Abstract: A method for locating critical control points on a part or combination of parts during a manufacturing process involves mating, directly or indirectly, a jig extension to the part or parts. A pattern on the jig extension defines an origin point that is used to track the position of the part or parts during manufacturing, such as during location-sensitive operations. The jig extension may be a shoe last extension which connects to a shoe or shoe component via a shoe last.

Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.

Abstract: Metal gate cutting techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary method includes receiving an integrated circuit (IC) device structure that includes a substrate, one or more fins disposed over the substrate, a plurality of gate structures disposed over the fins, a dielectric layer disposed between and adjacent to the gate structures, and a patterning layer disposed over the gate structures. The gate structures traverses the fins and includes first and second gate structures. The method further includes: forming an opening in the patterning layer to expose a portion of the first gate structure, a portion of the second gate structure, and a portion of the dielectric layer; and removing the exposed portion of the first gate structure, the exposed portion of the second gate structure, and the exposed portion of the dielectric layer.

Abstract: A production machine includes a first motor, a raw material mixer receiving a mixture of plant-based protein and stirring and mixing materials in the mixture; a raw material storage tank receiving and storing the mixture stirred and mixed by the raw material mixer; a vacuum pump evacuating the raw material storage tank; a second motor controlling discharging speed of the mixture from the raw material storage tank; a raw material delivery pump; a pressure pump receiving and pressurizing the mixture delivered by the raw material delivery pump from the raw material storage tank; a heating/cooling device heating the mixture to a preset heating temperature within a preset time period and cooling the mixture to a preset cooling temperature; a fiberizing and cooling mold receiving the cooled mixture and performing an extrusion operation thereon to form fibrous materials; and a forming mold shaping the fibrous materials to form an artificial meat.

Abstract: An electronic device includes a receiver circuit, a clock generator circuit, and a clock control circuit. The receiver circuit receives first clock information associated with a first clock of another electronic device. The clock generator circuit generates a second clock for the electronic device. The clock control circuit obtains second clock information associated with the second clock, generates a clock control signal according to the first clock information and the second clock information, and outputs the clock control signal to the clock generator circuit, where the clock generator circuit adjusts the second clock in response to the clock control signal.

Abstract: Described herein are a novel concept of thermally stimulated delayed phosphorescence (TSDP) to harvest light emission from the higher energy triplet excited state via the up-conversion from the lowest-energy triplet excited state by efficient spin-allowed reverse internal conversion as well as the development of TSDP emitters, as exemplified by a novel class of gold(III) compounds with TSDP properties and methods of making and using said compounds. The gold(III) compound includes a triazine-containing cyclometalating tridentate ligand and one auxiliary ligand, both coordinated to a gold(III) metal center. The gold(III) compounds disclosed herein can be used as light-emitting material for fabrication of OLEDs.

Abstract: An electrical connector includes: an insulating housing having two side walls defining signal passageways and grounding passageways; two rows of terminals including signal terminals in the signal passageways and grounding terminals in the grounding passageways, each terminal having a retained portion and an elastic arm with a contacting portion extending into the card slot; a one-piece inserting member assembled in the insulating housing, the inserting member defining first inserting portions in the signal passageways and made from insulating plastic, and second inserting portions in the grounding passageways and at least partly made from conductive plastic, the second inserting portions mechanically connecting the grounding terminals; and a metallic member retained in the inserting member, wherein the metallic member defines two rows of grounding fingers, the grounding fingers are located in corresponding second inserting portions respectively and directly connect or face but not directly connect with corres

Abstract: The present disclosure relates to exclusion rings for use in processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The exclusion ring includes an alignment structure that cooperates with an alignment structure on a platen on which the exclusion ring will rest during processing of the wafer. The first alignment structure includes a guiding surface which promotes the reception of and positioning of the second alignment structure within the first alignment structure. Methods of utilizing the described exclusion rings are also described.

Abstract: The present disclosure is directed to workpiece support for supporting a workpiece during semiconductor processing. The workpiece support includes one or more support frame bodies including a plurality of spaced apart spacers on a first surface of the support frame bodies. The spacers include a first surface spaced apart from the first surface of the support frame body. The spacing between the first surface of the spacers and the first surface of the support frame body results in the underside of the workpiece contacting the spacers but not contacting the first surface of the support frame body. Portions of the underside of the workpiece that do not contact the first surface of the support frame body are less susceptible to damage or accumulation of unwanted debris.

Abstract: An electrical connector includes: an insulating housing having a mating face, a card slot recessed from the mating face with a floor face facing the mating face, and two side walls located at opposite sides of the card slot; and two terminal modules retained in the insulating housing, each terminal module including a row of terminals, a conductive plastic, and an insulating plastic, the row of terminals including plural signal terminals and plural grounding terminals, wherein the grounding terminals are partially retained in the conductive plastic and the insulating plastic surrounds and retains the signal terminals and the conductive plastic, thereby forming the terminal module.

Abstract: An illuminator comprises a substrate, a plurality of connecting pads, a plurality of LEDs, and a plurality of adhesive blocks. The plurality of connecting pads is on the substrate, each of the connecting pads defines a first well. Each of the plurality of LEDs is on one of the plurality of connecting pads. Each of the plurality of adhesive blocks bonds one of the plurality of LEDs and one of the plurality of connecting pads. Each of the plurality of adhesive blocks at least partially covers the first well of the corresponding one of the plurality of connecting pads, enabling light to shine on the each of plurality of adhesive blocks from a side of the substrate away from the plurality of connecting pads. An illuminator repairing device and an illuminator repairing method are also disclosed.

