Patents by Inventor Ming-Lun Szu

Ming-Lun Szu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090280660
    Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.
    Type: Application
    Filed: July 16, 2009
    Publication date: November 12, 2009
    Inventors: Fang-Jun Liao, Ming-Lun Szu
  • Patent number: 7589972
    Abstract: An electrical connector assembly (100) made in accordance with a preferable embodiment of the present invention comprises an electrical socket (20) with a plurality of contacts received therein, an IC module (30) mounted onto the electrical socket (20) so as to make electrical connection therebetween, a heat sink assembly (40) pressing on the IC module (30) and including a heat spreader (401), and a clip (50) fastening the heat sink assembly (40) above the IC module (30). The IC module (30) comprises a substrate (301) and at least one die (302) attached on a top surface of the substrate (301). The clip (50) has a set of first fingers (504) for pressing the die (301) of the IC module (30) and a set of second fingers (505) for pressing the substrate (301) of the IC module (30).
    Type: Grant
    Filed: May 26, 2007
    Date of Patent: September 15, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hao-Yun Ma, Ming Lun Szu, Derrell Wertz
  • Patent number: 7563107
    Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: July 21, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Fang-Jun Liao, Ming-Lun Szu
  • Patent number: 7510427
    Abstract: An electrical connector (1) for connecting an LGP (12) to a printed circuit board includes a housing having a bottom wall (100), side walls (101) and a number of contacts (11) mounted into the bottom wall. The side walls have a first side wall (1011) including a number of spring plates (104) assembled thereto, and a second side wall (1012) opposite to the first side wall having a guiding portion (102) disposed thereon. A receiving space (105) is defined between the guiding portion and the bottom wall for receiving the LGP.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: March 31, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Ming-Lun Szu
  • Publication number: 20090075499
    Abstract: An IC socket comprises an insulative housing having a plurality of periphery walls and a cover pivotally assembled to one end of the insulative housing and adapted to be locked to the insulative housing at the other end. The cover includes a plurality of peripheral edges. The cover also has a plurality of spring arms upwardly extending therefrom and disposed at the edges.
    Type: Application
    Filed: September 18, 2008
    Publication date: March 19, 2009
    Inventor: Ming-Lun Szu
  • Publication number: 20080291638
    Abstract: Provided a clip set (50) for pressing a CPU toward LGA contacts of a CPU socket comprises, a rigid body having an elongate base (501) with upper and lower edges. A set of first pressing finger (502) extends from the upper edge traversally and away from the base. Each of the first pressing fingers includes a first pressing pad located at a first plane. A set of second pressing finger (503) extends from and away from the base, and includes a second pressing pad located at a second plane differential to the first plane. The set of first and second pressing fingers are dimensioned to be located in two different levels so as to assert downward pressure to a die (302) of the CPU and a substrate (301) of the CPU, respectively.
    Type: Application
    Filed: May 26, 2007
    Publication date: November 27, 2008
    Inventors: Hao-Yun Ma, Ming Lun Szu, Derrell Wertz
  • Patent number: 7445454
    Abstract: An electrical connector assembly (5) includes an electrical connector (6) and a pick up cap (7) latchably assembly to the electrical connector. The electrical connector includes an insulative housing (60) and a number of conductive contacts received in the insulative housing. The pick up cap includes a main portion (70) and at least a pair of hooks (71) extending from the main portion toward the electrical connector to latch with the electrical connector. The pick up cap forms at least a pair of protecting members (72) adjacent to corresponding hook to protect the hook from being broken by improper force.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: November 4, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ming-Lun Szu, Fu-Pin Hsieh
  • Publication number: 20080220628
    Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing has a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for retaining the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four raised portions (102) extending upwardly around the base. A multiplicity of protrusions (106) is respectively extended upwardly from the walls. When a force is exerted down the LGA chip to make the LGA chip engage with the terminals, the protrusions and the four raised portions can support the force for separate the force without making the LGA chip deforming downwardly. This ensures that engagement between the connector and the LGA chip is accurate and reliable.
