Patents by Inventor Morio TAKEUCHI
Morio TAKEUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12191828Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.Type: GrantFiled: July 11, 2023Date of Patent: January 7, 2025Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Morio Takeuchi, Shigeru Tsuchida, Yukiya Yamaguchi
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Publication number: 20240421836Abstract: A radio-frequency circuit includes first and second transfer circuits. The first transfer circuit supports reception of a cellular communication system and a satellite system. The second transfer circuit supports transmission and reception of the cellular communication system. The first transfer circuit includes a first filter circuit and a first low-noise amplifier circuit. The first filter circuit is connected to a first antenna connection terminal and has a pass band including a cellular receive band and a satellite receive band. The first low-noise amplifier circuit is connected to the first filter circuit. The second transfer circuit includes a second filter circuit, a power amplifier circuit, and a second low-noise amplifier circuit. The second filter circuit is connected to a second antenna connection terminal and has a pass band including the cellular receive band and a cellular transmit band corresponding to the cellular receive band.Type: ApplicationFiled: September 3, 2024Publication date: December 19, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Morio TAKEUCHI, Hirotsugu MORI
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Publication number: 20240396575Abstract: A radio-frequency module includes a module substrate having first and second major surfaces, a transmit filter disposed at the module substrate, a duplexer that is disposed at the module substrate and that includes a transmit filter and a receive filter, an antenna switch to selectively couple the transmit filter or the duplexer, and a switch to selectively couple the transmit filter or the transmit filter. The transmit filter has a pass band that includes an uplink operating band of a first band for frequency division duplex. The transmit filter has a pass band that includes the uplink operating band of the first band. The receive filter has a pass band that includes a downlink operating band of the first band. The transmit filter and the receive filter are stacked together and positioned beside the first major surface.Type: ApplicationFiled: February 16, 2024Publication date: November 28, 2024Applicant: Murata Manufacturing Co., Ltd.Inventors: Reiji NAKAJIMA, Hiroyuki KANI, Morio TAKEUCHI
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Patent number: 12132507Abstract: A radio-frequency module includes a mounting substrate, a first power amplifier, a second power amplifier, a circuit component (IC chip), and an external connection terminal. The mounting substrate has a first main surface and a second main surface on opposite sides of the mounting substrate. The first power amplifier is mounted on the first main surface of the mounting substrate. The second power amplifier is mounted on the first main surface of the mounting substrate. The circuit component is mounted on the second main surface of the mounting substrate. The external connection terminal is disposed on the second main surface of the mounting substrate. The external connection terminal is connected to a power supply that supplies a power supply voltage to the first power amplifier and the second power amplifier.Type: GrantFiled: June 14, 2021Date of Patent: October 29, 2024Assignee: MURATA MANUFACTURING CO. , LTD.Inventors: Atsushi Horita, Yukiya Yamaguchi, Morio Takeuchi, Shigeru Tsuchida, Tomoaki Sato, Rui Tanaka
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Publication number: 20240324158Abstract: A module includes: a first substrate having a first surface and a second surface facing opposite sides; and a second substrate having a third surface and a fourth surface facing opposite sides, wherein the second substrate is disposed to overlap the first substrate with the third surface facing the first substrate, while being spaced apart from the first substrate on the second surface side of the first substrate, the first substrate and the second substrate are electrically connected, an inductor is mounted on the third surface, and at least one shield electrode is fixed to the first substrate with the shield electrode being positioned so as to cross a path of a magnetic flux, and each of the at least one shield electrode is grounded.Type: ApplicationFiled: May 23, 2024Publication date: September 26, 2024Inventors: Yoshihito OTSUBO, Morio TAKEUCHI
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Patent number: 12063028Abstract: A high-frequency module includes a mounting substrate, a first antenna switch, a second antenna switch, a filter (303), and a filter (307). The filter (303) and the filter (307) are respectively connected with an output terminal (204) and an output terminal (208). The second antenna switch is configured to be able to simultaneously execute connection between an input terminal and the output terminal (204) and connection between the input terminal and the output terminal (208). In plan view of the mounting substrate, a distance between an antenna terminal and the first antenna switch is shorter than a distance between the antenna terminal and the second antenna switch. A distance between the first antenna switch and the filter (303) is longer than a distance between the second antenna switch and the filter (303).Type: GrantFiled: December 29, 2021Date of Patent: August 13, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Morio Takeuchi
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Patent number: 12040822Abstract: A multiplexer includes first, second, and third filters with first, second, and third frequency bands different from each other, a first connection point connected to a common terminal, a second connection point connected to one end of the first filter and one end of the second filter, a first switch that switches connection and disconnection between the first and second connection points, a reactance element whose one end is connected to a signal path connecting the second connection point and the first switch, a second switch that switches connection and disconnection between the other end of the reactance element and the first connection point, and a third switch that switches connection and disconnection between one end of the third filter and the first connection point. The first and second frequency bands are adjacent to each other among the first, second, and third frequency bands.Type: GrantFiled: August 18, 2020Date of Patent: July 16, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yusuke Naniwa, Morio Takeuchi, Masakazu Tani
