Heat dissipation device

Abstract

A heat dissipation device is that at least one rigidly heat-conducting material is disposed to a base of a heat dissipation fin set and extended among heat dissipation fins. At least one flexible superconductor passes through the heat dissipation fins. One end of the flexible superconductor is welded with the rigidly heat-conducting material. A fluid is filled within a flexible tube body of the flexible superconductor and can play a role of rapidly transporting mass of heat in a condition of unchanged temperature to improve the heat conduction efficiency of the heat dissipation fins.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat dissipation device, and more particularly to the heat dissipation device capable of effectively improving the heat conduction efficiency of heat dissipation fins and increasing the air convection rate of the heat dissipation fins.

2. Description of the Related Art

When a light emitting diode is utilized for illumination purpose, a number of light emitting diodes must be simultaneously operated to achieve the brightness as well as conventional incandescent light bulbs or fluorescent lamp tubes. These light emitting diodes with different amounts are established on a substrate based upon a specific arrangement. Normally, the substrate is a printed circuit board (PCB). The material property of the printed circuit board is unfavorable for the heat conduction between the light emitting diode elements and a heat dissipation seat.

After the illumination lamp equipped with the light emitting diodes operates for a while, the phenomena of serious heat accumulation is generated by the light emitting diodes on the substrate. Consequently, the illumination intensity of the light emitting diodes is unable to be retained. Moreover, the service life of the light emitting diodes is further decreased. To overcome the foregoing problem, heat dissipation fins are usually disposed to the substrate or the exterior of the lamp while using the illumination lamp equipped with the light emitting diodes. With the design of the heat dissipation fins, the heat dissipation effect can be achieved by air convection.

Since the heat dissipation fin mainly utilizes air convection to achieve the heat dissipation effect, the thermal conductivity coefficient of the heat dissipation fin made of metal materials with single solid phase is almost a fixed value (the coefficients of copper and aluminum are 393 W/mk and 238 W/mk respectively). It seems that the conventional heat dissipation device is unable to deal with the issue derived from the overheating of chipsets disposed in the light emitting diode illumination lamp if the heat dissipation fin merely relies upon the air convection to achieve the heat dissipation effect.

SUMMARY OF THE INVENTION

In view of the shortcomings of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct extensive researches and experiments, and finally developed a heat dissipation device as a primary objective, thereby effectively improving the heat conduction efficiency of heat dissipation fins and increasing the air convection rate of the heat dissipation fins.

To achieve the foregoing objective, the heat dissipation device is that at least one rigidly heat-conducting material is disposed to a base of a heat dissipation fin set and extened among heat dissiapation fins of the heat dissipation fin set. At least one flexible superconductor passes through heat dissipation fins. One end of the flexible superconductor is welded with the rigidly heat-conducting material. At least one air current through hole is correspondingly disposed to each heat dissipation fin.

A fluid is filled within a flexible tube body of the flexible superconductor. The heat transport can be continuously performed since the fluid circularly absorbs and dissipates mass of heat during the phase change process. Thus the flexible superconductor can play a role of rapidly transporting mass of heat in a condition of unchanged temperature to improve the heat conduction efficiency of the heat dissipation fins and to relatively increase the the air convection rate of the heat dissipation fins by incorporating the effect of each air current through hole.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a structural diagram of a heat dissipation device according to a first embodiment of the present invention;

FIG. 2 is a structural diagram of a rigidly heat-conducting material and a flexible superconductor according to the present invention;

FIG. 3 is a structural decomposition drawing of a heat dissipation device according to a first embodiment of the present invention;

FIG. 4 is a reference diagram of a heat dissipation device according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The foregoing and other technical characteristics of the present invention will become apparent with the detailed description of the preferred embodiments and the illustration of the related drawings.

With reference to FIG. 1 to FIG. 2 for a heat dissipation device in accordance with the present invention, the device comprises at least one heat dissipation fin set 11, at least one rigidly heat-conducting material 12, and at least one flexible superconductor 13.

