Abstract: A radio-frequency module utilizing carrier aggregation includes a switch circuit that includes one input terminal and three or more output terminals and that simultaneously connects the input terminal and each of two or more output terminals selected from the output terminals, signal paths that propagate signals of corresponding frequency bands, band pass filters in the signal paths, and variable matching circuits in the signal paths. The circuit states of the variable matching circuits are changed in accordance with a combination of two or more signal paths simultaneously connected to the input terminal.

Abstract: A filter unit of a high-frequency module includes a plurality of SAW resonators connected in series between a first series connection terminal and a second series connection terminal, first shunt connection terminals, a second shunt connection terminal, and a plurality of SAW resonators. A connection line interconnecting the SAW resonators is connected to the first shunt connection terminal through one of the SAW resonators. The first shunt connection terminal is connected to a ground through an inductor. A matching circuit is connected between the second series connection terminal and a second external connection terminal. The matching circuit is inductively or capacitively coupled to the inductor.

Abstract: A high-frequency module includes a connection line that interconnects a first SAW resonator and a second SAW resonator, and is connected to a second shunt connection terminal through a third SAW resonator. A connection line interconnecting a fourth SAW resonator and a second series connection terminal is connected to the second shunt connection terminal through a fifth SAW resonator. The second shunt connection terminal is connected to a ground through an inductor. A matching circuit is connected between a first series connection terminal and a first external connection terminal. The matching circuit is inductively or capacitively coupled to the inductor.

Abstract: A high frequency module includes a first external connection terminal, a second external connection terminal, a filter unit, a first matching circuit, and a second matching circuit. The filter unit is connected between the first external connection terminal and the second external connection terminal. The first matching circuit is connected between the first external connection terminal and the filter unit. The second matching circuit is connected between the second external connection terminal and the filter unit. The first matching circuit and the second matching circuit are inductively or capacitively coupled to each other.

Abstract: A switch circuit includes first and second switches. The first switch includes a first common terminal and at least two first selection terminals selectively connected to the first common terminal. The second switch includes at least one second common terminal and at least one second selection terminal selectively connected to the at least one second common terminal. One of the at least two first selection terminals and the at least one second common terminal are connected to each other via a path passing through a first multiplexer. Another one of the at least two first selection terminals and the at least one second common terminal are connected to each other via a bypass path bypassing the first multiplexer.

Abstract: A radio-frequency front-end circuit includes a first filter that has a first pass band and is connected to an antenna common terminal, a second filter that has a second pass band and is connected to the antenna common terminal, a switch that includes a common terminal and selection terminals, the common terminal being connected to the first filter, and a third filter that is connected to one of the selection terminals and is disposed between the switch and an input/output terminal. A reflection coefficient of the first filter alone in the second pass band viewed from the antenna common terminal is larger than a reflection coefficient of the third filter alone in the second pass band viewed from the antenna common terminal.

Abstract: A multiplexer includes a n number (n is an integer equal to three or more) of filters that are individually provided in the n number of paths commonly connected at a common junction point, and that have different pass bands from one another. In the multiplexer, (n?1) filters among the n number of filters except for the first filter have impedances of which imaginary components cancel each other at a pass band frequency of the first filter when viewed from the common junction point in a state of the n number of paths being not commonly connected.

Abstract: In a band pass filter, a first elastic wave resonator includes a first base board type and a first electrode configuration significantly improved or optimal for frequency characteristics of the first elastic wave resonator, and a second elastic wave resonator includes a second base board type and a second electrode configuration significantly improved or optimal for frequency characteristics of the second elastic wave resonator. A first attenuation pole provided by the first elastic wave resonator and a second attenuation pole provided by the second elastic wave resonator is steeper than if the first elastic wave resonator and the second elastic wave resonator that have different frequency characteristics include electrodes having the same configuration on the same types of base boards.

Abstract: A high-frequency module includes a filter unit and first and second external connection terminals. The filter unit includes first and second terminals and a plurality of SAW resonators. The plurality of SAW resonators are connected to one another by connection conductors. A matching element is connected between the first terminal and the first external connection terminal, and a matching element is connected between the second terminal and the second external connection terminal. At least one of the matching elements is inductively coupled or capacitively coupled to at least one of the connection conductors located at a position such that at least one of the SAW resonators is interposed between the matching element and the connection conductor.

Abstract: A filter unit of a high-frequency module includes SAW resonators connected in series with first and second series connection terminals therebetween, first and second shunt connection terminals, and additional SAW resonators. One end of one SAW resonator is connected to a connection node of other SAW resonators via a connection conductor, and the other end of the one SAW resonator is connected to the first shunt connection terminal via a connection conductor. The first shunt connection terminal is connected to ground via an inductor. A matching element is connected between the second series connection terminal and the second external connection terminal. The matching element is inductively coupled or capacitively coupled to the connection conductor.

