Pattern formed on the ground layer of a multilayer printed circuit board

- Nitto Denko Corporation
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Description

FIG. 1 shows a front view of the design according to a first embodiment of the present invention.

FIG. 2 shows a back view of the design according to a first embodiment of the present invention.

FIG. 3 shows a top plan view of the design according to a first embodiment of the present invention.

FIG. 4 shows a bottom plan view of the design according to a first embodiment of the present invention.

FIG. 5 shows a left side view of the design according to a first embodiment of the present invention.

FIG. 6 shows a right side view of the design according to a first embodiment of the present invention.

FIG. 7 shows a partial view of FIG. 1 corresponding to the area indicated by the dashed box in FIG. 1.

FIG. 8 shows a detailed view of an enlarged portion of FIG. 7 indicated by the dashed box in FIG. 7.

FIG. 9 shows a sectional view along the line 9—9 indicated in FIG. 7.

FIG. 10 shows a front plan view of the design according to a second embodiment of the present invention. In this embodiment, the ground layer is transparent.

FIG. 11 shows a back view of the design according to a second embodiment of the present invention.

FIG. 12 shows a top plan view of the design according to a second embodiment of the present invention.

FIG. 13 shows a bottom plan view of the design according to a second embodiment of the present invention.

FIG. 14 shows a right side view of the design according to a second embodiment of the present invention.

FIG. 15 shows a left side view of the design according to a second embodiment of the present invention.

FIG. 16 shows a partial view of FIG. 11 corresponding to the area indicated by the dashed box in FIG. 11.

FIG. 17 shows a detailed view of an enlarged portion of FIG. 17 indicated by the dashed box in FIG. 17; and,

FIG. 18 shows a sectional view along the line 19—19 indicated in FIG. 17.

The broken lines represent unclaimed subject matter.

Claims

The ornamental design for a pattern formed on the ground layer of a multilayer printed circuit board, as shown and described.

Referenced Cited
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5855988 January 5, 1999 Matsuo
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D457146 May 14, 2002 Yamamoto et al.
6385035 May 7, 2002 Matoba et al.
20020075660 June 20, 2002 Samant et al.
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Patent History
Patent number: D574339
Type: Grant
Filed: Dec 22, 2005
Date of Patent: Aug 5, 2008
Assignee: Nitto Denko Corporation (Osaka)
Inventors: Mitsuru Honjo (Osaka), Hiroshi Yamazaki (Osaka), Toshiki Naito (Osaka)
Primary Examiner: Selina Sikder
Attorney: Osha Liang LLP
Application Number: 29/245,352