Patents by Inventor Mitsuo Tanaka
Mitsuo Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240150533Abstract: A method for producing a polytetrafluoroethylene particle, which includes subjecting tetrafluoroethylene to suspension polymerization in an aqueous medium to prepare a suspension-polymerized particle of polytetrafluoroethylene, washing and then crushing the suspension-polymerized particle or crushing the suspension-polymerized particle with washing to prepare a crushed particle, dehydrating the crushed particle to prepare a crushed particle having a water content of 40% by mass or less, and subjecting the dehydrated crushed particle to heat treatment to produce a polytetrafluoroethylene particle.Type: ApplicationFiled: December 29, 2023Publication date: May 9, 2024Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Takayuki TANAKA, Masayoshi Miyamoto, Tomoki Minamiyama, Takeki Kusunoki, Tokahiro Taira, Takuya Yamabe, Hirotoshi Yoshida, Taketo Kato, Taku Yamanaka, Mitsuo Tsukamoto
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Publication number: 20240150505Abstract: A method for producing a polytetrafluoroethylene powder, which includes subjecting tetrafluoroethylene to suspension polymerization in an aqueous medium to prepare a suspension-polymerized particle of non melt-processible polytetrafluoroethylene, drying the suspension-polymerized particle to prepare a dry particle, subjecting the dry particle to fluorine radical treatment to prepare a fluorine radical-treated particle, and crushing the fluorine radical-treated particle to produce a polytetrafluoroethylene powder. Also disclosed is a polytetrafluoroethylene formed article obtained by forming the polytetrafluoroethylene powder, as well as a polytetrafluoroethylene compression-molded article obtained by compression molding the polytetrafluoroethylene powder.Type: ApplicationFiled: December 27, 2023Publication date: May 9, 2024Applicant: DAIKIN INDUSTRIES, LTD.Inventors: Takahiro TAIRA, Kazuhiro Mishima, Takayuki Tanaka, Takeki Kusunoki, Masayoshi Miyamoto, Tomoki Minamiyama, Mitsuo Tsukamoto, Kenji Ichikawa, Takuya Yamabe, Hirotoshi Yoshida, Taketo Kato, Taku Yamanaka
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Patent number: 11501592Abstract: A coin transporting belt comprises a toothed belt with teeth formed on both surfaces of a belt unit, and an engagement member for engaging and transporting a coin attached to the toothed belt. The engagement member comprises: an attachment portion attached to the toothed belt; and a contact portion formed into a linear shape extending in a direction perpendicular to a long-edge direction of the toothed belt. The contact portion is to contact the coin.Type: GrantFiled: August 30, 2019Date of Patent: November 15, 2022Assignee: GLORY LTD.Inventors: Mitsuo Tanaka, Yusuke Yoshida
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Publication number: 20220270428Abstract: A cassette mounting apparatus includes an apparatus-side connector connectable to a cassette-side connector of a cassette that stores money, a cassette mounting section that enables the cassette to be mounted therein, and a connection processing section that connects the apparatus-side connector to the cassette-side connector by moving the apparatus-side connector in a direction closer to the cassette-side connector.Type: ApplicationFiled: February 11, 2022Publication date: August 25, 2022Applicant: Glory Ltd.Inventors: Hidekazu Tanaka, Mitsuo Tanaka, Ryoma Kuroki
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Publication number: 20210398380Abstract: A coin feeding device (for example, feeding unit 20) includes: a disk 22 having a plurality of protrusions 22b at a surface, the disk 22 disposed so as to be rotatable in a tilted state and configured to catch coins by the protrusions 22b to move the coins upward while rotating; a cover 21 configured to form a space for storing a coin between the cover 21 and the surface of the disk 22; a guide 26 configured to guide a peripheral edge of a coin such that a part of the coin having been caught by each protrusion 22b and moved upward protrudes from the disk 22; and a taking-out unit (for example, taking-out mechanism 28) configured to grip only one coin protruding from the disk 22, remove the coin from the disk 22, and discharge the coin to outside of the disk 22.Type: ApplicationFiled: June 17, 2021Publication date: December 23, 2021Applicant: Glory Ltd.Inventors: Hidekazu TANAKA, Mitsuo TANAKA, Kota KOBAYASHI, Shuji ONISHI
