Abstract: A thermoplastic polyurethane for polishing layer, in which a D hardness after saturated and swollen by water of 50° C. in a sheet with a thickness of 2 mm is less than 50, and a contact angle with water in a sheet with a thickness of 200 ?m is 70° or less.

Abstract: Disclosed is a polishing pad including a polishing layer that is a molded body of a polyurethane composition, wherein the polyurethane composition contains 90 to 99.9 mass % of a thermoplastic polyurethane including a non-alicyclic diisocyanate unit as an organic diisocyanate unit, and 0.1 to 10 mass % of a hygroscopic polymer, and the molded body has a hardness of 60 or more and less than 75, as measured with a type-D durometer compliant with JIS K 7215.

Abstract: Disclosed is a polishing pad including a polishing layer that is a molded body of a polyurethane composition, wherein the polyurethane composition contains 90 to 99.9 mass % of a thermoplastic polyurethane including a non-alicyclic diisocyanate unit as an organic diisocyanate unit, and 0.1 to 10 mass % of a hygroscopic polymer, and the molded body has a hardness of 75 to 90, as measured with a type-D durometer compliant with JIS K 7215.

Abstract: A modification method of a polyurethane, including the steps of: preparing a polyurethane having an ethylenically unsaturated bond; and treating the polyurethane with a liquid containing a compound having a conjugated double bond, or a modification method of a polyurethane, including the steps of: preparing a polyurethane having a conjugated double bond; and treating the polyurethane with a liquid containing a compound having an ethylenically unsaturated bond is used.

Abstract: A modification method of a polyurethane, including the steps of: preparing a polyurethane having an ethylenically unsaturated bond; and treating the polyurethane with a liquid containing a compound having a conjugated double bond, or a modification method of a polyurethane, including the steps of: preparing a polyurethane having a conjugated double bond; and treating the polyurethane with a liquid containing a compound having an ethylenically unsaturated bond is used.

Abstract: Provided is a semiconductor device in which a leakage current is reduced, the semiconductor device which is particularly useful for power devices. A semiconductor device including at least: an n+-type semiconductor layer, which contains a crystalline oxide semiconductor as a major component; an n?-type semiconductor layer that is placed on the n+-type semiconductor layer, the n?-type semiconductor layer containing a crystalline oxide semiconductor as a major component; a high-resistance layer with at least a part thereof being embedded in the n?-type semiconductor layer, the high-resistance layer having a bottom surface located at a distance of less than 1.5 ?m from an upper surface of the n+-type semiconductor layer; and a Schottky electrode that forms a Schottky junction with the n?-type semiconductor layer, the Schottky electrode having an edge located on the high-resistance layer.

Abstract: A multilayer inductor component includes an element body, an internal conductor, and an external electrode. The internal conductor is disposed in the element body. The external electrode is disposed on a surface of the element body and electrically connected to the internal conductor. The external electrode includes a sintered metal layer and a plating layer. The sintered metal layer is disposed on the surface of the element body. The plating layer covers the sintered metal layer. The sintered metal layer includes a thick portion and thin portions. The thick portion covers the surface of the element body. A plurality of glass particles is dispersed in the thick portion. The thin portions cover glass particles exposed on a surface of the thick portion among the plurality of glass particles and being in contact with the plating layer.

Abstract: A route planning apparatus configured to create a travel plan that includes a planned travel route for a leading vehicle to electronically tow a following vehicle using inter-vehicle communication, the route planning apparatus comprising: a receiving unit configured to receive a request to stop at a waypoint during traveling by the electronic towing, the stop-over request being input on a second information processing apparatus that is used by an occupant of the following vehicle: a searching unit configured to search, for a waypoint according to the request, the planned travel route and a surrounding region of the planned travel route; and a transmitting unit configured to transmit information regarding a found waypoint and a route to the waypoint to a first information processing apparatus that is used by an occupant of the leading vehicle.

Abstract: An elevator rope monitoring device, provided with: line sensor cameras 1a, 1b for imaging the entire circumference of the traveling elevator rope 5; a speed/position detecting device 4 for detecting the traveling speed and traveling position of the elevator rope 5; an image recording part 3a for inputting the image acquired by the line sensor cameras 1a, 1b in association with the traveling position of the elevator rope 5 detected by the speed/position detecting means 4; an image creating part 3b for creating an entire circumferential image of the elevator rope 5 from the image imaged by the line sensor cameras 1a, 1b; and an image processing part 3c for detecting an abnormality in the elevator rope 5 by analyzing the entire circumferential image.

