Abstract: A VGI system is a system in which electric power is exchanged between a power grid of an electric power utility company and a BEV, and includes a plurality of BEVs, EVSE, and a management server that manages exchange of electric power. The EVSE includes specific EVSE available to a specific vehicle among BEVs, the specific vehicle being permanently permitted to use the EVSE. The management server performs processing for temporarily permitting use of the specific EVSE by a non-specific vehicle different from the specific vehicle on condition that the non-specific vehicle uses the specific EVSE to exchange electric power with the electric power utility company and performs processing for granting an incentive to a user of the non-specific vehicle or a manager of the specific EVSE on condition that the non-specific vehicle has exchanged electric power with the electric power utility company.

Abstract: Provided is a compression ratio varying mechanism, including: a discharge oil passage connected to a first hydraulic chamber; a supply oil passage connected to a hydraulic pump; a pump cylinder including a first oil storage chamber connected to the discharge oil passage and the supply oil passage and a second oil storage chamber partitioned from the first oil storage chamber by a plunger; a branch oil passage connected to the second oil storage chamber; and an orifice provided in the branch oil passage.

Abstract: A silicon single crystal manufacturing method by a Czochralski method pulls up a silicon single crystal from a silicon melt in a quartz crucible while applying a magnetic field to the silicon melt. During a pull-up process of the silicon single crystal, the surface temperature of the silicon melt is continuously measured, and crystal growth conditions are changed based on a result of frequency analysis of the surface temperature.

Abstract: Provided is a compression ratio varying mechanism, including: a discharge oil passage connected to a first hydraulic chamber; a supply oil passage connected to a hydraulic pump; a pump cylinder including a first oil storage chamber connected to the discharge oil passage and the supply oil passage and a second oil storage chamber partitioned from the first oil storage chamber by a plunger; a branch oil passage connected to the second oil storage chamber; and an orifice provided in the branch oil passage.

Abstract: A silicon single crystal manufacturing method by a Czochralski method pulls up a silicon single crystal from a silicon melt in a quartz crucible while applying a magnetic field to the silicon melt. During a pull-up process of the silicon single crystal, the surface temperature of the silicon melt is continuously measured, and crystal growth conditions are changed based on a result of frequency analysis of the surface temperature.

Abstract: An apparatus for manufacturing a silicon single crystal is provided. The apparatus comprises a chamber (11), a quarts crucible (21) provided in the chamber so as to be rotatable and movable upward and downward and store a silicon melt, a first heater (25) for melting a silicon raw material stored in the crucible, and a pulling mechanism (32) provided in the chamber so as to be rotatable and movable upward and downward. The pulling mechanism has a lower end to which a seed crystal (S) is attached. The seed crystal is to be dipped in the silicon melt in the crucible and pulled upward for growing a silicon single crystal by a Czochralski method. The apparatus further comprises a melt supplying mechanism (50) for supplying an additional silicon melt to the silicon melt in the crucible from external of the chamber.

Abstract: A heat dissipation device includes: a plurality of heat receiving members disposed on a plurality of electronic components mounted on a substrate; a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate and includes a plurality of openings formed corresponding to the heat pipes, wherein the heat pipes are inserted in the respective openings, and an inner diameter of the openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the heat pipes in the perpendicular direction to the surface of the substrate.

Abstract: A printed board includes: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole.

Abstract: An apparatus for manufacturing a silicon single crystal is provided. The apparatus comprises a chamber (11), a quarts crucible (21) provided in the chamber so as to be rotatable and movable upward and downward and store a silicon melt, a first heater (25) for melting a silicon raw material stored in the crucible, and a pulling mechanism (32) provided in the chamber so as to be rotatable and movable upward and downward. The pulling mechanism has a lower end to which a seed crystal (S) is attached. The seed crystal is to be dipped in the silicon melt in the crucible and pulled upward for growing a silicon single crystal by a Czochralski method. The apparatus further comprises a melt supplying mechanism (50) for supplying an additional silicon melt to the silicon melt in the crucible from external of the chamber.

Abstract: An electronic device includes: a frame in which a unit is mounted on each of an upper row and a lower row of the frame; a rack configured to accommodate a plurality of frames; a back plate configured to close the rack on a rear side of the frame; and a duct configured to protrude from an insertion hole formed in the back plate, and form an opening with a hole edge of the insertion hole so as to discharge air passing through the unit on the lower row, the duct separating the unit on the upper row and the unit on the lower row from each other, wherein a cross-sectional area of the opening is adjusted by adjustment of a protrusion length from the insertion hole.

