Abstract: According to one embodiment, each monitoring device acquires monitoring variables from an observation target, generates an individual multidimensional distribution of the monitoring variables, and transmits the individual multidimensional distribution to a server. The server generates sampling data using the individual multidimensional distribution received from each monitoring device, generates an overall multidimensional distribution of the monitoring variables using the sampling data, determines a statistical model of each index using the overall multidimensional distribution, generates an overall index multidimensional distribution of indexes using the statistical model and the overall multidimensional distribution, and transmits the overall index multidimensional distribution and statistical models to each monitoring device.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: In a method of estimating one of mechanical supporting states of a housing for an electronic apparatus, a drive signal is supplied to an oscillation device from which first oscillation is applied to the housing. A sensor detects a second oscillation transferred through the housing in response to the first oscillation to generate an oscillation signal, and a measurement response characteristic is obtained based on the drive signal and the oscillation signal, and is compared with reference response characteristics which are correlated with the mechanical supporting states, respectively, to estimate one of the mechanical supporting states of the housing.

Abstract: A life predicting method for a solder joint includes a step of referring to a temperature history of a measurement object having a solder joint, a step of examining at least one physical quantity selected from the group consisting of amplitude, a cycle number, a mean temperature, and a periodic length of a temperature variation with a cycle count method from the temperature history, a step of calculating a strain range by utilizing a previously prepared response surface from the physical quantity examined with the cycle count method, and a step of calculating a strain range increasing rate from a strain range with reference to a previously obtained damage index and a strain variation history of the strain range.

Abstract: According to one embodiment, an electronic device includes a circuit board, an electronic component, a first pad formed on the circuit board, a second pad formed on the electronic component, a junction which connects the first pad and the second pad, and a detecting unit. The detecting unit detects an electric characteristic of a connection path that includes the junction and at least one of the first pad and the second pad. An insulator is formed in part of a contact area of at least one of the first pad and the second pad that is in contact with the junction.

Abstract: An electronic apparatus includes: a circuit board that is disposed inside a case that is formed by coupling first and second case halves, the circuit board being interposed between first and second boss portions; first and second conductive members that are disposed between a gap formed between the first boss portion and the circuit board; a third conductive member that is disposed between the first boss portion and the first conductive member and between the first boss portion and the second conductive member to electrically connect the first conductive member to the second conductive member; and a measurement circuit that is electrically connected to a first wiring and a second wiring, which are respectively connected to the first conductive member and the second conductive member, and measures an electrical characteristic value of at least one of the first conductive member and the second conductive member.

Abstract: An electronic apparatus includes: a circuit board that is disposed inside a case that is formed by coupling first and second case halves, the circuit board being interposed between first and second boss portions; first and second conductive members that are disposed between a gap formed between the first boss portion and the circuit board; a third conductive member that is disposed between the first boss portion and the first conductive member and between the first boss portion and the second conductive member to electrically connect the first conductive member to the second conductive member; and a measurement circuit that is electrically connected to a first wiring and a second wiring, which are respectively connected to the first conductive member and the second conductive member, and measures an electrical characteristic value of at least one of the first conductive member and the second conductive member.

Abstract: A RAID system to transfer data to and from host equipment includes a semiconductor storage unit, a semiconductor-memory selector, and a memory controller. The semiconductor storage unit includes two or more semiconductor memories, a mounting board, and solder joints. The semiconductor memories are mounted on the mounting board. The solder joints are between the semiconductor memories and the mounting board. The semiconductor-memory selector selects a combination of the semiconductor memories to dispersively record the data in the semiconductor storage unit. The memory controller accesses the combination in response to a request of the host equipment. In addition, the selector selects the combination so that mechanical loads received by the semiconductor memories are averaged.

Abstract: According to one aspect of the invention, there is provided an electronic apparatus having a circuit board supporting structure, the circuit board supporting structure including: a casing including a first body and a second body, the first body having a first boss portion, the second body having a second boss portion; a jig including a cylindrical portion having, and a flange portion formed on an outer periphery, the cylindrical portion configured to slidably receive the first boss portion and the second boss portion in an inner peripheral wall; and a circuit board disposed in the casing. The first and second boss portions are configured to be fastened by a bolt member; the circuit board has a hole and a joining region provided around the hole, the hole configured to allow the cylindrical portion to penetrate therethrough; and the joining region is configured to be soldered to the flange portion.

Abstract: In a method of estimating one of mechanical supporting states of a housing for an electronic apparatus, a drive signal is supplied to an oscillation device from which first oscillation is applied to the housing. A sensor detects a second oscillation transferred through the housing in response to the first oscillation to generate an oscillation signal, and a measurement response characteristic is obtained based on the drive signal and the oscillation signal, and is compared with reference response characteristics which are correlated with the mechanical supporting states, respectively, to estimate one of the mechanical supporting states of the housing.

Abstract: In a method of estimating one of mechanical supporting states of a housing for an electronic apparatus, a drive signal is supplied to an oscillation device from which first oscillation is applied to the housing. A sensor detects a second oscillation transferred through the housing in response to the first oscillation to generate an oscillation signal, and a measurement response characteristic is obtained based on the drive signal and the oscillation signal, and is compared with reference response characteristics which are correlated with the mechanical supporting states, respectively, to estimate one of the mechanical supporting states of the housing.

