Abstract: A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.

Abstract: The present invention discloses a counterweighted vibration device and a manufacturing method thereof.

Abstract: A sensor includes a first chip, a dam structure and a cover. The first chip includes a substrate, a sensing area and a low-k material layer. The sensing area is located on the surface of the substrate. The low-k material layer is located in the substrate. The dam structure is located on the first chip. The dam structure covers the edge of the low-k material layer. The cover is located on the dam structure and covers the sensing area. A manufacturing method of a sensor is also provided.

Abstract: A vibration unit includes a shell with a hollow cavity, a vibration shaft arranged in the hollow cavity and coils, wherein the shell is provided with two elastic support structures located at two ends of the vibration shaft, and at least two permanent magnet rings and at least one magnetic insulator ring are fixed to an outer periphery of the vibration shaft, with each magnetic insulator ring arranged between every two adjacent permanent magnet rings. The coils are fixed on an inner wall of the hollow cavity and located on an outer periphery of each of the permanent magnet rings, wherein a change in a current flowing through each of the coils produces vibration of each of the permanent magnet rings in proportion to the change in the current, which in turn drives the vibration shaft to vibrate in proportion.

Abstract: An in-vehicle life detection system and detection method thereof are provided. The system includes a processor, an electromagnetic wave detection module, and a warning module. The method includes following steps: vehicle condition identifying step, life form detecting step, and warning step. Upon receiving an engine off signal and a driver absence signal, the processor emits a detection activation signal, activating the electromagnetic wave detection module to emit an electromagnetic wave for detecting a life form. When the life form is detected, the warning module sends a warning signal, indicating that the life form is left in the vehicle when the vehicle is in the engine off status with the doors closed. Thus, the tragedy of a life form remaining inside the vehicle incapable of calling for help is avoided.

Abstract: An information delivery method for transferring fund is provided. The information delivery method includes receiving payment information, determining whether a transfer condition is met according to the payment information, in response to determining that the transfer condition is met, obtaining source account information of a source entity and destination account information of a destination entity in the payment information, determining a transfer path according to the source account information of the source entity and the destination account information of the destination entity, and transmitting the payment information from the source entity to the destination entity according to the transfer path.

Abstract: A method of manufacturing a semiconductor device is as below. An exposed photoresist layer is developed using a developer supplied by a developer supplying unit. An ammonia gas by-product of the developer is discharged through a gas outlet of the developer supplying unit into a treating tool. The ammonia gas by-product is retained in the treating tool. A concentration of the ammonia gas by-product is monitored.

Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: The invention provides a server device. The server device includes a casing, an electronic assembly, and a heat dissipation assembly. The casing includes a housing and a partition. The partition is disposed in the housing and forms an accommodation space and a heat dissipation space in the housing that are not communicated with each other. The housing has a plurality of first vent holes communicated with the heat dissipation space. The electronic assembly is located in the accommodation space. The heat dissipation assembly includes a heat dissipation component and a heat pipe. The heat dissipation component is located in the heat dissipation space. The heat pipe includes a heat absorption portion and a condensation portion connected to each other. The heat pipe is disposed through the partition, the heat absorption portion is thermally coupled to the electronic assembly, and the condensation portion is coupled to the heat dissipation component.

Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.

Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.

Abstract: A sensor includes a first chip, a dam structure and a cover. The first chip includes a substrate, a sensing area and a low-k material layer. The sensing area is located on the surface of the substrate. The low-k material layer is located in the substrate. The dam structure is located on the first chip. The dam structure covers the edge of the low-k material layer. The cover is located on the dam structure and covers the sensing area. A manufacturing method of a sensor is also provided.

Abstract: An in-vehicle life detection system and detection method thereof are provided. The system includes a control unit, an electromagnetic wave detection module, and a warning module. The method includes following steps: vehicle condition identifying step, life form detecting step, and warning step. Upon receiving an engine off signal and a driver absence signal, the control unit emits a detection activation signal, activating the electromagnetic wave detection module to emit an electromagnetic wave for detecting a life form. When the life form is detected, the warning module sends a warning signal, indicating that the life form is left in the vehicle when the vehicle is in the engine off status with the doors closed. Thus, the tragedy of a life form remaining inside the vehicle incapable of calling for help is avoided.

Abstract: A tool storage device is provided, including a base and a seat. The base includes a receiving portion, and the receiving portion includes an accommodation room and a wall defining the accommodation room. The seat is swingably disposed within the accommodation room, and the seat includes a slot and at least one elastic aim. The slot is configured to detachably receive a workpiece, and the at least one elastic arm is disengageably abutted laterally against the wall and configured to urge the workpiece within the slot.

Abstract: A method of manufacturing a semiconductor device and a semiconductor processing system are provided. The method includes the following steps. A photoresist layer is formed on a substrate in a lithography tool. The photoresist layer is exposed in the lithography tool to form an exposed photoresist layer. The exposed photoresist layer is developed to form a patterned photoresist layer in the lithography tool by using a developer. An ammonia gas by-product of the developer is removed from the lithography tool.

Abstract: A method for applying developer over a semiconductor wafer is provided. The method includes moving a nozzle over the center of the semiconductor wafer. The nozzle extends across the semiconductor wafer. The method also includes rotating the semiconductor wafer by a dispensing rotation angle that is less than 180 degrees. The method further includes dispensing developer over the semiconductor wafer relative to alignment marks formed on the semiconductor wafer while the semiconductor wafer is rotated by the dispensing rotation angle.

Abstract: A tire pressure monitoring system includes a main unit carried in a motor vehicle having one or multiple vehicle tires, and a tire pressure sensor installed in each vehicle tire of the motor vehicle and electrically connected to the main unit through a wireless communication SoC (system-on-chip) therein in a wireless manner. The wireless communication SoC of each tire pressure sensor includes a first communication protocol and a second communication protocol the related data of the respective vehicle tire. Thus, the tire pressure monitoring system improves data signal transmission efficiency and achieves dual-mode transmission.