Abstract: A thermographic inspection system includes a heat source configured to be removably attached to an exterior surface of an object. A thermal imaging device obtains a thermal image of the object, and an analyzing device determines a location of a defect in the object based on the thermal image.

Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.

Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two-phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract: A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or cermaic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials.

Abstract: A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or ceramic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials.

Abstract: A method of joining similar or dissimilar ceramic and ceramic composite materials, such as SiC continuous fiber ceramic composites, at relatively low joining temperatures uses a solventless, three component bonding agent effective to promote mechanical bond toughness and elevated temperature strength to operating temperatures of approximately 1200 degrees C. The bonding agent comprises a preceramic precursor, an aluminum bearing powder, such as aluminum alloy powder, and mixtures of aluminum metal or alloy powders with another powder, and and boron powder in selected proportions. The bonding agent is disposed as an interlayer between similar or dissimilar ceramic or cermaic composite materials to be joined and is heated in ambient air or inert atmosphere to a temperature not exceeding about 1200 degrees C. to form a strong and tough bond joint between the materials.

Abstract: A musical balloon has an electronic music-producing device contained within an inner, nearly opaque balloon. An outer balloon of any desired color and design, more light transmissive than the inner balloon, covers the inner balloon. The electronic music-producing device includes an on/off switch sensitive to light. When the balloons are deflated, the rubber material is dense enough to keep light from activating the music. However, when the balloons are inflated, the rubber material is stretched to a more translucent condition, and sufficient light permeates the balloons to activate the switch and the music.