Abstract: A Schiff base-containing chain extender may be a diol having a Schiff base or a derivative thereof, as well as a polyurethane produced using the same and a modification method thereof, and a polishing layer including a polyurethane and a polishing method using the polishing layer.

Abstract: According to one embodiment, a cleaning head for cleaning a plurality of hoisting belts and/or at least one sheave of an elevator system is provided. The at least one sheave includes a plurality of grooves for receiving each of the hoisting belts. The cleaning head comprises a base plate and a plurality of wipers fixed to an upper end of the base plate to project outwards from the base plate. The cleaning head may be used to clean the plurality of hoisting belts at once and/or the plurality of grooves of the at least one sheave at once.

Abstract: During a maintenance inspection, an optical rope diameter measuring device is provided at a predetermined position along a path of a wire rope, rope diameter is measured at multiple measuring points while the elevator is driven in test mode, and diameter reduction at each measuring point is determined and stored as a first diameter reduction (S2_S6). During a subsequent maintenance inspection, rope diameter is similarly measured at each measuring point to determine diameter reduction constituting a second diameter reduction (S7_S11). Based on these two diameter reductions, the time at which diameter reduction will reach a predetermined threshold value is predicted for each measuring point, and the earliest time is displayed as a rope replacement time (S12_S14).

Abstract: A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.

Abstract: Disclosed is a polishing pad including a polishing layer having a polishing surface, wherein the polishing surface includes a deep-groove region having a first pattern formed by a deep groove or hole having a depth of 0.3 mm or more, and a land region that is a region other than the deep-groove region, and the land region includes shallow recesses having a second pattern and a depth of 0.01 to 0.1 mm, and a plurality of island-like land portions surrounded by the shallow recesses and having a maximum distance in a horizontal direction of 8 mm or less.

Abstract: Disclosed are a polyurethane for use in a polishing layer, and a polishing layer and a polishing pad using the same, the polyurethane including a terminal group represented by the following formula (I): R—(OX)n— (I) wherein R represents a monovalent hydrocarbon group having 1 to 30 carbon atoms that may be substituted with a heteroatom or may be interrupted by a heteroatom, X represents an alkylene group having 2 to 4 carbon atoms, 90 to 100% of the alkylene group being an ethylene group, and n represents a number from 8 to 120.

Abstract: Disclosed is a polyurethane for use in a polishing layer, including a carboxylic acid ester group, and a polyurethane preferably having a carboxylic acid ester group in at least one of a side chain, a main chain terminal, and a main chain skeleton is preferably used. Also disclosed is a method for modifying a polishing layer, including the steps of: preparing a polishing layer including a polyurethane having a carboxylic acid ester group; and hydrolyzing the carboxylic acid ester group of the polyurethane, to produce a carboxyl group.

Abstract: Provided is a polishing pad including a polishing surface having a zeta potential of +0.1 mV or more at a pH of 10.0. Preferably, a polishing pad including a polyurethane having a tertiary amine is provided. Further preferably, the polyurethane having a tertiary amine is a reaction product of a polyurethane reaction raw material containing at least a chain extender having a tertiary amine. A polishing method using the polishing pads is also provided, wherein the method is performed while supplying an alkaline polishing slurry.

Abstract: There is used a polyurethane for polishing layers that can be used as a material of a polishing layer of a polishing pad, the polyurethane including a thermoplastic polyurethane that is a reaction product of a polyurethane raw material including a polymer diol, an organic diisocyanate, and a chain extender, wherein the chain extender contains 50 mass % or more of a first chain extender including a straight-chain carbon backbone having 7 to 12 carbon atoms.

Abstract: A modification method of a polyurethane, including the steps of: preparing a polyurethane having an ethylenically unsaturated bond; and treating the polyurethane with a liquid containing a compound having a conjugated double bond, or a modification method of a polyurethane, including the steps of: preparing a polyurethane having a conjugated double bond; and treating the polyurethane with a liquid containing a compound having an ethylenically unsaturated bond is used.

Abstract: Disclosed herein are polyurethanes useful for polishing layers, where the polyurethane is a polyurethane having a Schiff base. Also disclosed herein are polishing layers containing the polyurethanes, polishing methods that use the polishing layers, and a modification method including a step of converting the Schiff base into at least one functional group selected from an aldehyde group, a carboxylic acid group, a hydroxyl group, and an amino group.