Patents by Inventor Ming Lin Tsai

Ming Lin Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Patent number: 11961834
    Abstract: A semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. The first diode is coupled between an input/output (I/O) pad and a first voltage terminal. The second diode is coupled with the first diode, the I/O pad and a second voltage terminal. The clamp circuit is coupled between the first voltage terminal and the second voltage terminal. The second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (ESD) current flowing between the I/O pad and the first voltage terminal. The third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the ESD current flowing between the I/O pad and the first voltage terminal.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Lin Peng, Li-Wei Chu, Ming-Fu Tsai, Jam-Wem Lee, Yu-Ti Su
  • Publication number: 20240120735
    Abstract: An electrostatic discharge (ESD) circuit includes a first ESD detection circuit, a first discharging circuit and a first ESD assist circuit. The first ESD detection circuit is coupled between a first node having a first voltage and a second node having a second voltage. The first discharging circuit includes a first transistor. The first transistor has a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to the first ESD detection circuit by a third node. The first drain is coupled to the first node. The first source and the first body terminal are coupled together at the second node. The first ESD assist circuit is coupled between the second and third node, and configured to clamp a third voltage of the third node at the second voltage during an ESD event at the first or second node.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Chia-Lin HSU, Ming-Fu TSAI, Yu-Ti SU, Kuo-Ji CHEN
  • Patent number: 11956261
    Abstract: A detection method for a malicious domain name in a domain name system (DNS) and a detection device are provided. The method includes: obtaining network connection data of an electronic device; capturing log data related to at least one domain name from the network connection data; analyzing the log data to generate at least one numerical feature related to the at least one domain name; inputting the at least one numerical feature into a multi-type prediction model, which includes a first data model and a second data model; and predicting whether a malicious domain name related to a malware or a phishing website exists in the at least one domain name by the multi-type prediction model according to the at least one numerical feature.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 9, 2024
    Assignee: Acer Cyber Security Incorporated
    Inventors: Chiung-Ying Huang, Yi-Chung Tseng, Ming-Kung Sun, Tung-Lin Tsai
  • Patent number: 11929363
    Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Lin Peng, Li-Wei Chu, Ming-Fu Tsai, Jam-Wem Lee, Yu-Ti Su
  • Patent number: 11847851
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: December 19, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11651611
    Abstract: A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: May 16, 2023
    Assignee: InvenSense, Inc.
    Inventor: Julius Ming-Lin Tsai
  • Patent number: 11440052
    Abstract: An electronic device includes a plurality of CMOS control elements arranged in a two-dimensional array and a plurality of MEMS devices. Each CMOS control element of the plurality of CMOS control elements includes at least one of a low voltage semiconductor device, a high voltage PMOS semiconductor device, and a high voltage NMOS semiconductor device. Each MEMS device of the plurality of MEMS devices is associated with a CMOS control element of the plurality of CMOS control elements. The plurality of CMOS control elements are arranged in the two-dimensional array such that low voltage semiconductor devices are only adjacent to other low voltage semiconductor devices, high voltage PMOS semiconductor devices are only adjacent to other high voltage PMOS semiconductor devices, and high voltage NMOS semiconductor devices are only adjacent to other high voltage NMOS semiconductor devices.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: September 13, 2022
    Assignee: InvenSense, Inc.
    Inventors: James Christian Salvia, Michael H. Perrott, Marian Voros, Eldwin Ng, Julius Ming-Lin Tsai, Nikhil Apte
  • Publication number: 20220172506
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Application
    Filed: February 18, 2022
    Publication date: June 2, 2022
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11263424
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: March 1, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11107858
    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: August 31, 2021
    Assignee: InvenSense, Inc.
    Inventors: Renata Melamud Berger, Julius Ming-Lin Tsai, Stephen Lloyd
  • Publication number: 20200400800
    Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
    Type: Application
    Filed: March 20, 2020
    Publication date: December 24, 2020
    Applicant: InvenSense, Inc.
    Inventors: Eldwin NG, Julius Ming-Lin TSAI, Nikhil APTE
  • Publication number: 20200355824
    Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam.
    Type: Application
    Filed: June 1, 2020
    Publication date: November 12, 2020
    Applicant: InvenSense, Inc.
    Inventors: Nikhil APTE, Julius Ming-Lin TSAI, Michael Julian DANEMAN, Renata Melamud BERGER
  • Publication number: 20200250393
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Application
    Filed: February 28, 2020
    Publication date: August 6, 2020
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 10726231
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: July 28, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Publication number: 20200194495
    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
    Type: Application
    Filed: October 28, 2019
    Publication date: June 18, 2020
    Applicant: InvenSense, Inc.
    Inventors: Renata Melamud BERGER, Julius Ming-Lin TSAI, Stephen LLOYD
  • Patent number: 10670716
    Abstract: In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: June 2, 2020
    Assignee: InvenSense, Inc.
    Inventors: Nikhil Apte, Julius Ming-Lin Tsai, Michael Julian Daneman, Renata Melamud Berger
  • Patent number: 10656255
    Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. An interior support structure is disposed within the cavity and connected to the substrate and the membrane.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: May 19, 2020
    Assignee: InvenSense, Inc.
    Inventors: Eldwin Ng, Julius Ming-Lin Tsai, Nikhil Apte
  • Patent number: 10643052
    Abstract: A method for generating a composite image having an increased image pixel density by an array of ultrasonic transducers having a given spatial density is provided. The method comprises capturing a first set of pixels at an ultrasonic sensor using a first beamforming pattern, wherein the first beamforming pattern comprises a first pattern of ultrasonic transducers of the ultrasonic sensor. The method further comprises capturing a second set of pixels at the ultrasonic sensor using a second beamforming pattern, wherein the second beamforming pattern comprises a second pattern of ultrasonic transducers. The first beamforming pattern and the second beamforming pattern are different. Pixels of the second set of pixels correspond to positions between pixels of the first set of pixels. The method additionally comprises combining the first and second sets of pixels to form the composite image. An electronic device and a method of generating an image of a fingerprint are also provided.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: May 5, 2020
    Assignee: InvenSense, Inc.
    Inventors: Bruno W. Garlepp, James Christian Salvia, Michael Daneman, Nikhil Apte, Julius Ming-Lin Tsai
  • Publication number: 20200111834
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Application
    Filed: November 27, 2019
    Publication date: April 9, 2020
    Inventors: Julius Ming-Lin Tsai, Michael Daneman