Abstract: The thermally conductive body for use by being placed between a heat generating body and a heat radiating body, in which the body is molded from a thermally conductive polymer composition. The thermally conductive polymer composition contains a polymer matrix and a thermally conductive filler. At least part of the thermally conductive filler is formed in the shape of fibers and oriented in a certain direction. In the body, ends of the thermally conductive filler formed in the shape of fibers are exposed on the outer surface intersecting the direction of the orientation. Protrusions extending along the outer surface are formed thereat. In case, the body is placed between the heat generating body and the heat radiating body so that the outer surface contacts at least one of the heat generating body and the heat radiating body.

Abstract: A heating device includes an insulating ceramic base having a heating surface for heating a heating object. A high frequency electrode is embedded in the insulating ceramic base in the vicinity of the heating surface, and a heating body is embedded in the base more apart from the heating surface than the high frequency electrode is. A low resistance ceramic member is provided so as to be exposed to a part of the heating surface of the insulating ceramic base and to be connected to a conductive member in an inside of the insulating ceramic base. A main component of the low resistance ceramic member is common to that of the insulating ceramic base, and thermal expansion coefficients of both thereof are equivalent to each other.

Abstract: An electrostatic chuck using the Johnson-Rahbek force, comprising: a dielectric material layer including a ceramics layer and a resin layer formed on the ceramics layer; and an electrode for generating an electrostatic adsorption power.

Abstract: An object of the present invention is to provide a heater having a ceramic substrate with a through hole formed therein so that the uniformity of temperature on the heating face of the substrate can be improved and the use life of the ceramic substrate can be improved upon thermal cycles. A ceramic heater comprises a substrate made of a ceramic material and having a heating face where three or more zones 3C, 3F are allocated, heating resistances corresponding to the zones, respectively, and terminals 5C electrically connected to the heating resistances, respectively. Three or more holes 4 are formed in the substrate. Distances of the terminals 5C and the wall surfaces facing the holes 4 are 8 mm or more, respectively. The heating resistance 15 intersects a straight line 16 connecting the center of the terminal and the center 4a of the hole in a plan view.

Abstract: A thermally conductive member including a thermal diffusion sheet having at least one opening with an inner periphery; and a thermally conductive elastomer piece passing through the opening of the sheet is provided. The thermally conductive elastomer piece includes at least one base portion fitting with the inner periphery of the opening of the thermal diffusion sheet and at least one projecting portion connected to the base portion and projecting out from the surface of the thermal diffusion sheet.

Abstract: A heat-radiating structure is equipped with a heat-radiating sheet, a case and exothermic bodies. Heat-radiating sheet is equipped with a graphite sheet, and an electrically insulating elastic layer provided on surface thereof. The average thickness of graphite sheet is 300 ?m or less. Elastic layer is formed from an elastic composition containing a particulate heat-conducting filler. The average thickness of elastic layer is 10 to 280 ?m. The average particle diameter of the heat-conducting filler is 50% or less of the average thickness of elastic layer. In the elastic composition, the content of the heat-conducting filler is 30% by volume or more, and the content of heat-conducting filler in which the average particle diameter is 95% or more of the average thickness of elastic layer is less than 15% by volume. The free space within case is less than 20% of the volume of case.

Abstract: A heat radiation member including a thermal diffusion sheet; and a thermally conductive polymer layer provided on at least a part of the thermal diffusion sheet. Thermal conductivity of the thermally conductive polymer layer in a thickness direction of the layer is higher than thermal conductivity of the thermally conductive polymer layer in a direction parallel to the surface of the layer. The heat radiation member is formed by joining an independently formed thermally conductive layer including a thermally conductive filler onto the thermal diffusion sheet. The thermally conductive filler are oriented in a specific direction. Alternatively, the heat radiation member is formed by placing a thermally conductive polymer composition containing a thermal conductive filler containing a thermally conductive filler onto the thermal diffusion sheet, orienting the thermally conductive filler in a specific direction, and curing the thermally conductive polymer composition while the orientation is maintained.

Abstract: An excimer laser includes: an alumina tube which has a purity of 99.9% by weight or more, a density of 3.99 g/cm3 or more, an open porosity of less than 0.3%, and a dielectric strength voltage of 15 kV/mm or more and which includes a hollow portion; an inner electrode for corona discharge which is disposed in the hollow portion of the alumina tube; and an outer electrode for corona discharge which is disposed so as to contact an outer circumferential surface of the alumina tube.

Abstract: An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor chip 102 provided on a lead frame 121, which are encapsulated with an encapsulating resin 115. Lead frames 119 are provided in both sides of the lead frame 121. A portion of the lead frame 119 is encapsulated with the encapsulating resin 115 to function as an inner lead 117. The encapsulating resin 115 is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad 107 provided in the semiconductor chip 102 is electrically connected to the inner lead 117 via the AuPd wire 111.

