Patents by Inventor Moon Choi

Moon Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of tuning skew between read head and write head and storage device thereof
    Patent number: 8780487
    Abstract: Tuning a skew between a read head and a write head, may include setting a center value of a track according to a track density of a storage medium; writing data having a certain pattern to at least one target track and at least two tracks adjacent to the target track, while following the center value of the track; reading the data having a certain pattern from the target track by using a plurality of off track values in an off track range based on the center value of the track; and detecting an off track value having a minimum error occurrence number among error occurrence numbers with respect to the read data having a certain pattern corresponding to each of the plurality of off tracks, as an optimum off track value of the target track.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: July 15, 2014
    Assignee: Seagate Technology LLC
    Inventors: Jun Bum Park, Moon Choi Park
  • SOLAR CELL AND MANUFACTURING METHOD THEREOF
    Publication number: 20140174516
    Abstract: A solar cell includes a crystalline photovoltaic layer, a first impurity region having a first conductivity type and a second impurity region having a second conductivity type in the photovoltaic layer, a third impurity region having the first conductivity type in the first impurity region, a fourth impurity region having the second conductivity type in the second impurity region, a first barrier layer and a second barrier layer contacting the third impurity region and the fourth impurity region, respectively, and a first electrode and a second electrode contacting the first barrier layer and the second barrier layer, respectively. The first impurity region and the second impurity region are spaced apart from each other. The third impurity region and the fourth impurity region have an impurity concentration higher than the first impurity region the second impurity region, respectively.
    Type: Application
    Filed: June 19, 2013
    Publication date: June 26, 2014
    Inventors: Young Moon CHOI, Dong Kyun KIM, Yun Gi KIM, Eun Cheol DO, Yeon Il LEE
  • HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF
    Publication number: 20140174940
    Abstract: Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
    Type: Application
    Filed: February 12, 2014
    Publication date: June 26, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun LIM, Seog Moon CHOI, Sang Hyun SHIN, Young Ki LEE, Sung Keun PARK
  • METHOD OF CONVERTING AUDIO SIGNAL TO HAPTIC SIGNAL AND APPARATUS THEREOF
    Publication number: 20140167940
    Abstract: Disclosed are a method and an apparatus of efficiently converting audio signal to haptic signal. A method of converting audio signal into haptic signal, performed in a haptic signal converting apparatus, may include obtaining perceptive characteristic information of the audio signal from the audio signal provided; obtaining perceptive characteristic information of the haptic corresponding to the obtained perceptive characteristic information of the audio signal; and converting the perceptive characteristic information of the haptic into a haptic signal. Thus, the audio signal may be converted to the haptic signal intuitively and in real time, so that the method and the apparatus may be applied to various fields such as a mobile device, a gaming terminal, a home theater, and a 4 dimensional theater system, etc.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 19, 2014
    Applicant: POSTECH ACADEMY - INDUSTRY FOUNDATION
    Inventors: Seung Moon Choi, Jae Bong Lee
  • Semiconductor package substrate
    Patent number: 8736077
    Abstract: Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: May 27, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jong Man Kim, Young Hoon Kwak, Kyu Hwan Oh, Seog Moon Choi, Tae Hoon Kim
  • Power module package and method for fabricating the same
    Patent number: 8729683
    Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: May 20, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Kwang Soo Kim, Ji Hyun Park, Young Ki Lee, Seog Moon Choi
  • PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140113392
    Abstract: Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.
    Type: Application
    Filed: December 31, 2013
    Publication date: April 24, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hyun PARK, Seog Moon CHOI, Tae Hoon KIM, Sang Hyun SHIN, Tae Hyun KIM
  • PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140113393
    Abstract: Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.
    Type: Application
    Filed: January 2, 2014
    Publication date: April 24, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ji Hyun PARK, Seog Moon CHOI, Tae Hoon KIM, Sang Hyun SHIN, Tae Hyun KIM
  • LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140103386
    Abstract: Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.