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Publication number: 20210295632Abstract: Provided is a coin handling apparatus including: a drawer attachment unit to which a drawer is attached; a first cassette attachment unit to which a coin transport cassette including an opening to be opened when the coin transport cassette is attached to a specific apparatus and giving or receiving a coin to or from the specific apparatus via the opening is attached; a storage unit storing the coin and feeding out the stored coin; and a first transport unit transporting the coin fed out of the storage unit to the drawer attached to the drawer attachment unit or the coin transport cassette attached to the first cassette attachment unit. The first cassette attachment unit is provided at a position different from a position of the drawer attachment unit. The coin transport cassette is attachable to the first cassette attachment unit when the drawer is attached to the drawer attachment unit.Type: ApplicationFiled: March 22, 2021Publication date: September 23, 2021Applicant: Glory Ltd.Inventors: Fumio KIBIHARA, Hidekazu TANAKA, Mitsuo TANAKA
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Publication number: 20200074779Abstract: A coin transporting belt comprises a toothed belt with teeth formed on both surfaces of a belt unit, and an engagement member for engaging and transporting a coin attached to the toothed belt. The engagement member comprises: an attachment portion attached to the toothed belt; and a contact portion formed into a linear shape extending in a direction perpendicular to a long-edge direction of the toothed belt. The contact portion is to contact the coin.Type: ApplicationFiled: August 30, 2019Publication date: March 5, 2020Applicant: GLORY LTD.Inventors: Mitsuo TANAKA, Yusuke YOSHIDA
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Patent number: 10256300Abstract: A semiconductor device includes: an active layer that is located in an SOI substrate, and in which an element included in a circuit is formed; a buried insulation layer that is located in the SOI substrate, and is in contact with the active layer; a deep trench isolation (DTI) region that is formed in the active layer to surround a whole formation region of the element in plan view, and extends from an upper surface to a lower surface of the active layer; and a first conductive film formed above the element. The DTI region has a first hole inside, and a film thickness of the first conductive film is greater than a thickness of the active layer.Type: GrantFiled: March 6, 2018Date of Patent: April 9, 2019Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Shinya Natsume, Masaki Inoue, Mitsuo Tanaka
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Publication number: 20180197950Abstract: A semiconductor device includes: an active layer that is located in an SOI substrate, and in which an element included in a circuit is formed; a buried insulation layer that is located in the SOI substrate, and is in contact with the active layer; a deep trench isolation (DTI) region that is formed in the active layer to surround a whole formation region of the element in plan view, and extends from an upper surface to a lower surface of the active layer; and a first conductive film formed above the element. The DTI region has a first hole inside, and a film thickness of the first conductive film is greater than a thickness of the active layer.Type: ApplicationFiled: March 6, 2018Publication date: July 12, 2018Inventors: Shinya NATSUME, Masaki INOUE, Mitsuo TANAKA
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Patent number: 9842751Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.Type: GrantFiled: October 26, 2015Date of Patent: December 12, 2017Assignee: Tokyo Electron LimitedInventors: Shouta Umezaki, Yoshihiro Kai, Kazuki Kosai, Mitsuo Tanaka
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Publication number: 20170270735Abstract: A coin handling apparatus includes: a recognition unit; an arcuate coin track; a driving unit configured to move coins along the coin track in a single layer and a single file; a plurality of active sorting units disposed in the coin track and configured to actively sort the coins based on recognition results; and at least one passive sorting unit disposed in the coin track and configured to passively sort the coins.Type: ApplicationFiled: March 16, 2016Publication date: September 21, 2017Applicant: GLORY LTD.Inventors: Eiichi NOMURA, Mitsuo TANAKA, Noriyuki MURAMOTO
