Abstract: There is provided a monolithically integrated multimodal sensor device for intracranial neuromonitoring, the sensor device including: a single substrate; a temperature sensor formed on a first portion of the single substrate for detecting temperature; a pressure sensor formed on a second portion of the single substrate for detecting intracranial pressure; and an oxygen sensor formed on a third portion of the single substrate for detecting oxygen concentration. In particular, sensing portions of the temperature sensor, the oxygen sensor and the pressure sensor, respectively, are formed at different layers of the sensor device. There is also provided an integrated multimodal sensor system incorporating the sensor device and the associated methods of fabrication.

Abstract: A method and apparatus for detecting underwater sounds is disclosed. An embodiment of the apparatus includes a substrate with a vacuum-sealed cavity. A support structure and an acoustic pressure sensor are situated on the substrate. The support structure of the apparatus may include a first oxide layer situated on the substrate, a silicon layer situated on the first oxide layer, and a second oxide layer situated on the silicon layer. The acoustic pressure sensor of the apparatus includes a first electrode layer situated on the substrate, a piezoelectric layer situated on the first electrode layer, and a second electrode layer situated on the piezoelectric layer. In one embodiment, the surface area of the second electrode layer is between about 70 to 90 percent of the surface area of the piezoelectric layer. In various embodiments, the support structure is thicker than the piezoelectric layer.

Abstract: Microelectromechanical systems (MEMS) pressure sensors having a leakage path are described. Provided implementations can comprise a MEMS pressure sensor system associated with a back cavity and a membrane that separates the back cavity and an ambient atmosphere. A pressure of the ambient atmosphere is determined based on a parameter associated with movement of the membrane.

Abstract: A piezoelectric microphone and/or a piezoelectric microphone system is presented herein. In an implementation, a piezoelectric microphone includes a microelectromechanical systems (MEMS) layer and a complementary metal-oxide-semiconductor (CMOS) layer. The MEMS layer includes at least one piezoelectric layer and a conductive layer. The conductive layer is deposited on the at least one piezoelectric layer and is associated with at least one sensing electrode. The CMOS layer is deposited on the MEMS layer.

Abstract: A piezoelectric acoustic resonator based sensor is presented herein. A device can include an array of piezoelectric transducers and an array of cavities that has been attached to the array of piezoelectric transducers to form an array of resonators. A resonator of the array of resonators can be associated with a first frequency response corresponding to a first determination that the resonator has been touched, and a second frequency response corresponding to a second determination that the resonator has not been touched. The array of piezoelectric transducers can include a piezoelectric material; a first set of electrodes that has been formed a first side of the piezoelectric material; and a second set of electrodes that has been formed on second side of the piezoelectric material.

Abstract: An acoustic sensing element of an acoustic sensor and/or transducer can be covered with a composite material comprising a cover material and an anti-scratch material. In one aspect, an acoustic impedance of the cover material is lower than an acoustic impedance of the anti-scratch material. During acoustical sensing, the acoustic sensing element transmits an ultrasonic signal through the cover material and the anti-scratch material, which interferes with an object on (or near) the surface of the anti-scratch material. An interference signal that is generated based on an interference of the ultrasonic signal with the object propagates through the anti-scratch material and the cover material and is sensed by the acoustic sensing element. Further, an image of the object is recreated based on an analysis of the interference signal.

Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Abstract: Parameters, such as, quality factor and/or resonance frequency of an acoustic transducer can be electrically tuned. The acoustic transducer can include a piezoelectric layer deposited on a silicon supporting layer, a first electrode layer deposited on the piezoelectric layer, and a second electrode layer deposited between the silicon supporting layer and piezoelectric layer. In one aspect, a resonant frequency of the piezoelectric actuated transducer is electrically tuned based on modifying a voltage across at least a portion of the first electrode layer and the second electrode layer. In another aspect, a quality factor of the piezoelectric actuated transducer is electrically tuned based on modifying a resistance across at least another portion of the first electrode layer and the second electrode layer.

Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

Abstract: According to embodiments of the present invention, a transducer is provided. The transducer includes a substrate, and a diaphragm suspended from the substrate, wherein the diaphragm is displaceable in response to an acoustic signal impinging on the diaphragm, wherein the transducer is configured, in a first mode of operation, to determine a direction of the acoustic signal based on a first displacement of the diaphragm in the first mode of operation, and to decide to accept or reject the acoustic signal based on at least one predetermined parameter and the determined direction of the acoustic signal, and in a second mode of operation, to sense the acoustic signal based on a second displacement of the diaphragm in the second mode of operation if the acoustic signal is accepted in the first mode of operation.

Abstract: A micro-electro-mechanical system device is disclosed. The micro-mechanical system device comprises a first silicon substrate comprising: a handle layer comprising a first surface and a second surface, the second surface comprises a cavity; an insulating layer deposited over the second surface of the handle layer; a device layer having a third surface bonded to the insulating layer and a fourth surface; a piezoelectric layer deposited over the fourth surface of the device layer; a metal conductivity layer disposed over the piezoelectric layer; a bond layer disposed over a portion of the metal conductivity layer; and a stand-off formed on the first silicon substrate; wherein the first silicon substrate is bonded to a second silicon substrate, comprising: a metal electrode configured to form an electrical connection between the metal conductivity layer formed on the first silicon substrate and the second silicon substrate.