Abstract: In a high frequency module, in addition to a main transmission path in which a high-frequency signal propagates in first filter elements, a sub transmission path is defined by inductive coupling or capacitive coupling between a first inductor and a matching element or by inductive coupling between the first inductor and a second inductor. The sub transmission path has different amplitude characteristics and phase characteristics from those of the main transmission path depending on a degree of the inductive coupling or capacitive coupling, and transmission characteristics as a high-frequency module are adjustable by adjusting the amplitude characteristics and the phase characteristics of the sub transmission path.

Abstract: A high frequency module includes a first external connection terminal, a second external connection terminal, a filter unit, a first matching circuit, and a second matching circuit. The filter unit is connected between the first external connection terminal and the second external connection terminal. The first matching circuit is connected between the first external connection terminal and the filter unit. The second matching circuit is connected between the second external connection terminal and the filter unit. The first matching circuit and the second matching circuit are inductively or capacitively coupled to each other.

Abstract: A filter unit of a high-frequency module includes a plurality of SAW resonators connected in series between a first series connection terminal and a second series connection terminal, first shunt connection terminals, a second shunt connection terminal, and a plurality of SAW resonators. A connection line interconnecting the SAW resonators is connected to the first shunt connection terminal through one of the SAW resonators. The first shunt connection terminal is connected to a ground through an inductor. A matching circuit is connected between the second series connection terminal and a second external connection terminal. The matching circuit is inductively or capacitively coupled to the inductor.

Abstract: A high-frequency module includes a connection line that interconnects a first SAW resonator and a second SAW resonator, and is connected to a second shunt connection terminal through a third SAW resonator. A connection line interconnecting a fourth SAW resonator and a second series connection terminal is connected to the second shunt connection terminal through a fifth SAW resonator. The second shunt connection terminal is connected to a ground through an inductor. A matching circuit is connected between a first series connection terminal and a first external connection terminal. The matching circuit is inductively or capacitively coupled to the inductor.

Abstract: A high-frequency module includes a filter unit and first and second external connection terminals. The filter unit includes first and second terminals and a plurality of SAW resonators. The plurality of SAW resonators are connected to one another by connection conductors. A matching element is connected between the first terminal and the first external connection terminal, and a matching element is connected between the second terminal and the second external connection terminal. At least one of the matching elements is inductively coupled or capacitively coupled to at least one of the connection conductors located at a position such that at least one of the SAW resonators is interposed between the matching element and the connection conductor.

Abstract: A filter unit of a high-frequency module includes SAW resonators connected in series with first and second series connection terminals therebetween, first and second shunt connection terminals, and additional SAW resonators. One end of one SAW resonator is connected to a connection node of other SAW resonators via a connection conductor, and the other end of the one SAW resonator is connected to the first shunt connection terminal via a connection conductor. The first shunt connection terminal is connected to ground via an inductor. A matching element is connected between the second series connection terminal and the second external connection terminal. The matching element is inductively coupled or capacitively coupled to the connection conductor.

Abstract: A branching circuit includes a transmission filter and a reception filter. The transmission filter is connected between a transmission signal input terminal and an antenna connection terminal. The reception filter is connected between the antenna connection terminal and a reception signal output terminal in series together with a first phase shift circuit and a second phase shift circuit. A first amplitude adjustment circuit and a second amplitude adjustment circuit are connected in series between the antenna connection terminal and the reception signal output terminal. A junction point between the first amplitude adjustment circuit and the second amplitude adjustment circuit is connected to a junction point between the first phase shift circuit and the second phase shift circuit. The first and second phase shift circuits adjust the phase of a transmission signal that leaks to the reception side and that is to be canceled out.

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract: A branching circuit includes a transmission filter and a reception filter. The transmission filter is connected between a transmission signal input terminal and an antenna connection terminal. The reception filter is connected between the antenna connection terminal and a reception signal output terminal in series together with a first phase shift circuit and a second phase shift circuit. A first amplitude adjustment circuit and a second amplitude adjustment circuit are connected in series between the antenna connection terminal and the reception signal output terminal. A junction point between the first amplitude adjustment circuit and the second amplitude adjustment circuit is connected to a junction point between the first phase shift circuit and the second phase shift circuit. The first and second phase shift circuits adjust the phase of a transmission signal that leaks to the reception side and that is to be canceled out.

Abstract: A circuit substrate on which a duplexer is mounted includes a substrate body. First, second and third external electrodes are provided on a first main surface of the substrate body. Fourth, fifth and sixth external electrodes are provided on a second main surface of the substrate body. First, second and third signal paths connect the first, second and third external electrodes to the fourth, fifth and sixth external electrodes, respectively. First and second ground conductors are embedded in the substrate body, and overlap with a mounting area so as to contain the mounting area where the duplexer is mounted, in a planar view seen from the z-axis direction. The first, second and third signal paths extend from the inside of the mounting area to the outside of the mounting area between the first main surface and the second ground conductor.