Abstract: An apparatus for calculating a normalized correlation coefficient used as a similarity evaluation measure by using image data values of pixels in a template image and image data values of pixels in a subimage, included in a search image, corresponding to the template image, has a memory that stores image data values of pixels in the search image and calculating means that calculate a sum of image data values of pixels in the template image and a sum of image data values of pixels in the first rectangular region in the search image or a sum of squares of image data values of pixels in the template image and a sum of squares of image data values of pixels in the first rectangular region in the search image.

Abstract: This invention is to provide a shape measuring device and a shape measuring method that can accurately measure a cross-sectional shape or a three-dimensional shape of a sample without using matching of characteristics. A shape measuring apparatus comprises a charged particle beam apparatus comprising a processor for measuring detected charged particles signal generated from the sample. The charged particle beam is irradiated to sample at first angle to generate a first signal and second angle to generate second signal. The processor selects a parameter indicating a relation between the first signal and a height of the sample or an inclination angle of the specimen until the first signal which achieves the second signal.

Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.

Abstract: A pattern matching apparatus comprising: means for storing photographed image data of a semiconductor device; means for storing CAD data of said semiconductor device; an information input means for inputting information on the white band width contained in said image data; a pattern extracting means for extracting a pattern on the semiconductor device from said image data by using the white band width information; and a matching means for matching said pattern with the CAD data.

Abstract: The present invention relates to a method and apparatus for measuring a three-dimensional profile using a SEM, capable of accurately measuring the three-dimensional profile of even a flat surface or a nearly vertical surface based on the inclination angle dependence of the amount of secondary electron image signal detected by the SEM. Specifically, a tilt image obtaining unit obtains a tilt image (a tilt secondary electron image) I(2) of flat regions a and c1 on a pattern to be measured by using an electron beam incident on the pattern from an observation direction ?(2). Then, profile measuring units presume the slope (or surface inclination angle) at each point on the pattern based on the obtained tilt image and integrate successively each presumed slope value (or surface inclination angle value) to measure three-dimensional profiles S2a and S2c. This arrangement allows a three-dimensional profile to be accurately measured.

Abstract: A foreign matter detecting system which can acquire a clear image and detect a foreign matter with high accuracy based on the acquired image regardless of whether a subject is located far or near from an image capturing device in spite of a depth variation or a level difference. An image capturing unit having an externally controllable focus position is disposed above or below a liquid surface, and a ray of light from an LED is illuminated toward the liquid surface from above or the side at least at a focus position of the image capturing unit so that a foreign matter on the liquid surface causes mirror reflection. The focus position of the image capturing unit is changed over the range from the top of a container containing a liquid to the bottom thereof. At each focus position, an input image from the image capturing unit is taken into an image input unit of an image processing section.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles [obtained at] irradiated from a surface portion of said sample [irradiated with] in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the sample [as viewed from a direction of said charged particle beam source,] based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: An apparatus for calculating a normalized correlation coefficient used as a similarity evaluation measure by using image data values of pixels in a template image and image data values of pixels in a subimage, included in a search image, corresponding to the template image, has a memory that stores image data values of pixels in the search image and calculating means that calculate a sum of image data values of pixels in the template image and a sum of image data values of pixels in the first rectangular region in the search image or a sum of squares of image data values of pixels in the template image and a sum of squares of image data values of pixels in the first rectangular region in the search image.

Abstract: This invention is to provide a shape measuring device and a shape measuring method that can accurately measure a cross-sectional shape or a three-dimensional shape of a sample without using matching of characteristics. A shape measuring apparatus comprises a charged particle beam apparatus comprising a processor for measuring detected charged particles signal generated from the sample. The charged particle beam is irradiated to sample at first angle to generate a first signal and second angle to generate second signal. The processor selects a parameter indicating a relation between the first signal and a height of the sample or an inclination angle of the specimen until the first signal which achieves the second signal.

Abstract: A display device is constituted by a display module which determines a plurality of pieces of pixels as belonging to one block unit, selects the plurality of pixels in each block unit at the same time and displays a picture image by adding one or a plurality of specific patterns each having different spatial frequencies of each block unit; a display control unit which controls the display module; a picture image signal generation unit which generates picture image signals; and a computing circuit which generates the specific patterns each having different spatial frequencies while weighting the same based on the picture image signals for every block unit. Thereby, a display device which reduces the signal clock frequency as well as increases the signal writing time, enhances the opening rate of an LC panel and permits a highly fine display and a high speed motion picture display, is obtained.

