memory cell in relation to a reference cell (118). A loading circuit (206) is coupled with a sensing circuit and associated with the reference cell to approximate loading associated with the selected memory cell. The loading circuit is shared for sensing memory cells of the first bank and memories of the second bank. By sharing the loading circuit, total device count and manufacturing costs where the memory integrated circuit are reduced.

Abstract: A flash memory device (100) includes a first bank (194) and a second bank (196) of memory cells. Address logic (416, 418, 420, 422) is configured to access read data at a first location in the first bank according to first address data. The address logic is configured to substantially simultaneously access for writing a plurality of second locations in the second bank according to second address data. The address logic is configured to access the plurality of second locations by varying only a single bit of the second address data at a time. This reduces the total number of address signals changing during sector erase in the flash memory device, thereby reducing noise which previously impacted the sense margin and access time in the device.

Abstract: A page mode memory senses a large number of bits simultaneously. The associated read current creates a source bias in the core cells which alters the sense margin at the sense amplifier. To address this problem, a memory integrated circuit (100) includes an array (102) of core cells, each core cell having a ground node (220, 222, 224). A ground line (230) couples the ground node of each core cell to a ground potential (Vss) and establishes a variable parasitic potential between the ground node and Vss. For sensing the data state of the core cells, a reference core cell (252) matches the array core cells and has a reference ground node (262). A circuit element (256) is coupled between the reference ground node and Vss to establish a variable reference potential to match the variable parasitic potential.

Abstract: A number of resonant tunneling diodes are connected in series with a resistor, a current source or a load device. A bit line is connected to every joint between any two devices through a switch. When properly biased, there can be (N+1).sup.m number of stable quantized operating points which are represented by a combination of m variables (of either voltage or current, where N is the number of peaks of the folding I-V characteristic and m is the number of bit lines. The m bit lines can write in (N+1).sup.m different combinations of inputs. During reading, the quantized voltage (or current) at each bit line is sensed. The number of stable states can be doubled by changing the polarity of the power supply.