Abstract: Provided are methods of forming patterns of semiconductor devices, whereby patterns having various widths may be simultaneously formed, and a pattern density may be doubled by a double patterning process in a portion of the semiconductor device. A dual mask layer is formed on a substrate. A variable mask layer is formed on the dual mask layer. A first photoresist pattern having a first thickness and a first width in the first region, and a second photoresist pattern having a second thickness greater than the first thickness and a second width wider than the first width in the second region are formed on the variable mask layer. A first mask pattern and a first variable mask pattern are formed in the first region, and a second mask pattern and a second variable mask pattern are formed in the second region, by sequentially etching the variable mask layer and the dual mask layer by using, as etch masks, the first photoresist pattern and the second photoresist pattern.

Abstract: Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Abstract: Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

Abstract: The present invention provides an advanced oxidation system for the treatment of offensive odors and toxic substances of foundry waste, e.g., sand, and a treatment method using the same, which can effectively remove offensive odors and toxic substances produced during a sand reclamation process for reclamation of foundry waste. For this purpose, an advanced oxidation system for the treatment of offensive odors and toxic substances of foundry waste by implementing a spray device for spraying a diluted solution of hydrogen peroxide onto foundry waste; a stirring device for mixing the foundry waste with the diluted solution of hydrogen peroxide sprayed thereto; an ultraviolet irradiation device for activating the hydrogen peroxide mixed with the foundry waste to produce radicals; and a local exhaust system for collecting dust generated when the foundry waste is mixed with the hydrogen peroxide by the stirring device.

Abstract: A novel phenylcarbamate compound and a pharmaceutical composition containing the same are provided. More specifically, a novel phenylcarbamate compound, a composition for muscle relaxation containing the phenylcarbamate compound as an active ingredient, and a method of muscle relaxation comprising administering a therapeutically effective amount of the phenylcarbamate compound, are provided.

Abstract: Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

Abstract: Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element.

Abstract: The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.

Abstract: Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

Abstract: An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

Abstract: Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.

Abstract: Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

Abstract: The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

Abstract: According to example embodiments, a solar cell includes a first unit portion, a second unit portion, and an insulating layer. The first and second unit portions may have different bandgaps, and the insulating layer may be between the first unit portion and the second unit portion.

Abstract: According to example embodiments, a solar cell includes a plurality of unit portions. Each of the unit portions may have a stacked structure including a plurality of photoelectric members and at least one insulating layer disposed between the photoelectric members. The photoelectric members in different levels may have different energy bandgaps. The photoelectric members in a level may be connected to each other.

Abstract: A switching power source apparatus includes a converting unit to convert a voltage level of power, a first switch to switch power supplied to the converting unit, a second switch connected in series with the first switch and turned on after the first switch has been turned on, and a voltage clamp unit to clamp a level of a voltage applied across the series connection of the first switch and the second switch to a predetermined voltage or less.

Abstract: An image forming apparatus includes a converting unit to convert a voltage level of power; a first switch to switch power supplied to the converting unit; a second switch connected in series with the first switch and turned on after the first switch has been turned on; and a voltage clamp unit to clamp a level of a voltage applied across the series connection of the first switch and the second switch to a predetermined voltage or less.