    Type: Application
    Filed: May 13, 2008
    Publication date: September 11, 2008
    Inventors: Fang-Jun Liao, Ming-Lun Szu
  • Publication number: 20080188097
    Abstract: An electrical connector (1) for connecting an LGP (12) to a printed circuit board includes a housing having a bottom wall (100), side walls (101) and a number of contacts (11) mounted into the bottom wall. The side walls have a first side wall (1011) including a number of spring plates (104) assembled thereto, and a second side wall (1012) opposite to the first side wall having a guiding portion (102) disposed thereon. A receiving space (105) is defined between the guiding portion and the bottom wall for receiving the LGP.
    Type: Application
    Filed: February 4, 2008
    Publication date: August 7, 2008
    Inventor: Ming-Lun Szu
  • Publication number: 20080124955
    Abstract: An electrical connector assembly (100) includes a first retaining half (51) securely mounted on a printed substrate, a load plate (60) pivotally attached to the first retaining half, a second retaining half (52) opposite and distant to the first retaining half, a lever (70) pivotally attached to the second retaining half and including a cam portion (706) capable of pushing down a pressed section (610) from the clip toward the printed substrate, and a connector (30) mounted between the first and second retaining halves.
    Type: Application
    Filed: November 26, 2007
    Publication date: May 29, 2008
    Inventor: Ming-Lun Szu
  • Patent number: 7371075
    Abstract: An electrical connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in passageways (104) of the housing. The housing defines a base (100) and sidewalls (12, 14), the base and the sidewalls cooperatively defining a space therebetween for receiving the LGA chip. The base has a multiplicity of walls respectively between every two adjacent passageways along a length thereof, and four peripheral raised portions (102) extending upwardly and adjoining the sidewalls respectively. A multiplicity of protrusions (106) extends upwardly from the walls respectively. A height of the raised portions is the same as that of the protrusions. When a force is exerted down on the LGA chip to make the LGA chip engege with the terminals, a proportion of the force is borne by the protrusions and the raised portions.
    Type: Grant
    Filed: July 19, 2004
    Date of Patent: May 13, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Fang-Jwu Liao, Ming-Lun Szu
  • Publication number: 20080102651
    Abstract: An electrical connector assembly (5) includes an electrical connector (6) and a pick up cap (7) latchably assembly to the electrical connector. The electrical connector includes an insulative housing (60) and a number of conductive contacts received in the insulative housing. The pick up cap includes a main portion (70) and at least a pair of hooks (71) extending from the main portion toward the electrical connector to latch with the electrical connector. The pick up cap forms at least a pair of protecting members (72) adjacent to corresponding hook to protect the hook from being broken by improper force.
    Type: Application
    Filed: October 31, 2007
    Publication date: May 1, 2008
    Inventors: Ming-Lun Szu, Fu-Pin Hsieh
  • Patent number: 7351087
    Abstract: Disclosed is an LGA socket (1) including a socket body (10) having a number of terminals (11) embedded therein. A stiffener (12) is bottomed to the socket body. A load plate (14) and a load lever (15) are pivotally assembled to two opposite ends of the stiffener. At least one of the stiffener and the load plate is formed to have a lateral-opened hollow frame by stamp of an elongated strip of metal.