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Publication number: 20160114345Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.Type: ApplicationFiled: October 26, 2015Publication date: April 28, 2016Inventors: Shouta Umezaki, Yoshihiro Kai, Kazuki Kosai, Mitsuo Tanaka
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Patent number: 8986083Abstract: A coin feeding device (70) includes: a rotary disc (72) that is inclined at a predetermined angle with respect to a vertical direction; a hopper member (74) configured to define a coin storage space (73) for storing coins between the hopper member (74) and a surface (72b) of the rotary disc (72); and a plurality of protruding members (78) disposed on the surface (72b) of the rotary disc (72). Coins in a lower area of the rotary disc (72) are transported by the respective protruding members (78) to an upper area of the rotary disc (72) along with a rotation of the rotary disc (72). A first guide member (80) is located nearer to a center of the rotary disc than the respective protruding members on the rotary disc (72), with a slight gap being defined between the first guide member and the surface (72b) of the rotary disc (72).Type: GrantFiled: July 23, 2008Date of Patent: March 24, 2015Assignee: Glory Ltd.Inventor: Mitsuo Tanaka
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Patent number: 8710621Abstract: A semiconductor device according to the present invention includes a p-type semiconductor substrate, a first n-type collector diffusion layer formed in the p-type semiconductor substrate, a deep trench formed in the p-type semiconductor substrate so as to surround the first n-type collector diffusion layer, a p-type channel stopper layer formed beneath the deep trench, and an n-type diffusion layer formed between a sidewall of the deep trench and the first n-type collector diffusion layer.Type: GrantFiled: December 21, 2012Date of Patent: April 29, 2014Assignee: Panasonic CorporationInventors: Mitsuo Tanaka, Tsuneichiro Sano, Osamu Matsui
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Patent number: 8482081Abstract: A high-performance semiconductor apparatus which can be easily introduced into the MOS process, reduces the leakage current (electric field strength) between the emitter and the base, and is insusceptible to noise or surge voltage, and a manufacturing method of the semiconductor apparatus. The emitter 111 is formed by performing the ion implantation twice by using the conductive film (109) as a mask. The second emitter area (111b) is formed by ion implantation of a low impurity density impurity ion, and the first emitter area (111a) is formed by ion implantation of a high impurity density impurity ion. As a result, the low impurity density second emitter area is formed in the circumference of the emitter 111, which lowers the electric field strength, and reduces the leakage current. Also the conductive film is connected with the emitter electrode (116), which makes the apparatus insusceptible to noise.Type: GrantFiled: November 30, 2010Date of Patent: July 9, 2013Assignee: Panasonic CorporationInventor: Mitsuo Tanaka
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Publication number: 20120107613Abstract: A corrosion-resistant article is proposed which is coated with an aluminum nitride wherein the aluminum nitride grains contain oxygen by 0.1 mass % or greater but not greater than 20 mass % so that the thermal expansion coefficient of the coating layer is made even with that of the base body; the relative density of the coating layer is preferably 50% or higher but lower than 98%. It is preferred that the coating layer is first made by chemical vapor deposition and then subjected to an oxidizing atmosphere of a temperature of 700 degrees centigrade or higher but 1150 degrees centigrade or lower; or it is preferable that after the chemical vapor deposition step the coating layer is exposed to the natural atmosphere to adsorb hydrate and then subjected to a heat treatment in an inert atmosphere of a temperature of 900 degrees centigrade but 1300 degrees centigrade or lower.Type: ApplicationFiled: September 16, 2011Publication date: May 3, 2012Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Shoji Kano, Mitsumasa Kubota, Mitsuo Tanaka, Koji Kato, Waichi Yamamura