Abstract: According to one embodiment, each monitoring device acquires monitoring variables from an observation target, generates an individual multidimensional distribution of the monitoring variables, and transmits the individual multidimensional distribution to a server. The server generates sampling data using the individual multidimensional distribution received from each monitoring device, generates an overall multidimensional distribution of the monitoring variables using the sampling data, determines a statistical model of each index using the overall multidimensional distribution, generates an overall index multidimensional distribution of indexes using the statistical model and the overall multidimensional distribution, and transmits the overall index multidimensional distribution and statistical models to each monitoring device.

Abstract: A dummy junction which will break earlier than a target junction is arranged on a board. A history of load applied to the dummy junction until the dummy junction actually breaks is recorded, and an estimated lifetime of the target junction is calibrated when a lifetime of the dummy junction estimated by the history of the load is largely different from an actual lifetime of the dummy junction. The calibration is performed by subtracting a value of an unmeasurable load from the estimated lifetime of the target junction based on load ever applied to the target junction, and the unmeasurable load is calculated based on the difference of the actual lifetime and estimated lifetime of the dummy junction.

Abstract: A first module calculates a failure occurrence risk index of each data storage area address. A second module calculates a power saving index of each data storage area address. A third module calculates an access speed index per unit data volume necessary to access each data storage area address. A fourth module generates a distribution table that represents the failure occurrence risk index, the power saving index, and the access speed index for each candidate address, with respect to data to be distributed. A fifth module selects a candidate address in the distribution table such that the power saving index and the access speed index meet restricting conditions and the failure occurrence risk index is minimized, and distributes the data to the candidate address.

Abstract: A storage device includes: a printed circuit board; a semiconductor memory package mounted on the printed circuit board via solder joints, the semiconductor memory package incorporating semiconductor memories; a sensor configured to measure a physical quantity relating to a state of the storage device; a database including a damage estimation model base to be used for estimating damage of the solder joints from the physical quantity measured by the sensor; a damage estimating module configured to calculate a damage estimation value of the solder joints from the physical quantity using the damage estimation model base; and a controller configured to control writing, reading, and erasure of electronic data to or from the semiconductor memories based on the damage estimation values calculated by the damage estimating module.

Abstract: A damage index predicting system is for predicting a damage-related index of solder joints of an electronic device having the solder joints that electrically connect an electronic component to a mounting circuit board and one or more detection solder joints that are designed so as to have a shorter life than the solder joints. The system includes: a database configured to store a fracture relationship between the detection solder joints and the solder joints; a fracture detector configured to detect fracture of the detection solder joints; and a processor configured to calculate a prediction value of the damage-related index of the solder joints based on information relating to the fracture of the detection solder joints obtained by the fracture detector and the fracture relationship stored in the database.

Abstract: A device and method for providing a load calculating device is presented. In one embodiment, a load calculating device can include a variable acquiring unit configured to acquire monitoring variables. The monitoring variables can include in a detected value by a sensor monitoring a state of a circuit board and a performance characteristic obtained by a tool monitoring performance of the circuit board. The device can also store a first statistical model that is one of a regression model, an occurrence frequency distribution and a probability distribution; a second storage configured to store a second statistical model that is one of a regression model, an occurrence frequency distribution and a probability distribution. An arithmetic processor can then be used to calculate the intermediate variable from the monitoring variables according to the first statistical model and calculate the physical quantity from calculated intermediate variable according to the second statistical model.

Abstract: According to one aspect of the invention, there is provided an electronic apparatus having a circuit board supporting structure, the circuit board supporting structure including: a casing including a first body and a second body, the first body having a first boss portion, the second body having a second boss portion; a jig including a cylindrical portion having, and a flange portion formed on an outer periphery, the cylindrical portion configured to slidably receive the first boss portion and the second boss portion in an inner peripheral wall; and a circuit board disposed in the casing. The first and second boss portions are configured to be fastened by a bolt member; the circuit board has a hole and a joining region provided around the hole, the hole configured to allow the cylindrical portion to penetrate therethrough; and the joining region is configured to be soldered to the flange portion.

Abstract: An electronic equipment is provided with a housing which is assembled by combining first and second cases. The first and second cases are provided with first and second projections on inner surfaces of the first and second cases. A circuit board is located in the housing, which has a hole having a diameter larger than those of the first and second projections. The first and second projections are so engaged with each other as to be inserted in the hole. Stoppers are provided around the first and second projections so as to form gaps between first and second projections and the circuit board.

Abstract: In a method of estimating one of mechanical supporting states of a housing for an electronic apparatus, a drive signal is supplied to an oscillation device from which first oscillation is applied to the housing. A sensor detects a second oscillation transferred through the housing in response to the first oscillation to generate an oscillation signal, and a measurement response characteristic is obtained based on the drive signal and the oscillation signal, and is compared with reference response characteristics which are correlated with the mechanical supporting states, respectively, to estimate one of the mechanical supporting states of the housing.