Abstract: An object of the present invention is to provide a heater having a ceramic substrate with a through hole formed therein so that the uniformity of temperature on the heating face of the substrate can be improved and the use life of the ceramic substrate can be improved upon thermal cycles. A ceramic heater comprises a substrate made of a ceramic material and having a heating face where three or more zones 3C, 3F are allocated, heating resistances corresponding to the zones, respectively, and terminals 5C electrically connected to the heating resistances, respectively. Three or more holes 4 are formed in the substrate. Distances of the terminals 5C and the wall surfaces facing the holes 4 are 8 mm or more, respectively. The heating resistance 15 intersects a straight line 16 connecting the center of the terminal and the center 4a of the hole in a plan view.

Abstract: A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.

Abstract: A joined structure of a metal terminal and a ceramic member has a joining layer between the terminal and the ceramic member. The joining layer has a metal adhesive layer containing at least indium metal. The invention further provides a joined structure of a metal member and a ceramic member. The metal member has a tip face and a side face. A hollow is formed in the ceramic member. A joining layer is formed between a bottom surface facing the hollow and the tip face of the member, and further formed between a side wall surface facing the hollow and the side face of the member. The joining layer has a metal adhesive layer containing at least indium metal.

Abstract: A joined structure of a metal terminal and a ceramic member has a joining layer between the terminal and the ceramic member. The joining layer has a metal adhesive layer containing at least indium metal. The invention further provides a joined structure of a metal member and a ceramic member. The metal member has a tip face and a side face. A hollow is formed in the ceramic member. A joining layer is formed between a bottom surface facing the hollow and the tip face of the member, and further formed between a side wall surface facing the hollow and the side face of the member. The joining layer has a metal adhesive layer containing at least indium metal.

Abstract: In a ceramic circuit board having a ceramic substrate and a metal circuit plate bonded to one surface of the ceramic substrate, assuming that the warpage of the ceramic circuit board is a difference in height between the center and edge of the metal circuit plate and is positive (+) when the circuit board warps so as to be concave on the side of the metal circuit plate, the warpage of the ceramic circuit board is in the range of from −0.1 mm to +0.3 mm when the ceramic circuit board is heated to 350° C., and in the range of from +0.05 mm to +0.6 mm when the temperature of the ceramic circuit board is returned to a room temperature after the ceramic circuit board is heated to 350° C. The initial warpage of the ceramic circuit board is in the range of from +0.05 mm to +0.6 mm.

Abstract: A joined structure includes a metal terminal, a ceramic member and a joining layer between the metal terminal and the ceramic member. The joining layer includes a metal adhesive layer containing at least indium metal. The invention further provides a joined structure including a metal member, a ceramic member, and a joining layer. The metal member includes a tip face and a side face. A hollow portion is formed in the ceramic member. The joining layer is formed between a bottom surface facing the hollow portion and the tip face of member, and further formed between a side wall surface facing the hollow portion and the side face of the metal member. The joining layer also includes a metal adhesive layer containing at least indium metal.

Abstract: A toner composition having a high light transmission when printed on a transparent medium, in addition to being superior in strength and durability is provided. Binder resin particles manufactured through a dispersing polymerization method are colored using at least one kind of dye and are then subjected to a process of injecting an organic finely divided powder and a charge controlling agent and to a process of externally adding a hydrophobic silica and a conductive titanium oxide, thereby making a toner composition having a gel percentage of 2 to 15%.

Abstract: In a ceramic circuit board having a ceramic substrate and a metal circuit plate bonded to one surface of the ceramic substrate, assuming that the warpage of the ceramic circuit board is a difference in height between the center and edge of the metal circuit plate and is positive (+) when the circuit board warps so as to be concave on the side of the metal circuit plate, the warpage of the ceramic circuit board is in the range of from −0.1 mm to +0.3 mm when the ceramic circuit board is heated to 350° C., and in the range of from +0.05 mm to +0.6 mm when the temperature of the ceramic circuit board is returned to a room temperature after the ceramic circuit board is heated to 350° C. The initial warpage of the ceramic circuit board is in the range of from +0.05 mm to +0.6 mm.

Abstract: There are provided a bonded member comprising different materials which are bonded together, the bonded member having air tightness at the interface between the bonded materials and also having thermal cycle properties and thermal shock properties and being able to be produced by a simple operation, and an easy-to-practice production method of the bonded member comprising different materials.

Abstract: A toner composition that permits printing of clear-cut and high image quality without developing a fog or a blur is provided.

Abstract: The object of the invention is to join a ceramic member and a metal member with a sufficiently high bonding strength and to prevent cracks in a ceramic material constituting the ceramic member. A joined structure of a metal terminal 8 and a ceramic member 1 has a joining layer 12 between the terminal 8 and the ceramic member 1. The joining layer 12 has a metal adhesive layer 6 containing at least metal indium. The invention further provides a joined structure of a metal member 8 and a ceramic member 1. The metal member has a tip face 8a and a side face 8b. A hollow 4 is formed in the ceramic member 1. A joining layer 12 is formed between a bottom surface 4a facing the hollow 4 and the tip face 8a of the member 8, and further formed between a side wall surface 4b facing the hollow 4 and the side face 8b of the member 8. The joining layer 12 has a metal adhesive layer 6 containing at least metal indium.