Abstract: A piezoelectric device including a pressure chamber, a piezoelectric element, and a vibration plate, in which the piezoelectric element is provided with a first electrode, a second electrode, and a piezoelectric layer, the vibration plate has a first portion overlapping the piezoelectric element and a second portion having a thickness smaller than that of the first portion and overlapping an inner peripheral surface of a side wall of the pressure chamber, a side surface of the piezoelectric element which intersects the vibration plate has a first surface inclined at a first angle, the vibration plate has a second surface, between the first portion and the second portion, inclined at a second angle smaller than the first angle, and an end portion of the second surface on the side wall side of the pressure chamber overlaps the side wall of the pressure chamber.

Abstract: A piezoelectric element includes a plurality of individual electrodes, a piezoelectric layer formed on each of individual electrodes, and a common electrode which is formed on the piezoelectric layer and is an electrode common to the individual electrodes. Further, a protection film covering a region, which is not covered by the common electrode on the individual electrode, is provided.

Abstract: A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

Abstract: A liquid ejection head includes a substrate in which a pressure generating chamber that communicates with a nozzle opening is formed; and a piezoelectric element having a piezoelectric layer, a first electrode that is formed on a surface of the piezoelectric layer on a side of the substrate so as to correspond to the pressure generating chamber, and a second electrode that is formed on a surface of the piezoelectric layer opposite to the side on which the first electrode is formed so as to extend over a plurality of the pressure generating chambers, wherein the second electrode is formed to extend to an outside of the pressure generating chamber in a longitudinal direction of the pressure generating chamber.

Abstract: An inkjet head includes: a pressure chamber-forming plate in which a plurality of pressure chambers each communicating with a nozzle are formed; a vibration plate that defines one surface of each pressure chamber and allows for deformation of a defining region thereof; a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in a region corresponding to the pressure chamber in an order from a surface of the vibration plate, which is opposite to the pressure chamber; and a circuit board that is arranged at an interval from the vibration plate, with a plurality of bump electrodes interposed therebetween, and outputs a signal for driving the piezoelectric element, wherein the first electrode layer is formed independently for each piezoelectric element, the second electrode layer is formed continuously across the plurality of piezoelectric elements, and at least part of the bump electrodes is electrically connected with the first electrode layer and t

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a common electrodes common to the plurality of the piezoelectric elements. The actuator substrate includes a plurality of first common wirings connected to each of the common electrodes of the plurality of the piezoelectric element rows. The wiring substrate includes a plurality of second common wirings connected to each of the first common wirings of the plurality of piezoelectric element rows, and a plurality of auxiliary wirings buried in a groove portion formed in the wiring substrate. The auxiliary wirings are connected to each of the second common wirings, and the plurality of auxiliary wirings are not connected to each other.

Abstract: A piezoelectric device includes a substrate that includes a piezoelectric element formed by stacking a piezoelectric layer, a first electrode and a second electrode such that the piezoelectric layer is interposed between the first electrode and the second electrode; and a wiring substrate that includes a driving element providing a signal for driving the piezoelectric element to the substrate. The substrate has an inspection region where a piezoelectric element for inspection which is a portion of the piezoelectric element is disposed. The wiring substrate has an electrode inspection region including an electrode to be inspected that is electrically connected to the piezoelectric element for inspection and is disposed on a surface side opposite to the substrate, and a flexible substrate mounting region which is disposed on the surface side opposite to the substrate, and is connected to a flexible substrate.

Abstract: A manufacturing method of a head which includes a channel formation substrate having two piezoelectric actuator rows formed thereon, a driving circuit, and a driving circuit board which is provided with a first bump and a second bump. In the method, a piezo element is formed and the first bump is formed on the outside of the piezoelectric actuator row, on the driving circuit board, an adhesive layer is provided on both sides of the first bump and the second bump, a first through hole and a second through hole are formed on the driving circuit board, a first connection wiring and a second connection wiring which are connected to the driving circuit are formed, and a first electrode of the piezoelectric actuator is electrically connected to the first connection wiring via the first bump and a second electrode is electrically connected to the second connection wiring via the second bump.

Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: There is provided a method of manufacturing a liquid ejecting head that includes a communication substrate on which a pressure chamber substrate in which a pressure chamber communicating with a nozzle is formed is stacked. The communication substrate has a concave portion that forms a common liquid chamber that communicates with a plurality of the pressure chambers, a first hole portion constituting a nozzle-side communication flow channel, a second hole portion constituting a supply-side communication flow channel, and a third hole portion constituting an opening portion communicating with the common liquid chamber. The method includes forming a mask layer for forming the concave portion and the first to third hole portions that communicate with the concave portion, forming a preliminary hole in each of the first to the third hole portions, anisotropically etching the concave portion and the first to third hole portions, and removing the mask layer.

