Patents by Inventor Morio TAKEUCHI
Morio TAKEUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230238985Abstract: A radio-frequency circuit includes a filter circuit and a power amplifier circuit. The filter circuit includes a first pass band corresponding to a band of a cellular communication system and a second pass band corresponding to a band of a satellite communication system. The power amplifier is connected to the filter circuit. The second pass band is positioned between the first pass band and a third pass band corresponding to a band of a satellite navigation system, or the second pass band at least partially matches the first pass band.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Hirotsugu MORI, Hidenori OBIYA, Morio TAKEUCHI
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Publication number: 20230238987Abstract: A radio-frequency circuit includes a first filter having a first passband including a first band; a second filter having a second passband including the first band; a power amplifier that amplifies a radio-frequency signal in the first band; and a switch that switches between connection between the first filter and the power amplifier and a connection between the second filter and the power amplifier. Under a condition that a transmission of the radio-frequency signal in the first band is not V2X communication, the first filter is connected to the power amplifier via the switch. Under a condition that the transmission of the radio-frequency signal in the first band is the V2X communication, the second filter is connected to the power amplifier via the switch.Type: ApplicationFiled: March 31, 2023Publication date: July 27, 2023Applicant: Murata Manufacturing Co., Ltd.Inventors: Hirotsugu MORI, Hidenori OBIYA, Morio TAKEUCHI
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Publication number: 20230230951Abstract: To provide a circuit module capable of suppressing a decrease in an area for mounting an electronic component on a substrate even when a wire for shielding the electronic component is connected to the substrate. A circuit module according to the present disclosure includes a substrate, a first component mounted on the substrate and including a ground terminal on an upper surface, first wires that connect the ground terminal to the substrate, and a second component mounted on the substrate, in which overlapping first wires in plan view.Type: ApplicationFiled: March 24, 2023Publication date: July 20, 2023Inventors: Yoshihito OTSUBO, Morio TAKEUCHI, Tsuyoshi TAKAKURA
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Patent number: 11496168Abstract: A radio frequency circuit includes an amplifier capable of amplifying a first radio frequency signal and a second radio frequency signal that has a frequency different from a frequency of the first radio frequency signal. Here, the amplifier uses a first power-supply voltage to amplify one of the first radio frequency signal and the second radio frequency signal and uses a second power-supply voltage to amplify both the first radio frequency signal and the second radio frequency signal together. A value of the second power-supply voltage is greater than a value of the first power-supply voltage.Type: GrantFiled: February 10, 2021Date of Patent: November 8, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Satoshi Tanaka, Hirotsugu Mori, Hidenori Obiya, Morio Takeuchi
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Patent number: 11483019Abstract: A radio-frequency module includes a switch performing switching of the connection between a common terminal and a selection terminal, a reception filter having a reception band in a band A as a passband, a transmission filter that has a transmission band in a band B as a passband and has an output terminal connected to the selection terminal, a filter that has the transmission band in a band B as an attenuation band and has an input terminal connected to the selection terminal, a reception path which connects the selection terminal and an input terminal of the reception filter and on which the filter is disposed, a bypass path which connects the selection terminal and the input terminal of the reception filter and on which no filter is disposed, and a transmission path which connects the selection terminal and a transmission terminal and on which the transmission filter is disposed.Type: GrantFiled: June 18, 2021Date of Patent: October 25, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Yukiya Yamaguchi, Sho Matsumoto, Hiroyuki Kani, Atsushi Horita, Morio Takeuchi, Yusuke Naniwa, Jin Yokoyama
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Publication number: 20220302893Abstract: A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.Type: ApplicationFiled: June 9, 2022Publication date: September 22, 2022Inventors: Junpei YASUDA, Morio TAKEUCHI
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Publication number: 20220239333Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.Type: ApplicationFiled: April 12, 2022Publication date: July 28, 2022Inventors: Morio TAKEUCHI, Syunsuke KIDO
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Patent number: 11387803Abstract: A composite filter device includes bandpass filters whose respective one ends are electrically connected in common. A first bandpass filter of the bandpass filters includes a first filter, a switch, a second filter, and an impedance element that is electrically connected to the switch and having an impedance value larger than the input impedance value of the second filter. The switch is configured to be switched between a first state in which the first filter and the second filter are electrically connected and a second state in which the first filter and the impedance element are electrically connected.Type: GrantFiled: August 27, 2019Date of Patent: July 12, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Junpei Yasuda, Morio Takeuchi
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Patent number: 11381261Abstract: A radio-frequency module includes a transmission path which has one end connected to a transmission terminal and on which a transmission signal in Band A is transmitted; a reception path (62) which has one end connected to a reception terminal (120B) and on which a reception signal in Band B is transmitted; a reception path (63) which has one end connected to a reception terminal (120C) and on which a reception signal in Band C is transmitted; a switch (11) having a common terminal (11a) and selection terminals (11b and 11c); and a switch (12) having a common terminal (12a) and selection terminals (12b and 12c).Type: GrantFiled: July 7, 2021Date of Patent: July 5, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Motoji Tsuda, Yusuke Naniwa, Morio Takeuchi, Atsushi Horita, Jin Yokoyama, Sho Matsumoto, Syunsuke Kido, Yukiya Yamaguchi, Hiroyuki Kani
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Patent number: 11368172Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof; a transmission power amplifier; a control circuit configured to control the transmission power amplifier; a first transmission filter and a second transmission filter; and a first switch configured to switch connection of an output terminal of the transmission power amplifier between the first transmission filter and the second transmission filter. The control circuit is disposed on the first principal surface, and the first switch is disposed on the second principal surface.Type: GrantFiled: March 11, 2021Date of Patent: June 21, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