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Publication number: 20240234355Abstract: A module includes a die pad arranged to locate a lower end thereof on a reference plane, a signal terminal arranged to locate a lower end thereof on the reference plane, an electronic component fixed as being superimposed above the die pad, and a sealing resin arranged to seal the die pad, the signal terminal, and the electronic component from above. The electronic component is provided with a component first surface facing a side of the die pad and a component second surface facing a side opposite to the die pad. The component second surface and the signal terminal are electrically connected to each other through a first wire. The die pad includes a die pad main body on which the electronic component is carried and a surrounding portion extending from the die pad main body along the reference plane to surround the signal terminal apart from the signal terminal.Type: ApplicationFiled: March 25, 2024Publication date: July 11, 2024Inventors: Yoshihito OTSUBO, Morio TAKEUCHI
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Patent number: 11916521Abstract: A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.Type: GrantFiled: June 8, 2021Date of Patent: February 27, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Yoshito Matsumura, Morio Takeuchi, Yukiya Yamaguchi, Shigeru Tsuchida, Hidetaka Takahashi
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Patent number: 11901920Abstract: A front-end circuit includes a primary circuit and a diversity circuit, the primary circuit includes transmission paths 51 and 52 for transmitting a signal in a band A and in a band B, respectively. Transmission and reception of a signal in the band B are performed by a TDD system in the transmission path 52. The diversity circuit includes a switch, and reception paths 53 and 54 that receive a signal in the band A and in the band B, respectively. When reception signals in the band A and in the band B are simultaneously transmitted, and when a reception signal in the band A and a transmission signal in the band B are simultaneously transmitted, the switch causes the diversity antenna and each of the reception path 53 and the reception path 54 to be in a conductive state.Type: GrantFiled: May 12, 2020Date of Patent: February 13, 2024Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Atsushi Takada, Morio Takeuchi
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Publication number: 20240007144Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.Type: ApplicationFiled: September 19, 2023Publication date: January 4, 2024Inventors: Morio TAKEUCHI, Syunsuke KIDO
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Patent number: 11838003Abstract: A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.Type: GrantFiled: June 9, 2022Date of Patent: December 5, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Junpei Yasuda, Morio Takeuchi
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Publication number: 20230361733Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.Type: ApplicationFiled: July 11, 2023Publication date: November 9, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Morio TAKEUCHI, Shigeru TSUCHIDA, Yukiya YAMAGUCHI
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Patent number: 11799516Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.Type: GrantFiled: April 12, 2022Date of Patent: October 24, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Morio Takeuchi, Syunsuke Kido
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Patent number: 11791853Abstract: A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.Type: GrantFiled: July 15, 2021Date of Patent: October 17, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shigeru Tsuchida, Hiroki Shonai, Masakazu Tani, Yukiya Yamaguchi, Morio Takeuchi
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Patent number: 11736077Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.Type: GrantFiled: June 4, 2021Date of Patent: August 22, 2023Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Morio Takeuchi, Shigeru Tsuchida, Yukiya Yamaguchi
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Publication number: 20230238985Abstract: A radio-frequency circuit includes a filter circuit and a power amplifier circuit. The filter circuit includes a first pass band corresponding to a band of a cellular communication system and a second pass band corresponding to a band of a satellite communication system. The power amplifier is connected to the filter circuit. The second pass band is positioned between the first pass band and a third pass band corresponding to a band of a satellite navigation system, or the second pass band at least partially matches the first pass band.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Hirotsugu MORI, Hidenori OBIYA, Morio TAKEUCHI
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Publication number: 20230238987Abstract: A radio-frequency circuit includes a first filter having a first passband including a first band; a second filter having a second passband including the first band; a power amplifier that amplifies a radio-frequency signal in the first band; and a switch that switches between connection between the first filter and the power amplifier and a connection between the second filter and the power amplifier. Under a condition that a transmission of the radio-frequency signal in the first band is not V2X communication, the first filter is connected to the power amplifier via the switch. Under a condition that the transmission of the radio-frequency signal in the first band is the V2X communication, the second filter is connected to the power amplifier via the switch.Type: ApplicationFiled: March 31, 2023Publication date: July 27, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Hirotsugu MORI, Hidenori OBIYA, Morio TAKEUCHI
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Publication number: 20230230951Abstract: To provide a circuit module capable of suppressing a decrease in an area for mounting an electronic component on a substrate even when a wire for shielding the electronic component is connected to the substrate. A circuit module according to the present disclosure includes a substrate, a first component mounted on the substrate and including a ground terminal on an upper surface, first wires that connect the ground terminal to the substrate, and a second component mounted on the substrate, in which overlapping first wires in plan view.Type: ApplicationFiled: March 24, 2023Publication date: July 20, 2023Inventors: Yoshihito OTSUBO, Morio TAKEUCHI, Tsuyoshi TAKAKURA
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Patent number: 11496168Abstract: A radio frequency circuit includes an amplifier capable of amplifying a first radio frequency signal and a second radio frequency signal that has a frequency different from a frequency of the first radio frequency signal. Here, the amplifier uses a first power-supply voltage to amplify one of the first radio frequency signal and the second radio frequency signal and uses a second power-supply voltage to amplify both the first radio frequency signal and the second radio frequency signal together. A value of the second power-supply voltage is greater than a value of the first power-supply voltage.Type: GrantFiled: February 10, 2021Date of Patent: November 8, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Tanaka, Hirotsugu Mori, Hidenori Obiya, Morio Takeuchi