Patents by Inventor Morio TAKEUCHI

Morio TAKEUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916521
    Abstract: A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.
    Type: Grant
    Filed: June 8, 2021
    Date of Patent: February 27, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshito Matsumura, Morio Takeuchi, Yukiya Yamaguchi, Shigeru Tsuchida, Hidetaka Takahashi
  • Patent number: 11901920
    Abstract: A front-end circuit includes a primary circuit and a diversity circuit, the primary circuit includes transmission paths 51 and 52 for transmitting a signal in a band A and in a band B, respectively. Transmission and reception of a signal in the band B are performed by a TDD system in the transmission path 52. The diversity circuit includes a switch, and reception paths 53 and 54 that receive a signal in the band A and in the band B, respectively. When reception signals in the band A and in the band B are simultaneously transmitted, and when a reception signal in the band A and a transmission signal in the band B are simultaneously transmitted, the switch causes the diversity antenna and each of the reception path 53 and the reception path 54 to be in a conductive state.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: February 13, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Atsushi Takada, Morio Takeuchi
  • Publication number: 20240007144
    Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Inventors: Morio TAKEUCHI, Syunsuke KIDO
  • Patent number: 11838003
    Abstract: A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: December 5, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Junpei Yasuda, Morio Takeuchi
  • Publication number: 20230361733
    Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.
    Type: Application
    Filed: July 11, 2023
    Publication date: November 9, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Morio TAKEUCHI, Shigeru TSUCHIDA, Yukiya YAMAGUCHI
  • Patent number: 11799516
    Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: October 24, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Morio Takeuchi, Syunsuke Kido
  • Patent number: 11791853
    Abstract: A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: October 17, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shigeru Tsuchida, Hiroki Shonai, Masakazu Tani, Yukiya Yamaguchi, Morio Takeuchi
  • Patent number: 11736077
    Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: August 22, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Morio Takeuchi, Shigeru Tsuchida, Yukiya Yamaguchi
  • Publication number: 20230238985
    Abstract: A radio-frequency circuit includes a filter circuit and a power amplifier circuit. The filter circuit includes a first pass band corresponding to a band of a cellular communication system and a second pass band corresponding to a band of a satellite communication system. The power amplifier is connected to the filter circuit. The second pass band is positioned between the first pass band and a third pass band corresponding to a band of a satellite navigation system, or the second pass band at least partially matches the first pass band.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hirotsugu MORI, Hidenori OBIYA, Morio TAKEUCHI
  • Publication number: 20230238987
    Abstract: A radio-frequency circuit includes a first filter having a first passband including a first band; a second filter having a second passband including the first band; a power amplifier that amplifies a radio-frequency signal in the first band; and a switch that switches between connection between the first filter and the power amplifier and a connection between the second filter and the power amplifier. Under a condition that a transmission of the radio-frequency signal in the first band is not V2X communication, the first filter is connected to the power amplifier via the switch. Under a condition that the transmission of the radio-frequency signal in the first band is the V2X communication, the second filter is connected to the power amplifier via the switch.
    Type: Application
    Filed: March 31, 2023
    Publication date: July 27, 2023
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Hirotsugu MORI, Hidenori OBIYA, Morio TAKEUCHI
  • Publication number: 20230230951
    Abstract: To provide a circuit module capable of suppressing a decrease in an area for mounting an electronic component on a substrate even when a wire for shielding the electronic component is connected to the substrate. A circuit module according to the present disclosure includes a substrate, a first component mounted on the substrate and including a ground terminal on an upper surface, first wires that connect the ground terminal to the substrate, and a second component mounted on the substrate, in which overlapping first wires in plan view.
    Type: Application
    Filed: March 24, 2023
    Publication date: July 20, 2023
    Inventors: Yoshihito OTSUBO, Morio TAKEUCHI, Tsuyoshi TAKAKURA
  • Patent number: 11496168
    Abstract: A radio frequency circuit includes an amplifier capable of amplifying a first radio frequency signal and a second radio frequency signal that has a frequency different from a frequency of the first radio frequency signal. Here, the amplifier uses a first power-supply voltage to amplify one of the first radio frequency signal and the second radio frequency signal and uses a second power-supply voltage to amplify both the first radio frequency signal and the second radio frequency signal together. A value of the second power-supply voltage is greater than a value of the first power-supply voltage.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: November 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Tanaka, Hirotsugu Mori, Hidenori Obiya, Morio Takeuchi
  • Patent number: 11483019
    Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: October 25, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Motoji Tsuda, Yukiya Yamaguchi, Sho Matsumoto, Hiroyuki Kani, Atsushi Horita, Morio Takeuchi, Yusuke Naniwa, Jin Yokoyama
  • Publication number: 20220302893
    Abstract: A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.
    Type: Application
    Filed: June 9, 2022
    Publication date: September 22, 2022
    Inventors: Junpei YASUDA, Morio TAKEUCHI
  • Publication number: 20220239333
    Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Inventors: Morio TAKEUCHI, Syunsuke KIDO
  • Patent number: 11387803
    Abstract: A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: July 12, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Junpei Yasuda, Morio Takeuchi
  • Patent number: 11381261
    Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: July 5, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Motoji Tsuda, Yusuke Naniwa, Morio Takeuchi, Atsushi Horita, Jin Yokoyama, Sho Matsumoto, Syunsuke Kido, Yukiya Yamaguchi, Hiroyuki Kani
  • Patent number: 11368177
    Abstract: In a radio frequency module, the first inductor is disposed on the first principal surface of the mounting board and located on the first reception path through which a first reception signal of a first frequency passes, on an input side of the first low noise amplifier. The second inductor is disposed on the first principal surface of the mounting board and located on the second reception path through which a second reception signal of a second frequency lower than the first frequency passes, on an input side of the second low noise amplifier. The radio frequency component is disposed between the first inductor and the second inductor. A distance between the first inductor and the shielding layer is greater than a distance between the second inductor and the shielding layer. The first inductor overlaps the first low noise amplifier in a thickness direction of the mounting board.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: June 21, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takanori Ito, Morio Takeuchi, Yukiya Yamaguchi
  • Patent number: 11368172
    Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: June 21, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
  • Patent number: 11336312
    Abstract: A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: May 17, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Morio Takeuchi, Yukiya Yamaguchi, Yoichi Sawada