Abstract: A flow path forming substrate has a pressure generation chamber communicating with a nozzle opening; and a communication plate having a supply path communicating with a manifold common to and communicating with the pressure generation chamber. A recess of the manifold opens opposite to the flow path forming substrate. The recess has a first recess, and a second recess deeper than the first recess. Supply paths are open on a bottom surface of the first recess, and are arranged in a first direction between the first and second recesses. An inclined surface inclined toward the bottom surface of the second recess from the bottom surface of the first recess is provided along the first direction. The inclined surface is configured as alternately repeated first and second inclined surfaces with different angles. A pitch of adjacent second inclined surfaces is smaller than a pitch of adjacent supply paths.

Abstract: A liquid ejecting apparatus is provided with an actuator substrate on which a piezoelectric actuator that generates a pressure change in a pressure generation chamber, which is in communication with a nozzle opening that ejects a liquid, is provided. The liquid ejecting head is provided with lead-out wiring that is led out from the piezoelectric actuator to the top of the actuator substrate, the lead-out wiring is provided with an adhesive layer that is provided on an actuator substrate side, and a conductive layer that is provided on a side of the adhesive layer which is opposite the actuator substrate, and the adhesive layer has a width that is narrower than the conductive layer in at least a parallel arrangement direction of the lead-out wiring.

Abstract: A liquid ejecting apparatus may include a flow path forming substrate in which a pressure generation chamber which communicates with a nozzle opening that discharges liquid is formed and a communication plate which has a supply path that communicates with a manifold. A recess portion which configures at least a part of the manifold is open on a side opposite to the flow path forming substrate, on the communication plate. The supply path includes a discharge supply path which communicates with a discharge pressure generation chamber that discharges liquid from the nozzle opening, and a dummy supply path which communicates with a dummy pressure generation chamber that does not discharge liquid from the nozzle opening.

Abstract: An empty chamber component includes a pressure chamber formation substrate where a pressure chamber as an empty chamber is defined and a communication substrate bonded to the pressure chamber formation substrate. A piezoelectric element is provided on one side of the pressure chamber formation substrate. A flexible surface is located between the piezoelectric element and the pressure chamber. Empty portions are defined by the communication substrate closing recessed portions in the pressure chamber formation substrate. The empty portions are formed at positions where ends of the active section of the piezoelectric element pass through the empty portions in plan view.

Abstract: A MEMS device includes a first substrate provided with a plurality of first electrode terminals and a second substrate composed of a crystalline substrate and provided with a plurality of second electrode terminals respectively corresponding to the first electrode terminals. The first electrode terminals and the second electrode terminals are electrically bonded one-to-one. Protrusions are formed at positions corresponding to the first electrode terminals on a mounting face of the second substrate opposing the first substrate. The second electrode terminals include the protrusions and conductive material covering the protrusions.

Abstract: Provided are a vibrating plate, a first electrode provided over the vibrating plate, a piezoelectric layer provided over the first electrode, and a second electrode provided over the piezoelectric layer are provided. The piezoelectric layer is interposed between the first electrode and the second electrode. The piezoelectric layer includes an active portion of which at least one end portion is defined by the first electrode, and a non-active portion provided on an outside of the end portion of the first electrode for defining the active portion. The vibrating plate includes a first vibration portion under the non-active portion and a second vibration portion on an outside of the first vibration portion. The second vibration portion includes a taper part having the thickness which is increased toward the first vibration portion.

Abstract: A MEMS device includes a first substrate; a second substrate that is disposed laminated on the first substrate; and a functional element that is disposed between the first substrate and the second substrate, in which the second substrate is smaller than the first substrate, and in planar view, an end portion of the second substrate is disposed inside an end portion of the first substrate.

Abstract: A piezoelectric device includes a substrate that includes a piezoelectric element formed by stacking a piezoelectric layer, a first electrode and a second electrode such that the piezoelectric layer is interposed between the first electrode and the second electrode; and a wiring substrate that includes a driving element providing a signal for driving the piezoelectric element to the substrate. The substrate has an inspection region where a piezoelectric element for inspection which is a portion of the piezoelectric element is disposed. The wiring substrate has an electrode inspection region including an electrode to be inspected that is electrically connected to the piezoelectric element for inspection and is disposed on a surface side opposite to the substrate, and a flexible substrate mounting region which is disposed on the surface side opposite to the substrate, and is connected to a flexible substrate.

Abstract: A wiring substrate is provided with a surface wiring on at least one surface, a through hole which passes through the wiring substrate, and a through wiring which is formed in the through hole and is connected to a surface wiring, in which an inner surface of the through hole is a rough surface, and electric resistance of the through wiring is equal to or less than the electric resistance of the surface wiring.

Abstract: A piezoelectric device includes an actuator substrate that includes a plurality of piezoelectric element rows having a plurality of piezoelectric elements, and a wiring substrate that is disposed so as to face the actuator substrate. The piezoelectric element rows include a plurality of individual electrodes disposed for each of the piezoelectric elements, and a common electrodes common to the plurality of piezoelectric elements. The wiring substrate includes a core portion disposed on a surface on the actuator substrate side, an individual wiring portion that partially covers the core portion, a common wiring portion that partially covers the core portion, and an auxiliary wiring disposed in a groove portion disposed on a first principal surface on the side opposite to the actuator substrate or on a second principal surface on the actuator substrate side. The auxiliary wiring is electrically connected to the common wiring portion.