    Type: Application
    Filed: December 13, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Hyun SHIN, Seong Moon CHOI, Young Ki LEE
  • HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20140096380
    Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.
    Type: Application
    Filed: December 18, 2013
    Publication date: April 10, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chang Hyun LIM, Jung Eun KANG, Heung Soo PARK, Seog Moon CHOI, Kwang Soo KIM, Joon Seok CHAE, Sung Keun PARK
  • Heat-dissipating substrate and fabricating method thereof
    Patent number: 8686295
    Abstract: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.
    Type: Grant
    Filed: November 7, 2009
    Date of Patent: April 1, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hyun Lim, Seog Moon Choi, Sang Hyun Shin, Young Ki Lee, Sung Keun Park
  • Power module package and method for manufacturing the same
    Patent number: 8664755
    Abstract: Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: March 4, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Chang Hyun Lim, Young Ki Lee, Kwang Soo Kim, Seog Moon Choi
  • Acoustic signal detector
    Patent number: 8665669
    Abstract: Disclosed is an acoustic signal detector for detecting a target with moving in water. The acoustic signal detector may include a body having a front portion, the front portion having a cross section which becomes gradually narrow and an end formed to have a plane. The plane may be perpendicular to a moving direction of the acoustic signal detector. The acoustic signal detector may further include a plurality of sensor arrays configured to generate sound and detect sound returned by being reflected by a target. The plurality of sensor arrays may be mounted on a side surface of the front portion and on the plane.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: March 4, 2014
    Assignee: Agency for Defense Development
    Inventors: Woo-Shik Kim, Dae-Won Do, Sang-Moon Choi, Dong-Hoon Lee
  • PHENYLCARBAMATE COMPOUND AND MUSCLE RELAXANT CONTAINING THE SAME
    Publication number: 20140051753
    Abstract: A novel phenylcarbamate compound and a pharmaceutical composition containing the same are provided. More specifically, a novel phenylcarbamate compound, a composition for muscle relaxation containing the phenylcarbamate compound as an active ingredient, and a method of muscle relaxation comprising administering a therapeutically effective amount of the phenylcarbamate compound, are provided.
    Type: Application
    Filed: July 1, 2011
    Publication date: February 20, 2014
    Applicant: Bio-Pharm Solutions Co., Ltd.
    Inventor: Yong Moon Choi
  • APPARATUS AND METHOD FOR PREVENTING SENSING ERROR IN SRM
    Publication number: 20140042952
    Abstract: Disclosed herein are an apparatus and method for preventing a sensing error in a switched reluctance motor (SRM). The apparatus includes: a rectifying unit; a main controlling unit driven by power supplied from the rectifying unit, and operated in an error mode in the case in which the rotation speed of the rotor is decreased to a predetermined value or less; a voltage detecting; and an error preventing unit preventing an operation of the main controlling unit in an error mode at the time of reconnection of a power supply when it is sensed that the power has been blocked using the variation in the supplied voltage detected by the voltage detecting unit.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 13, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Joung Ho Son, Dae Sung Kim, Hyung Joon Kim, Mu Seon Woo, Hong Chul Shin, Sang Moon Choi
  • Power module using sintering die attach and manufacturing method thereof
    Patent number: 8630097
    Abstract: Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.
    Type: Grant
    Filed: January 14, 2011
    Date of Patent: January 14, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hyun Kim, Yong Hui Joo, Seog Moon Choi
  • Wallpaper with pattern
    Patent number: D699446
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: February 18, 2014
    Assignee: Paldo Co., Ltd.
    Inventor: Jae Moon Choi
  • Label with pattern
    Patent number: D706038
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: June 3, 2014
    Assignee: Paldo Co., Ltd.
    Inventor: Jae Moon Choi
  • Packaging box with pattern
    Patent number: D707121
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: June 17, 2014
    Assignee: Paldo Co., Ltd.
    Inventor: Jae Moon Choi
  • Tile
    Patent number: D707858
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: June 24, 2014
    Assignee: Paldo Co., Ltd.
    Inventor: Jae Moon Choi