Abstract: An air-blower dual-energy-extraction wave and tidal power generation device includes an air blower mechanism, a first conduit, a second conduit, four check valves, a bracket, and a power generation mechanism, wherein waves and tides boost a push member of the air blower mechanism to drive a piston of the air blower mechanism to operate for drawing in gas or liquid, dual energies, by the first conduit and the second conduit to gain double efficiency, and the gas or liquid is stored in a gas accumulation, constant-pressure, and pressure-regulating barrel for subsequent release of the gas or liquid, in a stable and constant manner, to drive a vane wheel power generator to rotate for generation of electrical energy. Furthermore, the invention provides an air-blower dual-energy-extraction wave and tidal power generation system, which includes a plurality of air-blower dual-energy-extraction wave and tidal power generation device for generation of electrical energy.

Abstract: A fan includes a first motor, a second motor, a rotating shaft and a fan blade. The first motor includes a first coil. A first current flows through the first coil when the fan is electrified. The second motor includes a second coil. A second current flows through the second coil when the fan is electrified. The fan blade is affixed to the rotating shaft. The first motor and the second motor drive the rotating shaft to rotate the fan blade when the fan is electrified.

Abstract: A semiconductor packaging structure including a circuit board, a chip, and a paste is provided. The circuit board includes a base layer, a first circuit layer, and a second circuit layer. The base layer has a first surface, a second surface opposite to the first surface, and a recess located on the first surface. The first circuit layer is located on the first surface. The second circuit layer is located on the second surface. The chip is disposed on the first surface and is electrically connected to first circuit layer, where the recess is located on at least one side of the chip. The paste is filled between the chip and the first surface and filled in the recess, where the paste covers a side surface of the chip.

Abstract: An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source. The heat dissipation device includes a casing having a heat dissipation material including 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The casing has a surface facing the heat source. A central area and an outer ring area are defined on the surface. A geometric midpoint of the central area overlaps a geometric midpoint of the surface. An orthographic projection region of the heat source to the surface is located in the central area. The heat dissipation device absorbs heat generated by the heat source through thermal radiation.

Abstract: An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The heat dissipation device has a surface facing the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. An orthographic projection region on the surface is in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal radiation.

Abstract: An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction.

Abstract: An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source. The heat dissipation device includes a casing having a heat dissipation material. The heat dissipation material includes 15 to 30 volume percent of multiple copper materials, 50 to 85 volume percent of a phase change material, and 15 to 20 volume percent of air. The casing has a surface being in thermal contact with the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area and a geometric midpoint of the surface are overlapped. The heat dissipation device absorbs heat generated by the heat source located in the central area through thermal conduction.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: A wrist training ball includes a housing, a rotating body rotatably disposed in the housing, a magnetic component and an information display and detecting module. The magnetic component, disposed at the rotating body, spins with the rotating body. The information display and detecting module, disposed at the housing, includes a sensing unit, a rectifying unit, a signal transforming unit and a processing unit. The sensing unit generates an induced current when the rotating body is spun. The rectifying unit, electrically connected to the sensing unit, rectifies the induced current into an operating power. The signal transforming unit, electrically connected to the sensing unit, transforms the induced current into a motion datum. The processing unit, electrically connected to the rectifying unit and the signal transforming unit, receives the operating power for operation and processes the motion datum to determine a relative motion relationship between the rotating body and the housing.

Abstract: An electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source. The heat dissipation device includes a casing having a heat dissipation material including 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The casing has a surface facing the heat source. A central area and an outer ring area are defined on the surface. A geometric midpoint of the central area overlaps a geometric midpoint of the surface. An orthographic projection region of the heat source to the surface is located in the central area. The heat dissipation device absorbs heat generated by the heat source through thermal radiation.

Abstract: An electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material and 15 to 20 percent volume of air. The heat dissipation device has a surface thermally contacting the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. The heat source is located in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal conduction.

