Abstract: An inspection apparatus performing template matching of a search image capable of outputting a correct matching position even if a pattern similar to a template exists in the search image is provided.

Abstract: A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.

Abstract: A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: The present invention achieves the process of easily registering a template which is prepared for a size change in pattern matching for specifying a measurement point, and high-speed pattern matching by which adequate position accuracy can be obtained in measurement. The present invention includes means for automatically calculating the size and position of a positioning template different from a measurement point itself when the measurement point is designated, to display a template having the calculated size and position. The present invention further includes means for performing pattern matching by using all or some of a plurality of divided templates and extracting templates having a similar positional relationship to the original positional relationship.

Abstract: A matching degree computing apparatus is provided for comparing an input image and an object template image and computing a matching degree between an input image and an object template image based on the compared result. The computing apparatus includes a transforming unit for transforming the input image so as to be matched to the template object region and a computing unit for computing a matching degree between the transformed input image and the template image. The transforming unit provides a shaping unit for shaping a non-background region to the form of the template object region in the object corresponding region of the input image and a processing unit for arranging the non-background region contacting with the template object corresponding region so that the non-background region has no substantial impact on the matching degree in the object non-corresponding region of the input image.

Abstract: Information indicating the reason for a failure of template matching is provided. Difference information between a first image, which is referred to as a template, and a third image that is selected by the operator from a second image and that is larger than the template is displayed.

Abstract: Information indicating the reason for a failure of template matching is provided. Difference information between a first image, which is referred to as a template, and a third image that is selected by the operator from a second image and that is larger than the template is displayed.

Abstract: There is provided an inspection apparatus and method that output an accurate matching position even if a search image contains a pattern similar to a template. An image search unit includes a relative position comparing unit which compares the relative position of a template in a template selection image with the relative position of a location currently being searched for in a search image and outputs the amount of position mismatch between the relative positions. A matching position determining unit determines a matching position by taking into consideration the amount of position mismatch in addition to search image similarity distribution information.

Abstract: A data management equipment connected with a general inspection system for detecting a defect candidate on a wafer and acquiring a location thereof, a design data server for storing a design data for a semiconductor circuit and a defect review system for acquiring a defect data image on the basis of the location and comparing the defect candidate image with a defect-free reference image to identify a defect. The data management equipment includes a first detecting unit for finding that the general inspection system is acquiring a location, a storage controlling unit responsive to the finding to start to store the location from the general inspection system in a storage unit and a defect-circumferential design data acquiring unit for acquiring from a portion of the design data a defect-circumferential design data such that a reference image including the location can be produced from the defect-circumferential design data.

Abstract: In step 701, the scanning method is determined. In step 702, according to the scanning method determined in step 701, the frequency of an artifact appearing on an image can be determined based on the relation depicted with reference to FIG. 5. In step 703, a frequency domain for removing an artifact is determined from the vertical and horizontal widths determined by such as experimental in advance with respect to the frequency position of step 702. In steps 704 and 705, photography is performed to obtain an image. An image obtained is Fourier transformed in step 706 and the frequency domain determined in step 703 is replaced, for example, by “0.” Its image is subjected to inverse Fourier transformation in step 708, and then displayed and stored in step 709. The flow of such processing enables decreasing an artifact appearing on an image, depending on a scanning method.

Abstract: A similar image having a high correlation is selected through autocorrelation performs a template original image selected from an image photographed for a template, and a difference image between the similar image and template original image is formed. An image extracting a real difference is formed by removing noises and edges in unstable areas from the difference image. This image is added to the template original image to form a modified template. Template matching is performed by using the modified template as a template. The image extracting the real reference and added to the modified template functions to add an evaluation penalty to the similar image during matching evaluation to lower an evaluation value of the similar image so that a probability of erroneously recognizing the similar image as the image to be detected.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample, based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: A charged particle beam apparatus for obtaining information of an uneven surface or a depression/protrusion of a sample by irradiating a charged particle beam to a sample having an uneven surface or a depression/protrusion at a plurality of focal positions, measuring signal emitted from the sample, and comparing profile waveforms corresponding to edge portions of the uneven surface.

Abstract: An inspection apparatus performing template matching of a search image capable of outputting a correct matching position even if a pattern similar to a template exists in the search image is provided.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: An inspection apparatus and method are provided, wherein even when an image that cannot be processed by a current image processing algorithm is input to an image processing unit while a working line is in operation, the inspection can be continued by newly generating an image processing algorithm optimized in keeping with a particular image. The apparatus includes an erroneous recognition detector, a teacher data generator and a switching unit for switching the current image processing algorithm to a new image processing algorithm generated based on an updated teacher data group. As a result, the inspection can be continued without extremely decreasing the accuracy even when an unexpected image is input to the working line.

Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.

Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.

Abstract: The present invention relates to a method and apparatus for measuring a three-dimensional profile using a SEM, capable of accurately measuring the three-dimensional profile of even a flat surface or a nearly vertical surface based on the inclination angle dependence of the amount of secondary electron image signal detected by the SEM. Specifically, a tilt image obtaining unit obtains a tilt image (a tilt secondary electron image) I(2) of flat regions a and c1 on a pattern to be measured by using an electron beam incident on the pattern from an observation direction ?(2). Then, profile measuring units presume the slope (or surface inclination angle) at each point on the pattern based on the obtained tilt image and integrate successively each presumed slope value (or surface inclination angle value) to measure three-dimensional profiles S2a and S2c. This arrangement allows a three-dimensional profile to be accurately measured.