Abstract: Disclosed herein is a heat dissipation device for a power conversion module. The device includes a casing, a high-heat-dissipation heat sink and a circuit board. The casing includes a heat-dissipation fin unit which has heat dissipation fins arranged at positions spaced apart from each other by predetermined intervals. The casing has a mounting space therein. The high-heat-dissipation heat sink is installed in the mounting space of the casing. The circuit board is coupled to a lower surface of the casing. Therefore, the weight and size of the heat dissipation device can be reduced. In addition, the heat sink and the casing having the heat dissipation fins dissipate heat at the same time, thus enhancing the heat dissipation efficiency. Moreover, in an optimal design, the high-heat-dissipation heat sink is located at a position corresponding to a part which generates high heat so that the heat dissipation efficiency can be maximized.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Abstract: Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

Abstract: Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

Abstract: The present invention provides an advanced oxidation system for the treatment of offensive odors and toxic substances of foundry waste, e.g., sand, and a treatment method using the same, which can effectively remove offensive odors and toxic substances produced during a sand reclamation process for reclamation of foundry waste. For this purpose, an advanced oxidation system for the treatment of offensive odors and toxic substances of foundry waste by implementing a spray device for spraying a diluted solution of hydrogen peroxide onto foundry waste; a stirring device for mixing the foundry waste with the diluted solution of hydrogen peroxide sprayed thereto; an ultraviolet irradiation device for activating the hydrogen peroxide mixed with the foundry waste to produce radicals; and a local exhaust system for collecting dust generated when the foundry waste is mixed with the hydrogen peroxide by the stirring device.

Abstract: A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.

Abstract: A solar cell may include a PN junction including a semiconductor substrate of a first conductivity and an emitter of a second conductivity, a passivation layer on an exposed surface of the semiconductor substrate, a first electrode connected to the semiconductor substrate, and a second electrode connected to the emitter. The passivation layer may be configured to apply stress to the exposed surface of the substrate such that a mobility of minority charge carriers in the semiconductor substrate is decreased in a first direction perpendicular to a boundary surface of the semiconductor substrate and the passivation layer.

Abstract: A solar cell includes a semiconductor layer including a charge carrier produced therein upon exposure to light, and a passivation layer on a side of the semiconductor layer, the passivation layer configured to apply a stress to the semiconductor layer and change a mobility of the charge carrier into a direction in the semiconductor layer.

Abstract: An apparatus and method for controlling the power supplied to a fixing unit are provided. The apparatus includes a voltage detector detecting a voltage of input power supplied to heat at least one heating lamp, a synch signal generator generating a synch signal in response to the detected voltage, a switching unit switching a supply path of the input power to be applied to the at least one heating lamp, and a controller having table information of temporal duty level values of the input power that is initially supplied, and outputting a control signal for controlling a switching operation of the switching unit using the generated synch signal and the table information, wherein the switching unit performs the switching operation corresponding to the control signal.

Abstract: According to example embodiments, a solar cell includes a photoelectric member on a passivation member. The photoelectric member is configured to convert incident light into current. The passivation member includes protection material for protecting the-photoelectric member and wavelength conversion material configured to convert light that passes through the photoelectric member into different wavelength.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

Abstract: Disclosed herein is a transformer having a heat radiation function. The transformer includes a pair of cores having an E-shape and facing and contacting each other to form central pillars and outer peripheral parts, a transforming coil part wound on the central pillars of the pair of cores and dropping voltage, and a heat radiation pipe formed to have a cylindrical shape and positioned inward from the transforming coil part to radiate heat generated from the transforming coil part, thereby well discharging heat generated from the coil.

Abstract: A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.

Abstract: Disclosed herein is a semiconductor package, including: a first heat dissipation substrate; a first lead frame that is formed on the first heat dissipation substrate by patterning; a first semiconductor device formed on the first lead frame; a second semiconductor device that is stacked on the first semiconductor device; a second lead frame that is patterned and bonded to the second semiconductor device; and a second heat dissipation substrate formed on the first lead frame.

Abstract: The present invention provides a separation system for a waste foundry sand binder using ultrasonic waves, which can minimize the number of surface treatment processes by inducing interface separation between a foundry sand and a binder, and which further optimizes the working process and reduces the recycling cost of waste foundry sand.

Abstract: A power module package includes: a substrate having a stepped portion and a non-stepped portion; a power circuit unit electrically connected to a circuit wiring provided in the stepped portion; a control circuit unit electrically connected to a circuit wiring provided in the non-stepped portion; and a molding unit molded on the substrate to seal the power circuit unit while exposing the circuit wiring of the non-stepped portion. Therefore, it is possible to improve thermal characteristics of the power module package, implement high reliability between the power circuit unit and the control circuit unit, improve design freedom of the power module package, and implement miniaturization of products.

Abstract: Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.

Abstract: Tuning a skew between a read head and a write head, may include setting a center value of a track according to a track density of a storage medium; writing data having a certain pattern to at least one target track and at least two tracks adjacent to the target track, while following the center value of the track; reading the data having a certain pattern from the target track by using a plurality of off track values in an off track range based on the center value of the track; and detecting an off track value having a minimum error occurrence number among error occurrence numbers with respect to the read data having a certain pattern corresponding to each of the plurality of off tracks, as an optimum off track value of the target track.