Abstract: An electrical connector includes: an insulating housing defining a mating face, a card slot, and two side walls at opposite sides of the card slot, each of the side walls defining signal passageways and grounding passageways; two rows of terminals located on the side walls and each row of terminal including signal terminals in the signal passageways and grounding terminals in the grounding passageways, the terminals including retaining portions retained in the passageways and elastic arms with contacting portions extending into the card slot; and a one-piece inserting member assembled in the insulating housing, wherein the inserting member defines plural first inserting portions inserted in the signal passageways and plural second inserting portions inserted in the grounding passageways, the second inserting portions contact corresponding grounding terminals, respectively, to establish a grounding path.

Abstract: An illuminator includes a substrate, an interlayer, a plurality of connecting pads, a plurality of LEDs, and a plurality of adhesive blocks. The interlayer is on the substrate. The connecting pads are on a side of the interlayer away from the substrate. Each LEDs is on a corresponding connecting pad. Each adhesive blocks bonds one LED to one connecting pad. The interlayer defines a plurality of grooves, each of the grooves corresponds to a connecting pad, each grooves includes an opening through a surface of the interlayer facing the top side of the illuminator. The opening is configured and arranged so that the corresponding adhesive block, in a molten form, flows through the opening into the corresponding groove of the plurality of grooves. A method of fabricating the illuminator and a method of repairing the illuminator are further disclosed.

Abstract: A perovskite optical element includes a light guiding unit and a luminescent layer. The light guiding unit is configured to conduct light and serves as a resonant cavity. The luminescent layer is a thin film made of perovskite material and clads the light guiding unit. The luminescent layer is configured to be excited by an excitation module to emit light. The light is conducted and output by the light guiding unit. A manufacturing method of a perovskite optical element includes preparing a dip coating solution; dipping a single crystal optical fiber in the dip coating solution for one hour, removing the single crystal optical fiber out of the dip coating solution, and drying the single crystal optical fiber; and placing the single crystal optical fiber into a tube furnace, heating the crystal optical fiber, and introducing synthetic molecules into the tube furnace.

Abstract: A perovskite optical element includes a light guiding unit and a luminescent layer. The light guiding unit is configured to conduct light and serves as a resonant cavity. The luminescent layer is a thin film made of perovskite material and clads the light guiding unit. The luminescent layer is configured to be excited by an excitation module to emit light. The light is conducted and output by the light guiding unit. A manufacturing method of a perovskite optical element includes preparing a dip coating solution; dipping a single crystal optical fiber in the dip coating solution for one hour, removing the single crystal optical fiber out of the dip coating solution, and drying the single crystal optical fiber; and placing the single crystal optical fiber into a tube furnace, heating the crystal optical fiber, and introducing synthetic molecules into the tube furnace.

Abstract: A fluid level indicator and method of determining a fluid level. In one example, a fluid level indicator is configured to be disposed in a brake fluid reservoir of a vehicle. A motor drives the fluid level indicator at a constant horsepower. A motor sensor monitors the speed of the motor. A controller receives the motor speed data from the motor sensor and receives vehicle movement data from other vehicle sensors. The controller determines the level of the brake fluid based on the motor speed and the vehicle movement data.

Abstract: Integrated circuit structures including an interconnect feature without a higher-resistance liner material. In absence of a liner, metal of low resistance directly contacts an adjacent dielectric material, enabling lower resistance interconnect. Even for low-k dielectric compositions, adhesion of the metal to the dielectric material is improved through the incorporation of nitrogen proximal to the interface. Prior to deposition of the metal upon a surface of the dielectric, the surface is exposed to nitrogen species to form a nitrogen-rich compound at the surface. The metal deposited upon the surface may then be nitrogen-lean, for example a substantially pure elemental metal or metal alloy.

Abstract: A wireless audio output device includes a plurality of audio output units, first and second audio output units among the audio output units being set as first and second roles, respectively. The first role is to establish a multicast link with a source device, to receive one or more media packets from the source device on the multicast link, and to perform bidirectional communication with the source device. The second role is to join the multicast link, to receive the one or more media packets from the source device on the multicast link, to perform unidirectional communication with the source device, and to perform unidirectional and/or bidirectional communication with the first role. An extended packet time slot is divided and each of the first role and the second role transmits or receives one or more extended packets during the extended packet time slot.

Abstract: A plastic molded product includes a plastic body provided with a plurality of holes, which are recessed in a common depth direction, on a surface of the plastic body. The holes include: an inner surface including an inlet a specific reference plane perpendicular to the depth direction and including at least a portion of the inlet and a depth reference point, which is spaced away from a center point on an inlet side of the specific reference plane toward a bottom side of the hole, the depth reference point being spaced away by a distance equal to ¼ of a maximum value of an inlet side bore diameter on the specific reference plane. A deepmost portion of the inner surface of the hole is in a position which coincides with the reference point or is deeper than the reference point toward the bottom side.

Abstract: A fluid level indicator and method of determining a fluid level. In one example, a fluid level indicator is configured to be disposed in a brake fluid reservoir of a vehicle. A motor drives the fluid level indicator at a constant horsepower. A motor sensor monitors the speed of the motor. A controller receives the motor speed data from the motor sensor and receives vehicle movement data from other vehicle sensors. The controller determines the level of the brake fluid based on the motor speed and the vehicle movement data.