Abstract: A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 ?m; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

Abstract: A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 ?m; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

Abstract: A remote starter transmits vehicle position information at a time of parking start to an information processor upon the parking start of a vehicle. The information processor judges whether to transmit a request for starting of the vehicle based on the vehicle position information and mobile-terminal position information upon reception of the request for starting of the vehicle and the mobile-terminal position information from a mobile terminal.

Abstract: A vehicle controller includes a communicator communicating with an information processor located outside the vehicle by transmitting and receiving information, a controller controlling the vehicle controller based on control information transmitted from the information processor, and a position-information-obtaining-part obtaining position information of the vehicle, wherein the position-information-obtaining-part obtains position information at a time of parking start upon parking start of the vehicle, and obtains position information at a time of reception of the control information when the controller receives the control information from the information processor while being in a sleep mode, and when the position-information-obtaining-part obtains the position information at the time of reception of the control information, the communicator transmits a more accurate one of the position information at the time of parking start and the position information at the time of reception of the control information

Abstract: An in-vehicle apparatus includes an image-capturing part that is installed on a vehicle and captures an image of a periphery of the vehicle, an image generator that generates a bird's-eye image including the vehicle and the periphery of the vehicle viewed from a virtual viewpoint based on the image captured by the image-capturing part, and a transmitter that transmits the bird's-eye image to a terminal. The image generator changes the virtual viewpoint based on a change request from the terminal and generates the bird's-eye image viewed from the virtual viewpoint after changing the virtual viewpoint.

Abstract: When vehicle position information at a time of parking start is available, a remote starter transmits the vehicle position information at the time of parking start to an information processor. When the vehicle position information at the time of parking start is unavailable, the remote starter transmits the vehicle position information obtained just before the vehicle position information becomes unavailable, as the vehicle position information at the time of parking start to the information processor.

Abstract: A vehicle controller controls one or more operations of a vehicle.

Abstract: A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.

Abstract: An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.

Abstract: A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line.

Abstract: An in-vehicle apparatus includes an image-capturing part that is installed on a vehicle and captures an image of a periphery of the vehicle, an image generator that generates a bird's-eye image including the vehicle and the periphery of the vehicle viewed from a virtual viewpoint based on the image captured by the image-capturing part, and a transmitter that transmits the bird's-eye image to a terminal. The image generator changes the virtual viewpoint based on a change request from the terminal and generates the bird's-eye image viewed from the virtual viewpoint after changing the virtual viewpoint.

Abstract: An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.

Abstract: An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.

Abstract: An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor chip 102 provided on a lead frame 121, which are encapsulated with an encapsulating resin 115. Lead frames 119 are provided in both sides of the lead frame 121. A portion of the lead frame 119 is encapsulated with the encapsulating resin 115 to function as an inner lead 117. The encapsulating resin 115 is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad 107 provided in the semiconductor chip 102 is electrically connected to the inner lead 117 via the AuPd wire 111.

Abstract: An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.

Abstract: The thermally conductive body for use by being placed between a heat generating body and a heat radiating body, in which the body is molded from a thermally conductive polymer composition. The thermally conductive polymer composition contains a polymer matrix and a thermally conductive filler. At least part of the thermally conductive filler is formed in the shape of fibers and oriented in a certain direction. In the body, ends of the thermally conductive filler formed in the shape of fibers are exposed on the outer surface intersecting the direction of the orientation. Protrusions extending along the outer surface are formed thereat. In case, the body is placed between the heat generating body and the heat radiating body so that the outer surface contacts at least one of the heat generating body and the heat radiating body.

Abstract: A laminated body comprises a thermally conductive sheet, a protective sheet, an auxiliary sheet, a carrier sheet and a coating sheet. The thermally conductive sheet comprises a main sheet body and an adhesive layer. The coefficient of static friction of the main sheet body is 1.0 or lower. The adhesive layer has high adhesiveness in comparison with the main sheet body, and has an outer shape smaller than that of the main sheet body. The protective sheet is formed having an outer shape larger than that of the adhesive layer, and provided with a cutting line extending toward the adhesive layer from the peripheral portion of the protective sheet so that the protective sheet can be cut along the cutting line.

Abstract: A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.

Abstract: A heat-radiating structure is equipped with a heat-radiating sheet, a case and exothermic bodies. Heat-radiating sheet is equipped with a graphite sheet, and an electrically insulating elastic layer provided on surface thereof. The average thickness of graphite sheet is 300 ?m or less. Elastic layer is formed from an elastic composition containing a particulate heat-conducting filler. The average thickness of elastic layer is 10 to 280 ?m. The average particle diameter of the heat-conducting filler is 50% or less of the average thickness of elastic layer. In the elastic composition, the content of the heat-conducting filler is 30% by volume or more, and the content of heat-conducting filler in which the average particle diameter is 95% or more of the average thickness of elastic layer is less than 15% by volume. The free space within case is less than 20% of the volume of case.

Abstract: A heating device is provided, including an insulating ceramic base having a heating surface for heating an object. A high frequency electrode is embedded in the insulating ceramic base in the vicinity of the heating surface, and a heating body is embedded in the base in a location that is further from the heating surface than the location of the high frequency electrode. A low resistance ceramic member is provided so as to be exposed to a part of the heating surface of the insulating ceramic base and to be connected to a conductive member inside of the insulating ceramic base. A main component of the material of the low resistance ceramic member is common to that of the insulating ceramic base, and the respective thermal expansion coefficients are equivalent.