At least one buckle notch 112 is correspondingly disposed to a base of a sheet body of each heat dissipation fin 111 of the heat dissipation fin set 11 and provided for relatively embedding the rigidly heat-conducting material 12. At least one via 113 passed by the flexible superconductor 13 is correspondingly disposed to the sheet body of each heat dissipation fin 111. At least one air current through hole 114 is correspondingly disposed on the sheet body of each heat dissipation fin 111 and taken as a channel of the heat dissipation fin set 11 for circulating air current.

The rigidly heat-conducting material 12 is relatively arranged to the base of the heat dissipation fin set 11 and extended among sheet bodies of the hat dissipation fins 111. The ridifly heat-conducting material 12 is a squared shaft structure relatively embedded in the buckle notch 112 of the heat dissipation fins 111. Several positioning points 121 are preset on the shaft structure to position each heat dissipation fin 111.

The flexible superconductor 13 relatively passes through the heat dissipation fins 111. One end of the flexible superconductor is welded with the rigidly heat-conducting material 12. In the embodiment, the flexible superconductor 13 has at least one flexible tube body 131. A fluid 132 is filled within the flexible tube body 131. The flexible tube body 131 relatively penetrates through vias 113 of the heat dissipation fins 111, and one end of the flexible tube body 131 is welded with the rigidly heat-conducting material 12.

In addition, as shown in FIG. 3 and FIG. 4, the heat dissipation device further comprises a heat conducting and fastening seat 14. A top surface of the heat conducting and fastening seat 14 has at least one positioning recess portion 141 for containing the heat dissipation fin set 11 to increase the structural strength of the heat dissipation device, and the heat dissipation fin set is in contact with a heat source of an using object (a light emitting diode lamp 20 as shown in the figure) through the heat conducting and fastening seat 14.

While using the heat dissipation device, the air convection provided by the heat dissipation fin set 11 is utilized to achieve heat dissipation effect. The heat transport can be continuously performed since the fluid 132 within the flexible superconductor 13 passing through the heat dissipation fin set 11 circularly absorbs and dissipates mass of heat during the phase change process. Thus the flexible superconductor 13 can play a role of rapidly transporting mass of heat in a condition of unchanged temperature to improve the heat conduction efficiency of the heat dissipation fins 111 and to relatively increase the the air convection rate of the heat dissipation fins 111 by incorporating the effect of each air current through hole 114.

The present invention improves over the prior art and complies with patent application requirements, and thus is duly filed for patent application. While the invention has been described by device of specific embodiments, numerous modifications and variations could be made thereto by those generally skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims

1. A heat dissipation device comprising:

at least one heat dissipation fin set having at least one air current through hole that is correspondingly disposed to a sheet body of each heat dissipation fin and that is taken as a channel of the heat dissipation fin set for circulating air current;

at least one rigidly heat-conducting material relatively arranged to a base of the heat dissipation fin set and extended among the sheet bodies of heat dissipation fins; and

at least one flexible superconductor relatively passing through the sheet bodies of the heat dissipation fins, wherein one end of the flexible superconductor is welded with the rigidly heat-conducting material.

2. The heat dissipation device as recited in claim 1, further comprising a heat conducting and fastening seat, wherein a top surface of the heat conducting and fastening seat has at least one positioning recess portion for containing at least one heat dissipation fin set.

3. The heat dissipation device as recited in claim 1, wherein the heat dissipation fin set has at least one buckle notch that is correspondingly disposed to base of the sheet bodies of the heat dissipation fins and that is provided for relatively embedding the rigidly heat-conducting material.

4. The heat dissipation device as recited in claim 1, wherein the sheet body of each heat dissipation fin of the heat dissipation fin set has at least one via passed by the flexible superconductor.

5. The heat dissipation device as recited in claim 1, wherein rigidly heat-conducting material is a squared shaft structure made of copper, and several positioning points are preset on the shaft structure and provided for positioning each heat dissipation fin.

6. The heat dissipation device as recited in claim 1, wherein the flexible superconductor has a flexible tube body, and a fluid is filled within the flexible tube body.