Abstract: A printed board includes: a depression formed in at least one surface of a board; an open hole formed in the board so as to penetrate the board from a bottom portion of the depression; and a conductor formed over an edge of an opening portion of the open hole and an inner surface of the open hole.

Abstract: An electronic device includes: a plurality of board units, each configured to include a board and a heat generation part installed on the board, the plurality of board units configured to be arranged in an axial direction perpendicular to the board; and a radiating structure configured to thermally connect with the heat generation part, and include a plurality of duct formation portions provided in the plurality of board units, the plurality of duct formation portions being arranged in the axial direction perpendicular to the board so that an air duct extending in an axial direction perpendicular to each board is formed.

Abstract: A board unit includes a board to have an object to be cooled, the object being implemented on the board, a baffle plate to be rotatably coupled to the board and to be displaced to a first rotary position to guide a cooling air, flowing from a first direction to the board, to the object to be cooled and a second rotary position to guide a cooling air, flowing from a second direction to the board, to the object to be cooled, and an arm to be movably attached to the board and also to be rotatably coupled to a rotary end of the baffle plate to displace the baffle plate to the first rotary position and the second rotary position with movement.

Abstract: An electronic device includes: a frame in which a unit is mounted on each of an upper row and a lower row of the frame; a rack configured to accommodate a plurality of frames; a back plate configured to close the rack on a rear side of the frame; and a duct configured to protrude from an insertion hole formed in the back plate, and form an opening with a hole edge of the insertion hole so as to discharge air passing through the unit on the lower row, the duct separating the unit on the upper row and the unit on the lower row from each other, wherein a cross-sectional area of the opening is adjusted by adjustment of a protrusion length from the insertion hole.

Abstract: A heat dissipation device includes: a plurality of heat receiving members disposed on a plurality of electronic components mounted on a substrate; a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate and includes a plurality of openings formed corresponding to the heat pipes, wherein the heat pipes are inserted in the respective openings, and an inner diameter of the openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the heat pipes in the perpendicular direction to the surface of the substrate.

Abstract: A fixing-device that fixes a second member to be fastened to a first member to be fastened, the fixing-device includes, a base fixed to the first member to be fastened, a sprung-washer attached to the base and interposed between the base and the second member to be fastened, and a fastener that fastens the second member to be fastened and the base to each other, wherein the sprung-washer includes a threaded-portion insertion-hole into which a threaded-portion of the fastener is inserted, an edge-portion that is formed around the threaded-portion insertion-hole, and with which a pressing-portion provided in the fastener comes into contact and that is thereby pressed when the fastener is tightened, and a leaf-spring that extends from the edge-portion forward in a direction in which the fastener is inserted into the threaded-portion insertion-hole and outward, and that has a bent-portion midway along the length of the leaf-spring.

Abstract: An electronic device includes a first circuit board; a heat sink fixed to the first circuit board to form a cavity between the heat sink and the first circuit board; and a plurality of electronic components fixed to a surface of the heat sink facing the first circuit board inside the cavity, the plurality of electric components having heights different from each other, wherein each of the plurality of electronic components is electrically coupled to the first circuit board by a second circuit board and being different from the first circuit board.

Abstract: There is provided an electric device configured to cool a plurality of plug-in units, the electric device including a plurality of slots, each slot configured to install a plug-in unit, a first fan configured to create a current of air for cooling the plug-in units, a first plug-in unit installed into a first slot, and a second plug-in unit including a second fan configured to create a current of air for cooling the first plug-in unit, the second plug-in unit being installed into a second slot adjacent to the first slot, arranged to a side of mounting component of the first plug-in unit.

Abstract: An air guiding structure includes a shaft that is provided on a substrate body in an upright manner; a baffle plate coupled to the shaft so as to rotate around the shaft, the baffle plate guiding air that has been introduced into the substrate body; and a rotation restricting member that restricts a rotation of the baffle plate caused by the air that has been introduced.

Abstract: An apparatus on which a fan can be mounted, including a casing; a plurality of cooling fan units arranged in line on a lower portion of the casing and capable of being inserted into and removed from the casing on an individual basis; and a plurality of plate members disposed above the line in which the cooling fan units are arranged and above a gap between the cooling fan units, the plate members extending in a direction to which an upper surface of each of the cooling fan units is substantially perpendicular and in which the cooling fan unit is inserted into and removed from the casing, wherein each of the plate members is supported so as to be able to pivot about its lower end portion toward both directions.