    Type: Grant
    Filed: September 12, 2005
    Date of Patent: April 1, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Ming-Lun Szu
  • Patent number: 7322830
    Abstract: An electrical connector comprises a base mounted on a PCB, a cover for holding a CPU, and a plurality of contacts each of which has a supporting portion received in the base and an engaging portion reaching out of the base. The cover is formed with a number of through holes for fixing the contact. Every engaging portion crosses and partially extends out of the corresponding through hole. In process of assembly, each contact is pressed and generates elastic deformation, which causes its engaging portion to move. The CPU and the cover can move with the engaging portion simultaneously.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: January 29, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Ming Lun Szu
  • Patent number: 7207822
    Abstract: An LGA socket (1) is provided for electrically connecting an IC package to a circuit substrate. The LGA socket includes a housing (2) having a number of conductive terminals (3) and a stiffener (4) formed with a pair of clasping ribs (420) bent inwardly towards the housing disposed around the housing. A load plate (5) having a hook (520) is pivotally attached to the stiffener and moveable relative to the stiffener between an opening position and a closed position. A lever is pivotally connected to the hook. The lever is rotatable with respect to the hook so as to abut against the clasping ribs and successively lock the load plate in position.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: April 24, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Ming-Lun Szu
  • Patent number: 7182650
    Abstract: Disclosed is an electrical connector (20) for connecting an IC package (30) having a mating surface (302) and a number of pins (300) and guiding walls (316) extending past the mating surface. The electrical connector includes a base (200) defining a number of passages (2040). A number of terminals (230) are set in the corresponding passages, respectively. A cover (210) defining a number of through-holes (214) in accordance with the passages and guiding slots (216) in compliance with the guiding walls is movably mounted on the base. A cam (220) is provided to drive the cover to move relative to the base. When the guiding walls of the IC package are inserted into the guiding slots, the pins of the IC package remain a distance away from the through-holes of the cover.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: February 27, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Fang-Jwu Liao, Ming-Lun Szu
  • Patent number: 7182607
    Abstract: Disclosed is an electrical socket connector including an insulative housing (1) with a plurality of passageways (101) extending from a top mating interface (10a) toward a mounting interface (10b). A plurality of terminals (2) is inserted into the respective passageways from the mating interface to the mounting interface. Each of the terminals includes a main body (20), a lower contact engaging portion (21) extending downwardly from the main body. Guiding means (102) are formed between the terminal and the passageway and adjacent the contact engaging portion such that during the insertion of the terminal into the passageway, said guiding means and the terminal begin to mate at a location that the contact engaging portion of the terminal does not enter the passageway.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: February 27, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chieh-Jung Huang, Ming-Lun Szu
  • Patent number: 7179120
    Abstract: According to an embodiment of the present invention, an LGA connector (10) for forming electrical connection between an LGA package and a circuit substrate includes a dielectric housing (20) defining a number of passages (2024) and a number of conductive terminals (30) seated in the corresponding passages, respectively. The dielectric housing is provided with a number of reinforced columns (2026) capable of being inserted into a number of recesses correspondingly defined in the circuit substrate, to favorably prevent the dielectric housing from being displaced relative to the circuit substrate.
    Type: Grant
    Filed: January 26, 2006
    Date of Patent: February 20, 2007
    Assignee: Hon Hai Precision Ind. Co., Ltd
    Inventors: Jeffrey(Fu-Bin) Hsieh, Ming-Lun Szu
  • Patent number: 7128580
    Abstract: A socket connector (1) includes a dielectric housing (11) and a number of contacts (12) received in the housing. The housing defines top and bottom surfaces (111, 112) and a number of passageways (113) between the top and bottom surfaces. Each contact has a retention body (121) secured in a corresponding passageway and a contact portion extending beyond the top surface a first vertical distance for engaging with a corresponding pad (21) of an IC package (2). The body has an end projects beyond the top surface a second vertical distance. Protrusions (115) extend upwardly from the top surface toward the IC package, for supporting the IC package. Each protrusion projects the top surface a vertical height shorter than said first vertical distance but larger than said second distance. Thereby the pad can be prevented from electrically engaging the body of an adjacent contact when the IC package is pressed to mate with the connector.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: October 31, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Fang-Jwu Liao, Ming-Lun Szu
  • Patent number: 7112066
    Abstract: An electrical connector assembly (1) includes an LGA connector (2) and a pick up cap (3) mounted onto the connector. The connector defines a number of cells (26) for receiving a corresponding number of contacts (22). The pick up cap has a planar body (31) forming a plane top surface (300), which can be sucked by a vacuum suction device to move the connector assembly to a desired location on a PCB, and a bottom surface (301) opposite to the top surface. Several elongate passages (34) are defined in and through the planar body. Each passage extends aslant from the top surface to the bottom surface thereby preventing the contacts from dust. When curing adhesive film at high temperature, heated air can flow quickly through the passages and the cells to a bottom portion of the connector and reliable electrical connection between the contacts and the PCB are subsequently produced.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: September 26, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Fang-Jwu Liao, Ming-Lun Szu