Abstract: A fiber optic sensing system includes a plurality of optical probes, a light source, and a light splitting unit connecting the light source to the plurality of optical probes. The light splitting unit splits a light emitted from the light source into a plurality of divided lights, the divided lights being transmitted to the plurality of optical probes.

Abstract: The present disclosure provides a support pedestal that includes a support member including a resistive layer having at least two zones, a routing layer, and a plurality of conductive vias. The resistive layer and the routing layer are disposed in different planes of the support member and are connected by the plurality of vias. The number of zones of the resistive layer is greater than or equal to a number of wires coupled to the routing layer. The routing layer may include a plurality of arm portions that extend from a central region of the routing layer. The support pedestal may further include a second resistive layer disposed along the same plane as the routing layer.

Abstract: A ceramic pedestal assembly and a method of forming a ceramic pedestal assembly is provided. The ceramic pedestal assembly includes a ceramic substrate defining an upper surface and a lower surface, at least one via extending through the ceramic substrate, an upper conductive foil layer extending across the upper surface of the ceramic substrate and a lower conductive foil layer extending across the lower surface of the ceramic substrate. Each via includes an upper via defining a cavity and a lower via defining a corresponding tapered insert. In one form, the upper via, the lower via, and the conductive foil layers define a material having a melting temperature greater than 2,000° C. and a CTE less than or equal to the ceramic substrate.

Abstract: A support pedestal is provided that includes a substrate having a top resistive layer defining a first set of zones and a bottom resistive layer defining a second set of zones. Each zone of the first and second set of zones is coupled to at least two electric terminals from among a plurality of electric terminals, and a total number of electric terminals is less than or equal to a total of the first and second set of zones.

Abstract: A method of constructing a heater includes providing a substrate, forming at least one trench into the substrate, depositing a functional material onto the substrate and into the at least one trench to form a functional element, and providing an electrical termination in contact with the functional element.

Abstract: A method of manufacturing a pedestal includes having a support plate including a substrate, an electric element embedded in the substrate, and a conductive member connected to the electric element, preparing a tubular shaft that defines a chamber, securing the tubular shaft to the support plate, the conductive member being exposed in the chamber of the tubular shaft, and applying a protective layer on the conductive member by an atomic layer deposition (ALD) process. A system for manufacturing the pedestal and a pedestal are also provided in the present disclosure.

Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract: A method of manufacturing a heater includes forming a first laminate having a first double-sided adhesive dielectric layer, a sacrificial layer, and a conductive layer. The first double sided adhesive layer is disposed between the sacrificial layer and the conductive layer. Next, a circuit pattern is created into the conductive layer, followed by covering the circuit pattern with a second double-sided adhesive dielectric layer. Thereafter, the second double-sided adhesive dielectric layer is covered with a dielectric layer to form a second laminate. Finally, the sacrificial layer is completely removed to form the heater comprising the first double-sided adhesive dielectric layer, the circuit pattern, the second double-sided adhesive layer, and the dielectric layer.

Abstract: A thermal system includes a base member, a two-phase fluid, a tuning heater, and a chuck. The base member includes at least one fluid passageway. The two-phase fluid is disposed within the fluid passageway. A pressure of the two-phase fluid is controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. The tuning heater is secured to the base member. The chuck is secured to the tuning heater opposite to the base member. The tuning heater includes a plurality of zones to fine tune a heat distribution provided by the base member to the chuck.

Abstract: A semiconductor processing apparatus includes a wafer support assembly, a temperature sensor integrated in the wafer support assembly for measuring a temperature of the wafer support assembly, and a signal transmission device that wirelessly transmits a signal relating to a temperature measurement obtained by the temperature sensor to an external control module.

Abstract: A control system for controlling an operation of a resistive heater includes a dielectric parameter determination module for determining a dielectric parameter of the resistive heater when the resistive heater is in an active mode, and a diagnostic module for diagnosing performance of the resistive heater based on the dielectric parameter.

Abstract: A thermal system includes: a base member including at least one fluid passageway in which a two-phase fluid is disposed; a tuning layer secured to the base member; and a control system. The pressure of the two-phase fluid is controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. The tuning layer includes a plurality of zones. The control system includes a plurality of sets of power lines in communication with the tuning layer, and a plurality of addressable control elements in electrical communication with the power lines and with the tuning layer. The control elements provide selective control of the tuning layer zones.

Abstract: A heater assembly includes a heating member, a mounting member that mounts the heating member to a wall of an external component, and an insulator disposed between the heating member and the wall. The insulator electrically insulates the heating member from the wall and blocks a ground path from the heating member to the wall of the external component.

Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.

Abstract: A thermographic inspection system includes a heat source configured to be removably attached to an exterior surface of an object. A thermal imaging device obtains a thermal image of the object, and an analyzing device determines a location of a defect in the object based on the thermal image.

Abstract: A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separated by corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel. A cooling fluid flows through the fluid supply channel, through the plurality of linear-parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment, that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract: A heater system is provided that includes a base functional layer having at least one functional zone. A substrate is secured to the functional member, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer provides lower power than the base functional layer. A component is secured to the tuning layer opposite the substrate, and the substrate defines a thermal conductivity to absorb and dissipate a requisite amount of power from the base functional layer. A control system is also provided that has a plurality of addressable control elements in electrical communication with power lines and with the tuning layer, the control elements providing selective control of the tuning layer zones.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.