Abstract: An electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source. The heat dissipation device includes a casing having a heat dissipation material. The heat dissipation material includes 15 to 30 volume percent of multiple copper materials, 50 to 85 volume percent of a phase change material, and 15 to 20 volume percent of air. The casing has a surface being in thermal contact with the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area and a geometric midpoint of the surface are overlapped. The heat dissipation device absorbs heat generated by the heat source located in the central area through thermal conduction.

Abstract: An electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case. The radiator is disposed on the case and the radiator is kept away from the heat source at a distance. The radiator comprises a case body. A plurality of cellular compartments formed by a plurality of partition plates is disposed inside the case body. The cellular compartments are filled with a heat dissipation material. The radiator absorbs the heat of the heat source through thermal radiation.

Abstract: An electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing. A heat dissipation material is disposed in the casing. The heat dissipation material includes 15 to 30 percent volume of multiple copper materials, 50 to 85 percent volume of a phase change material, and 15 to 20 percent volume of air. The heat dissipation device has a surface facing the heat source. A central area and an outer ring area are defined on the surface. The outer ring area surrounds the central area. A geometric midpoint of the central area overlaps that of the surface. An orthographic projection region on the surface is in the outer ring area. The heat dissipation device absorbs heat from the heat source through thermal radiation.

Abstract: A tool hanger includes a hanging member and a tool holding member. The tool holding member can be folded up and fitted in a connection hold of a tool, such as a socket. The tool is then engaged by the tool holding member. The distal end of the tool holding member undetachably clips on the other end of the tool holding member. Thus, the unauthorized removal of the tool is prohibited, and burglarproof function is achieved.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: A substrate carrier is used for carrying a plurality of back electrode substrates into a furnace. Each back electrode substrate has a precursor layer formed thereon. The furnace is used for providing a process gas to react with the precursor layer, so as to form a photoelectric transducing layer on each back electrode substrate. The substrate carrier includes a heat-resistant metal frame and a first protective layer. The heat-resistant metal frame has a plurality of slots for supporting the plurality of back electrode substrates. The first protective layer is formed on the heat-resistant metal frame for preventing a chemical reaction of the heat-resistant metal frame with the process gas.

Abstract: A rapid thermal processing system includes a rapid thermal processing furnace, a back electrode substrate, and a cover. The rapid thermal processing furnace includes a reaction chamber and a heating device. The heating device is capable of generating heat energy. The back electrode substrate is adapted to dispose in the reaction chamber and has a precursor layer and a selenium layer formed on the precursor layer. The cover is disposed at a position corresponding to the selenium layer on the back electrode substrate and has a sulfur in solid form formed thereon, so as to make the sulfur in solid form opposite to the selenium layer. After the sulfur in solid form absorbs the heat energy generated by the heating device, the sulfur in solid form reacts with the selenium layer and the precursor layer to form a photoelectric transducing layer.

Abstract: A solar battery module includes a substrate, striped metal electrode layers formed alternately on the substrate along a first direction, striped photoelectric transducing layers, striped transparent electrode layers, and electrode lines. Each striped photoelectric transducing layer is formed on the striped metal electrode layer and the substrate along the first direction. Each striped transparent electrode layer is formed on the striped metal electrode layer and the striped photoelectric transducing layer along the first direction. The striped transparent electrode layers and the striped metal electrode layers are in series connection along a second direction. The electrode lines are formed alternately on each striped transparent electrode layer or between each striped photoelectric transducing layer and each striped transparent electrode layer along the second direction.

Abstract: A rapid thermal processing system includes a rapid thermal processing furnace, a back electrode substrate, and a cover. The rapid thermal processing furnace includes a reaction chamber and a heating device. The heating device is capable of generating heat energy. The back electrode substrate is adapted to dispose in the reaction chamber and has a precursor layer and a selenium layer formed on the precursor layer. The cover is disposed at a position corresponding to the selenium layer on the back electrode substrate and has a sulfur in solid form formed thereon, so as to make the sulfur in solid form opposite to the selenium layer. After the sulfur in solid form absorbs the heat energy generated by the heating device, the sulfur in solid form reacts with the selenium layer and the precursor layer to form a photoelectric transducing layer.