Abstract: A fully differential microelectromechanical system (MEMS) accelerometer configured to measure Z-axis acceleration is disclosed. This may avoid some of the disadvantages in traditional capacitive sensing architectures—for example, less sensitivity, low noise suppression, and low SNR, due to Brownian noise. In one embodiment, the accelerometer comprises three silicon wafers, fabricated with electrodes forming capacitors in a fully differential capacitive architecture. These electrodes may be isolated on a layer of silicon dioxide. In some embodiments, the accelerometer also includes silicon dioxide layers, piezoelectric structures, getter layers, bonding pads, bonding spacers, and force feedback electrodes, which may apply a force to the proof mass region. Fully differential MEMS accelerometers may be used in geophysical surveys, e.g., for seismic sensing or acoustic positioning.

Abstract: A microelectromechanical system (MEMS) accelerometer having separate sense and force-feedback electrodes is disclosed. The use of separate electrodes may in some embodiments increase the dynamic range of such devices. Other possible advantages include, for example, better sensitivity, better noise suppression, and better signal-to-noise ratio. In one embodiment, the accelerometer includes three silicon wafers, fabricated with sensing electrodes forming capacitors in a fully differential capacitive architecture, and with separate force feedback electrodes forming capacitors for force feedback. These electrodes may be isolated on a layer of silicon dioxide. In some embodiments, the accelerometer also includes silicon dioxide layers, piezoelectric structures, getter layers, bonding pads, bonding spacers, and force feedback electrodes, which may apply a restoring force to the proof mass region. MEMS accelerometers with force-feedback electrodes may be used in geophysical surveys, e.g.

Abstract: A fully differential microelectromechanical system (MEMS) accelerometer configured to measure Z-axis acceleration is disclosed. This may avoid some of the disadvantages in traditional capacitive sensing architectures—for example, less sensitivity, low noise suppression, and low SNR, due to Brownian noise. In one embodiment, the accelerometer comprises three silicon wafers, fabricated with electrodes forming capacitors in a fully differential capacitive architecture. These electrodes may be isolated on a layer of silicon dioxide. In some embodiments, the accelerometer also includes silicon dioxide layers, piezoelectric structures, getter layers, bonding pads, bonding spacers, and force feedback electrodes, which may apply a force to the proof mass region. Fully differential MEMS accelerometers may be used in geophysical surveys, e.g., for seismic sensing or acoustic positioning.

Abstract: A method and apparatus for detecting underwater sounds is disclosed. An embodiment of the apparatus includes a substrate with a vacuum-sealed cavity. A support structure and an acoustic pressure sensor are situated on the substrate. The support structure of the apparatus may include a first oxide layer situated on the substrate, a silicon layer situated on the first oxide layer, and a second oxide layer situated on the silicon layer. The acoustic pressure sensor of the apparatus includes a first electrode layer situated on the substrate, a piezoelectric layer situated on the first electrode layer, and a second electrode layer situated on the piezoelectric layer. In one embodiment, the surface area of the second electrode layer is between about 70 to 90 percent of the surface area of the piezoelectric layer. In various embodiments, the support structure is thicker than the piezoelectric layer.

Abstract: According to embodiments of the present invention, a sensor is provided. The sensor includes a substrate, a beam suspended from the substrate, and a plurality of conductive lines arranged on the beam, wherein the beam is adapted to be displaced in response to a current flowing through the plurality of conductive lines, and a magnetic field interacting with the beam, and wherein the sensor is configured to determine a property of the magnetic field based on the displacement of the beam. According to further embodiments of the present invention, a method of controlling a sensor is also provided.

Abstract: In various embodiments, a sensor device is provided. The sensor includes a sensor receiving portion, a sensor arranged in the sensor receiving portion and a cap covering the sensor and the sensor receiving portion. The cap includes a plurality of recesses in the inner side wall of the cap for reducing the pressure measured by the sensor.

Abstract: A power amplifier amplifying an input signal to generate an output signal, comprising a cascode unit and a bias circuit. The cascode unit comprises a cascode stage, a first input stage, and a second input stage. The cascode stage generates the output signal. The first input stage, in cascode with the cascode transistor, has a first signal input to be biased to provide a first amplifier gain. The second input stage, in cascode with the cascode transistor, has a second signal input to be biased to provide a second amplifier gain. The bias circuit, coupled to the first and the second input stages comprises first and second switches. The first switch, coupled to the first input stage, is switched on to bias the first input stage with a bias voltage. The second switch, coupled to the second input stage, is switched on to bias the second input stage with the bias voltage.

Abstract: The present invention provides a fingerprint sensing mechanism using a two-dimensional thermoelectric sensor array to capture the thermal image related to the ridges and valleys on the finger, wherein its fabricating method is totally compatible with integrated circuits processing. Using the body temperature of a human being as the stimulation source for biometrics, a temperature difference is produced from a ridge of a fingerprint contacting the thermoelectric sensor and the temperature gradient is converted into an electrical signal. A plurality of thermoelectric sensors arranged in a two-dimensional array forms a fingerprint sensor so as to obtain the electrical signal output of the ridge profile of the fingerprint.

Abstract: An electronic apparatus including a substrate, a baseband component and an electronic assembly is disclosed. The substrate has a first surface and a second surface opposite to the first surface. The baseband component is disposed on the first surface and electrically connected to the substrate. The electronic assembly includes an integrated passive device and a radio frequency component. The integrated passive device is disposed on the second surface and electrically connected to the substrate. The radio frequency component is disposed on the integrated passive device and electrically connected to the integrated passive device.