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Publication number: 20110127615Abstract: A high-performance semiconductor apparatus which can be easily introduced into the MOS process, reduces the leakage current (electric field strength) between the emitter and the base, and is insusceptible to noise or surge voltage, and a manufacturing method of the semiconductor apparatus. The emitter 111 is formed by performing the ion implantation twice by using the conductive film (109) as a mask. The second emitter area (111b) is formed by ion implantation of a low impurity density impurity ion, and the first emitter area (111a) is formed by ion implantation of a high impurity density impurity ion. As a result, the low impurity density second emitter area is formed in the circumference of the emitter 111, which lowers the electric field strength, and reduces the leakage current. Also the conductive film is connected with the emitter electrode (116), which makes the apparatus insusceptible to noise.Type: ApplicationFiled: November 30, 2010Publication date: June 2, 2011Inventor: Mitsuo TANAKA
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Publication number: 20110130083Abstract: A coin feeding device (70) includes: a rotary disc (72) that is inclined at a predetermined angle with respect to a vertical direction; a hopper member (74) configured to define a coin storage space (73) for storing coins between the hopper member (74) and a surface (72b) of the rotary disc (72); and a plurality of protruding members (78) disposed on the surface (72b) of the rotary disc (72). Coins in a lower area of the rotary disc (72) are transported by the respective protruding members (78) to an upper area of the rotary disc (72) along with a rotation of the rotary disc (72). A first guide member (80) is located nearer to a center of the rotary disc than the respective protruding members on the rotary disc (72), with a slight gap being defined between the first guide member and the surface (72b) of the rotary disc (72).Type: ApplicationFiled: July 23, 2008Publication date: June 2, 2011Inventor: Mitsuo Tanaka
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Patent number: 7820571Abstract: A multi-layer woven or knitted fabric exhibiting reversibly changeable air permeability, which contains reversibly crimping cellulose acetate fibers exhibiting a percentage of crimp of less than 10% at a humidity of 95% or above and a percentage of crimp of 20% or above at a humidity of 45% or below and which has a basis weight of 100 to 350 g/m2. When water content of the fabric is enhanced by the absorption of water or moisture, the air permeability of the fabric increases to inhibit in-clothes stuffiness or stickiness due to sweat and in-clothes temperature rise, while when the fabric has discharged the water into the outside environment, the air permeability of the fabric decreases to the original one to prevent the body temperature from lowering excessively because of the heat of vaporization and thus keep the in-clothes environment comfortable.Type: GrantFiled: May 18, 2005Date of Patent: October 26, 2010Assignees: Mitsubishi Rayon Co., Ltd., Mitsubishi Rayon Textile Co., Ltd.Inventors: Hisashi Kuroda, Mitsuo Tanaka, Mitsuaki Shiotsuki, Teruhiro Tsuchida
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Publication number: 20080268735Abstract: A multi-layer woven or knitted fabric exhibiting reversibly changeable air permeability, which contains reversibly crimping cellulose acetate fibers exhibiting a percentage of crimp of less than 10% at a humidity of 95% or above and a percentage of crimp of 20% or above at a humidity of 45% or below and which has a basis weight of 100 to 350 g/m2. When water content of the fabric is enhanced by the absorption of water or moisture, the air permeability of the fabric increases to inhibit in-clothes stuffiness or stickiness due to sweat and in-clothes temperature rise, while when the fabric has discharged the water into the outside environment, the air permeability of the fabric decreases to the original one to prevent the body temperature from lowering excessively because of the heat of vaporization and thus keep the in-clothes environment comfortable.Type: ApplicationFiled: May 18, 2005Publication date: October 30, 2008Applicants: Mitsubishi Rayon Co., Ltd., Mitsubishi Rayon Textile Co., Ltd.Inventors: Hisashi Kuroda, Mitsuo Tanaka, Mitsuaki Shiotsuki, Teruhiro Tsuchida