Abstract: An electron beam applied from an electron gun 1 and reflected off a surface of a specimen 7 placed on a stage 2 that is tilted at a tilt angle &phgr;=0 is detected, and a signal intensity thereof is measured by an electron detector 3. Based upon the measurement, an image processing unit 6 calculates a slope angle &thgr; of the surface of the specimen, and determines candidates for cross-sectional shape of the specimen. Signal intensity of the electromagnetic wave that would be reflected from a surface having a cross-sectional shape of each of the candidates if the tilt angle &phgr; were changed into &phgr;=&phgr;0 are estimated, and compared with a signal intensity actually measured by the electron detector 3 with the tilt angle &phgr; being changed into &phgr;=&phgr;0. Consequently, cross sectional shape and three-dimensional shape can be determined based upon a result of comparison, without utilizing a matching process of feature points.

Abstract: An electron beam applied from an electron gun 1 and reflected off a surface of a specimen 7 placed on a stage 2 that is tilted at a tilt angle &phgr;=0 is detected, and a signal intensity thereof is measured by an electron detector 3. Based upon the measurement, an image processing unit 6 calculates a slope angle &thgr; of the surface of the specimen, and determines candidates for cross-sectional shape of the specimen. Signal intensity of the electromagnetic wave that would be reflected from a surface having a cross-sectional shape of each of the candidates if the tilt angle &phgr; were changed into &phgr;=&phgr;0 are estimated, and compared with a signal intensity actually measured by the electron detector 3 with the tilt angle 100 being changed into &phgr;=&phgr;0. Consequently, cross sectional shape and three-dimensional shape can be determined based upon a result of comparison, without utilizing a matching process of feature points.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles obtained at a portion of said sample irradiated with the charged particle beam, and means for composing a two-dimensional image of the sample as viewed from a direction of said charged particle beam source, based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: An electron beam applied from an electron gun 1 and reflected off a surface of a specimen 7 placed on a stage 2 that is tilted at a tilt angle &phgr;=0 is detected, and a signal intensity thereof is measured by an electron detector 3. Based upon the measurement, an image processing unit 6 calculates a slope angle &thgr; of the surface of the specimen, and determines candidates for cross-sectional shape of the specimen. Signal intensity of the electromagnetic wave that would be reflected from a surface having a cross-sectional shape of each of the candidates if the tilt angle &phgr; were changed into &phgr;=&phgr;0 are estimated, and compared with a signal intensity actually measured by the electron detector 3 with the tilt angle 100 being changed into &phgr;=&phgr;0). Consequently, cross sectional shape and three-dimensional shape can be determined based upon a result of comparison, without utilizing a matching process of feature points.

Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles obtained at a portion of said sample irradiated with the charged particle beam, and means for composing a two-dimensional image of the sample as viewed from a direction of said charged particle beam source, based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: It is an object of the present invention to obtain an image which is focused on all portions of a sample and to provide a charged particle beam apparatus capable of obtaining a two-dimensional image which has no blurred part over an entire sample. In order to achieve the above object, the present invention comprises means for changing a focus condition of a charged particle beam emitted from a charged particle source, a charged particle detector for detecting charged particles irradiated from a surface portion of said sample in response to the emitted charged particle beam, and means for composing a two-dimensional image of the surface portion of the based on signals on which said charged particle beam is focused, said signals being among signals output from the charged particle detector.

Abstract: An operator-free and fully automated semiconductor inspection system with high throughput is realized. All conditions required for capturing and inspection are generated from design information such as CAD data. In order to perform actual inspection under the conditions, a semiconductor inspection system is composed of a navigation system for generating all the conditions required for capturing and inspection from the design information and a scanning electron microscope system for actually performing capturing and inspection. Moreover, in the case of performing a matching process between designed data and a SEM image, deformed parts are corrected by use of edge information in accordance with multiple directions and smoothing thereof. Furthermore, a SEM image corresponding to a detected position is re-registered as a template, and the matching process is thereby performed.