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Patent number: 11368177Abstract: In a radio frequency module, the first inductor is disposed on the first principal surface of the mounting board and located on the first reception path through which a first reception signal of a first frequency passes, on an input side of the first low noise amplifier. The second inductor is disposed on the first principal surface of the mounting board and located on the second reception path through which a second reception signal of a second frequency lower than the first frequency passes, on an input side of the second low noise amplifier. The radio frequency component is disposed between the first inductor and the second inductor. A distance between the first inductor and the shielding layer is greater than a distance between the second inductor and the shielding layer. The first inductor overlaps the first low noise amplifier in a thickness direction of the mounting board.Type: GrantFiled: December 21, 2020Date of Patent: June 21, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takanori Ito, Morio Takeuchi, Yukiya Yamaguchi
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Patent number: 11336312Abstract: A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.Type: GrantFiled: September 16, 2020Date of Patent: May 17, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Morio Takeuchi, Yukiya Yamaguchi, Yoichi Sawada
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Patent number: 11336315Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.Type: GrantFiled: September 16, 2020Date of Patent: May 17, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
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Patent number: 11336330Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.Type: GrantFiled: May 29, 2020Date of Patent: May 17, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Morio Takeuchi, Syunsuke Kido
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Publication number: 20220123732Abstract: A high-frequency module includes a mounting substrate, a first antenna switch, a second antenna switch, a filter (303), and a filter (307). The filter (303) and the filter (307) are respectively connected with an output terminal (204) and an output terminal (208). The second antenna switch is configured to be able to simultaneously execute connection between an input terminal and the output terminal (204) and connection between the input terminal and the output terminal (208). In plan view of the mounting substrate, a distance between an antenna terminal and the first antenna switch is shorter than a distance between the antenna terminal and the second antenna switch. A distance between the first antenna switch and the filter (303) is longer than a distance between the second antenna switch and the filter (303).Type: ApplicationFiled: December 29, 2021Publication date: April 21, 2022Inventor: Morio TAKEUCHI
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Patent number: 11296730Abstract: A radio-frequency front-end circuit includes first and second radio-frequency switches and filters. The first radio-frequency switch includes a first antenna-side terminal and a plurality of first filter-side terminals selectively coupled to the first antenna-side terminal. The second radio-frequency switch includes a second antenna-side terminal and a plurality of second filter-side terminals selectively coupled to the second antenna-side terminal. Some of the filters are multiplexer filters and each includes a common terminal. The common terminals of the filters are coupled individually to some of the first filter-side terminals of the first radio-frequency switch. The second antenna-side terminal of the second radio-frequency switch is coupled to the remaining one of the first filter-side terminals of the first radio-frequency switch.Type: GrantFiled: September 23, 2020Date of Patent: April 5, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Morio Takeuchi
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Patent number: 11251817Abstract: A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a radio frequency transmission signal that has been input through a transmission input terminal; a low noise amplifier configured to amplify a radio frequency reception signal; a switch disposed on the second principal surface and connected between the transmission input terminal and the power amplifier; and an inductor of a matching circuit connected to an input terminal of the low noise amplifier. In the radio frequency module, at least one of the low noise amplifier or the inductor is disposed on the first principal surface.Type: GrantFiled: December 3, 2020Date of Patent: February 15, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Morio Takeuchi, Motoji Tsuda
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Patent number: 11239868Abstract: A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides thereof, a transmission power amplifier, a control circuit that controls the transmission power amplifier, and a first inductor connected to an output terminal of the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first inductor is disposed on the second principal surface.Type: GrantFiled: September 10, 2020Date of Patent: February 1, 2022Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Shinozaki, Yukiya Yamaguchi, Morio Takeuchi, Yoichi Sawada
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Publication number: 20220021357Abstract: A radio-frequency module includes a first power amplifier, a second power amplifier, a switch, a plurality of first filters, and a second filter. The first power amplifier amplifies a transmission signal of a first frequency band and outputs the amplified transmission signal. The second power amplifier amplifies a transmission signal of a second frequency band and outputs the amplified transmission signal. The pass bands of the plurality of first filters are contained within the first frequency band. The pass band of the second filter is contained within the second frequency band. The second power amplifier has a greater output power level than the first power amplifier. The first output terminal of the first power amplifier is switchably connectable to the plurality of first filters via the switch. The second output terminal of the second power amplifier is connected to the second filter without the switch interposed therebetween.Type: ApplicationFiled: June 4, 2021Publication date: January 20, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Morio TAKEUCHI, Shigeru TSUCHIDA, Yukiya YAMAGUCHI
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Publication number: 20220021407Abstract: A radio-frequency module includes a mounting substrate having a first main surface; a first power amplifier that is mounted on the first main surface and that amplifies a first transmission signal in a first frequency band; a second power amplifier that is mounted on the first main surface and that amplifies a second transmission signal in a second frequency band different from the first frequency band; a first output matching circuit that is mounted on the first main surface and that receives the first transmission signal amplified by the first power amplifier; and a second output matching circuit that is mounted on the first main surface and that receives the second transmission signal amplified by the second power amplifier. The first output matching circuit and the second output matching circuit are mounted along a second direction intersecting with the first direction.Type: ApplicationFiled: July 15, 2021Publication date: January 20, 2022Applicant: Murata Manufacturing Co., Ltd.Inventors: Shigeru TSUCHIDA, Hiroki SHONAI, Masakazu TANI, Yukiya YAMAGUCHI, Morio TAKEUCHI